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BR8208045A - ELECTRIC CONDUCTOR ADHESIVE TO A SUBSTRATE AND PROCESS OF PRODUCTION OF THAT CONDUCTOR - Google Patents

ELECTRIC CONDUCTOR ADHESIVE TO A SUBSTRATE AND PROCESS OF PRODUCTION OF THAT CONDUCTOR

Info

Publication number
BR8208045A
BR8208045A BR8208045A BR8208045A BR8208045A BR 8208045 A BR8208045 A BR 8208045A BR 8208045 A BR8208045 A BR 8208045A BR 8208045 A BR8208045 A BR 8208045A BR 8208045 A BR8208045 A BR 8208045A
Authority
BR
Brazil
Prior art keywords
conductor
substrate
production
adhesive
electric conductor
Prior art date
Application number
BR8208045A
Other languages
Portuguese (pt)
Inventor
Charles William Eichelberger
Robert John Wojnarowski
Abraham Auerbach
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of BR8208045A publication Critical patent/BR8208045A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
BR8208045A 1982-01-04 1982-07-15 ELECTRIC CONDUCTOR ADHESIVE TO A SUBSTRATE AND PROCESS OF PRODUCTION OF THAT CONDUCTOR BR8208045A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33680782A 1982-01-04 1982-01-04
PCT/US1982/000956 WO1983002538A1 (en) 1982-01-04 1982-07-15 Electroplated augmentative replacement processed conductors and manufacture thereof

Publications (1)

Publication Number Publication Date
BR8208045A true BR8208045A (en) 1983-11-22

Family

ID=23317760

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8208045A BR8208045A (en) 1982-01-04 1982-07-15 ELECTRIC CONDUCTOR ADHESIVE TO A SUBSTRATE AND PROCESS OF PRODUCTION OF THAT CONDUCTOR

Country Status (4)

Country Link
EP (1) EP0097656A4 (en)
JP (1) JPS59500034A (en)
BR (1) BR8208045A (en)
WO (1) WO1983002538A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61110794A (en) * 1984-11-06 1986-05-29 Mitsui Mining & Smelting Co Ltd Surface treatment of copper foil
ATE246847T1 (en) * 1997-09-19 2003-08-15 Peter Vernon PLANAR ANTENNA ARRANGEMENT
KR100921874B1 (en) 2001-10-29 2009-10-13 히타치 긴조쿠 가부시키가이샤 Formation method of electroplating film on article surface

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR762653A (en) * 1933-08-07 1934-04-16 Process for preparing die-cast materials for electroplating
FR1188376A (en) * 1956-12-15 1959-09-22 Nippon Telegraph & Telephone Advanced process for manufacturing printed circuit boards
DE1521152A1 (en) * 1965-07-16 1969-04-24 Basf Ag Metallization of plastic surfaces
US3488166A (en) * 1967-01-13 1970-01-06 Ibm Method for activating plastics,subsequent metallization and article of manufacture resulting therefrom
US3764280A (en) * 1970-11-02 1973-10-09 Gen Electric Electroconductive coatings on non conductive substrates
DE2728465C2 (en) * 1977-06-24 1982-04-22 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Printed circuit
US4416914A (en) * 1980-12-29 1983-11-22 General Electric Company Electrical conductors arranged in multiple layers and preparation thereof
US4362903A (en) * 1980-12-29 1982-12-07 General Electric Company Electrical conductor interconnect providing solderable connections to hard-to-contact substrates, such as liquid crystal cells

Also Published As

Publication number Publication date
EP0097656A4 (en) 1986-05-14
EP0097656A1 (en) 1984-01-11
WO1983002538A1 (en) 1983-07-21
JPS59500034A (en) 1984-01-05

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