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BR8500354A - ELECTRONIC CIRCUIT DEVICE - Google Patents

ELECTRONIC CIRCUIT DEVICE

Info

Publication number
BR8500354A
BR8500354A BR8500354A BR8500354A BR8500354A BR 8500354 A BR8500354 A BR 8500354A BR 8500354 A BR8500354 A BR 8500354A BR 8500354 A BR8500354 A BR 8500354A BR 8500354 A BR8500354 A BR 8500354A
Authority
BR
Brazil
Prior art keywords
electronic circuit
circuit device
electronic
circuit
Prior art date
Application number
BR8500354A
Other languages
Portuguese (pt)
Inventor
Haruhiko Yamamoto
Masaaki Sakai
Yoshiaki Udagawa
Kouji Natsuyama
Mitsuhiko Nakata
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of BR8500354A publication Critical patent/BR8500354A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H10W40/772—
    • H10W40/776—
    • H10W72/5363—
    • H10W74/15—
    • H10W90/754—

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
BR8500354A 1984-01-26 1985-01-25 ELECTRONIC CIRCUIT DEVICE BR8500354A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59013004A JPS60160149A (en) 1984-01-26 1984-01-26 Cooling system for integrated circuit device

Publications (1)

Publication Number Publication Date
BR8500354A true BR8500354A (en) 1985-09-10

Family

ID=11821027

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8500354A BR8500354A (en) 1984-01-26 1985-01-25 ELECTRONIC CIRCUIT DEVICE

Country Status (9)

Country Link
US (1) US4729060A (en)
EP (1) EP0151068B1 (en)
JP (1) JPS60160149A (en)
KR (1) KR900002213B1 (en)
AU (1) AU550620B2 (en)
BR (1) BR8500354A (en)
CA (1) CA1228173A (en)
DE (1) DE3572909D1 (en)
ES (1) ES8606773A1 (en)

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US5121293A (en) * 1991-08-08 1992-06-09 Sun Microsystems, Inc. Method and apparatus for interconnecting devices using tab in board technology
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EP0608418B1 (en) * 1992-05-20 1998-11-04 Seiko Epson Corporation Cartridge for electronic apparatus
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US5706171A (en) * 1995-11-20 1998-01-06 International Business Machines Corporation Flat plate cooling using a thermal paste retainer
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US5920458A (en) * 1997-05-28 1999-07-06 Lucent Technologies Inc. Enhanced cooling of a heat dissipating circuit element
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US7147045B2 (en) * 1998-06-08 2006-12-12 Thermotek, Inc. Toroidal low-profile extrusion cooling system and method thereof
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US6173760B1 (en) * 1998-08-04 2001-01-16 International Business Machines Corporation Co-axial bellows liquid heatsink for high power module test
US6141219A (en) * 1998-12-23 2000-10-31 Sundstrand Corporation Modular power electronics die having integrated cooling apparatus
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US7857037B2 (en) 2001-11-27 2010-12-28 Thermotek, Inc. Geometrically reoriented low-profile phase plane heat pipes
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US7385821B1 (en) * 2001-12-06 2008-06-10 Apple Inc. Cooling method for ICS
US7147367B2 (en) 2002-06-11 2006-12-12 Saint-Gobain Performance Plastics Corporation Thermal interface material with low melting alloy
US7035104B2 (en) * 2002-08-06 2006-04-25 Mudawar Thermal Systems Inc. Apparatus for heat transfer and critical heat flux enhancement
CN100383959C (en) * 2003-02-24 2008-04-23 富士通株式会社 Electronic component and method of manufacturing semiconductor device using same
US20050026014A1 (en) * 2003-07-31 2005-02-03 Michael Fogaing Polymer batteries having thermal exchange apparatus
US7075959B1 (en) 2003-11-14 2006-07-11 Hamilton Sundstrand Corporation Cooling device for diode pumped laser
US20050145371A1 (en) * 2003-12-31 2005-07-07 Eric Distefano Thermal solution for electronics cooling using a heat pipe in combination with active loop solution
US7407083B2 (en) * 2004-08-19 2008-08-05 Thermal Corp. Bonded silicon, components and a method of fabricating the same
US20060060328A1 (en) * 2004-09-21 2006-03-23 Ingo Ewes Heat-transfer devices
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US20060157225A1 (en) * 2005-01-18 2006-07-20 Yves Martin High turbulence heat exchanger
ATE464524T1 (en) * 2005-02-18 2010-04-15 Ebm Papst St Georgen Gmbh & Co HEAT EXCHANGER
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US7849914B2 (en) * 2006-05-02 2010-12-14 Clockspeed, Inc. Cooling apparatus for microelectronic devices
US7870800B2 (en) * 2006-05-15 2011-01-18 Centipede Systems, Inc. Apparatus including a fluid coupler interfaced to a test head
US10349543B2 (en) 2013-02-22 2019-07-09 Vibrant Composites Inc. Layered assemblies
US9093549B2 (en) 2013-07-02 2015-07-28 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
US9743558B2 (en) * 2014-10-14 2017-08-22 Intel Corporation Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages
GB2543549B (en) * 2015-10-21 2020-04-15 Andor Tech Limited Thermoelectric Heat pump system
US9823718B2 (en) * 2016-01-13 2017-11-21 Microsoft Technology Licensing, Llc Device cooling
TWI688326B (en) * 2018-01-17 2020-03-11 緯創資通股份有限公司 Coolant replenishment assembly, cooling cycle system, and electronic device
US10976119B2 (en) * 2018-07-30 2021-04-13 The Boeing Company Heat transfer devices and methods of transfering heat
JP7195542B2 (en) * 2019-04-05 2022-12-26 富士電機株式会社 cooler, semiconductor module
CN113257759A (en) * 2020-02-10 2021-08-13 华为技术有限公司 Radiator, single board, electronic equipment and manufacturing method
GB2615775B (en) * 2022-02-17 2025-01-15 Iceotope Group Ltd Apparatus and system for cooling electronic devices
DE102023211844A1 (en) * 2023-11-28 2025-05-28 Robert Bosch Gesellschaft mit beschränkter Haftung Electronic arrangement and method for forming an electronic arrangement

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US4254431A (en) * 1979-06-20 1981-03-03 International Business Machines Corporation Restorable backbond for LSI chips using liquid metal coated dendrites
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US4561011A (en) * 1982-10-05 1985-12-24 Mitsubishi Denki Kabushiki Kaisha Dimensionally stable semiconductor device

Also Published As

Publication number Publication date
CA1228173A (en) 1987-10-13
AU550620B2 (en) 1986-03-27
ES539841A0 (en) 1986-04-16
EP0151068A3 (en) 1985-09-18
DE3572909D1 (en) 1989-10-12
US4729060A (en) 1988-03-01
KR900002213B1 (en) 1990-04-04
EP0151068B1 (en) 1989-09-06
EP0151068A2 (en) 1985-08-07
ES8606773A1 (en) 1986-04-16
KR850006301A (en) 1985-10-02
JPH0315341B2 (en) 1991-02-28
JPS60160149A (en) 1985-08-21
AU3794485A (en) 1985-08-01

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Legal Events

Date Code Title Description
B21A Patent or certificate of addition expired [chapter 21.1 patent gazette]

Free format text: PATENTE EXTINTA EM 25/01/2000