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BR8205922A - Dispositivo de contato para conectar componentes eletricos de forma desengatevel e respectivo metodo de fabricacao - Google Patents

Dispositivo de contato para conectar componentes eletricos de forma desengatevel e respectivo metodo de fabricacao

Info

Publication number
BR8205922A
BR8205922A BR8205922A BR8205922A BR8205922A BR 8205922 A BR8205922 A BR 8205922A BR 8205922 A BR8205922 A BR 8205922A BR 8205922 A BR8205922 A BR 8205922A BR 8205922 A BR8205922 A BR 8205922A
Authority
BR
Brazil
Prior art keywords
disengatable
manufacturing
way
electrical components
contact device
Prior art date
Application number
BR8205922A
Other languages
English (en)
Inventor
Harald Bohlen
Gerhard Kaus
Johann Greschner
Joachim Keyser
Werner Kulcke
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of BR8205922A publication Critical patent/BR8205922A/pt

Links

Classifications

    • H10W20/4451—
    • H10W72/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12674—Ge- or Si-base component
BR8205922A 1981-10-30 1982-10-08 Dispositivo de contato para conectar componentes eletricos de forma desengatevel e respectivo metodo de fabricacao BR8205922A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP81109371A EP0078337B1 (de) 1981-10-30 1981-10-30 Kontakteinrichtung zur lösbaren Verbindung elektrischer Bauteile

Publications (1)

Publication Number Publication Date
BR8205922A true BR8205922A (pt) 1983-09-06

Family

ID=8187990

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8205922A BR8205922A (pt) 1981-10-30 1982-10-08 Dispositivo de contato para conectar componentes eletricos de forma desengatevel e respectivo metodo de fabricacao

Country Status (6)

Country Link
US (1) US4522893A (pt)
EP (1) EP0078337B1 (pt)
JP (1) JPS5880275A (pt)
BR (1) BR8205922A (pt)
CA (1) CA1196113A (pt)
DE (1) DE3176140D1 (pt)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
DE3764354D1 (de) * 1987-01-20 1990-09-20 Litef Gmbh Biegefedergelenk und verfahren zu seiner herstellung.
JPH02304883A (ja) * 1989-05-19 1990-12-18 Japan Aviation Electron Ind Ltd 狭ピッチコネクタ
US4969842A (en) * 1989-11-30 1990-11-13 Amp Incorporated Molded electrical connector having integral spring contact beams
JPH03186701A (ja) * 1989-12-15 1991-08-14 Fujitsu Ltd ノギス用測定補助具
JP2561400B2 (ja) * 1991-07-31 1996-12-04 キヤノン株式会社 電子写真装置及びこの装置に着脱可能なプロセスカートリッジ
US5491604A (en) 1992-12-11 1996-02-13 The Regents Of The University Of California Q-controlled microresonators and tunable electronic filters using such resonators
US5806181A (en) * 1993-11-16 1998-09-15 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6741085B1 (en) * 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
DE4410947C1 (de) * 1994-03-29 1995-06-01 Siemens Ag Halbleiterbauelement für vertikale Integration und Herstellungsverfahren
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US6690185B1 (en) 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
US7247035B2 (en) 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US7349223B2 (en) 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US7215131B1 (en) 1999-06-07 2007-05-08 Formfactor, Inc. Segmented contactor
US6232669B1 (en) * 1999-10-12 2001-05-15 Advantest Corp. Contact structure having silicon finger contactors and total stack-up structure using same
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US7579848B2 (en) 2000-05-23 2009-08-25 Nanonexus, Inc. High density interconnect system for IC packages and interconnect assemblies

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE77525C (de) * E. ZEHNER, Suhl i. Th Maschine zur Herstellung von Spiralbohrern durch Ziehen im Drall
US3525146A (en) * 1965-12-11 1970-08-25 Sanyo Electric Co Method of making semiconductor devices having crystal extensions for leads
JPS5432315B1 (pt) * 1971-06-30 1979-10-13
US3971860A (en) * 1973-05-07 1976-07-27 International Business Machines Corporation Method for making device for high resolution electron beam fabrication
US3921916A (en) * 1974-12-31 1975-11-25 Ibm Nozzles formed in monocrystalline silicon

Also Published As

Publication number Publication date
EP0078337B1 (de) 1987-04-22
DE3176140D1 (en) 1987-05-27
EP0078337A3 (en) 1984-11-07
JPS6249704B2 (pt) 1987-10-21
JPS5880275A (ja) 1983-05-14
EP0078337A2 (de) 1983-05-11
US4522893A (en) 1985-06-11
CA1196113A (en) 1985-10-29

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Legal Events

Date Code Title Description
MM Lapse due to non-payment of fees (art. 50)