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BR8101794A - Material composito e processo para sua manufatura - Google Patents

Material composito e processo para sua manufatura

Info

Publication number
BR8101794A
BR8101794A BR8101794A BR8101794A BR8101794A BR 8101794 A BR8101794 A BR 8101794A BR 8101794 A BR8101794 A BR 8101794A BR 8101794 A BR8101794 A BR 8101794A BR 8101794 A BR8101794 A BR 8101794A
Authority
BR
Brazil
Prior art keywords
manufacture
composite material
composite
Prior art date
Application number
BR8101794A
Other languages
English (en)
Inventor
H Larker
Original Assignee
Asea Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asea Ab filed Critical Asea Ab
Publication of BR8101794A publication Critical patent/BR8101794A/pt

Links

Classifications

    • H10W76/138—
    • H10W70/22—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
BR8101794A 1980-03-27 1981-03-26 Material composito e processo para sua manufatura BR8101794A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8002365A SE420964B (sv) 1980-03-27 1980-03-27 Kompositmaterial och sett for dess framstellning

Publications (1)

Publication Number Publication Date
BR8101794A true BR8101794A (pt) 1981-09-29

Family

ID=20340622

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8101794A BR8101794A (pt) 1980-03-27 1981-03-26 Material composito e processo para sua manufatura

Country Status (8)

Country Link
US (1) US4401728A (pt)
JP (1) JPS56150834A (pt)
BR (1) BR8101794A (pt)
CA (1) CA1181265A (pt)
DE (1) DE3110034A1 (pt)
FR (1) FR2479565A1 (pt)
GB (1) GB2074373B (pt)
SE (1) SE420964B (pt)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3308661A1 (de) * 1983-03-11 1984-09-20 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterelement
US4788627A (en) * 1986-06-06 1988-11-29 Tektronix, Inc. Heat sink device using composite metal alloy
US4894293A (en) * 1988-03-10 1990-01-16 Texas Instruments Incorporated Circuit system, a composite metal material for use therein, and a method for making the material
US5050040A (en) * 1988-10-21 1991-09-17 Texas Instruments Incorporated Composite material, a heat-dissipating member using the material in a circuit system, the circuit system
JPH07115214B2 (ja) * 1988-11-22 1995-12-13 住友金属工業株式会社 多芯構造複合材料の製造方法
CA1316303C (en) * 1988-12-23 1993-04-20 Thijs Eerkes Composite structure
US5015803A (en) * 1989-05-31 1991-05-14 Olin Corporation Thermal performance package for integrated circuit chip
US4994903A (en) * 1989-12-18 1991-02-19 Texas Instruments Incorporated Circuit substrate and circuit using the substrate
CN1236982A (zh) * 1998-01-22 1999-12-01 株式会社日立制作所 压力接触型半导体器件及其转换器
EP1182701A1 (de) * 2000-08-21 2002-02-27 Abb Research Ltd. Verfahren zur Herstellung eines Pufferelementes zur Verminderung von mechanischen Spannungen
ES2307095T3 (es) 2004-08-18 2008-11-16 Honda Motor Co., Ltd. Sistema de control electronico de carburador.
JP2013115083A (ja) * 2011-11-25 2013-06-10 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA676283A (en) * 1963-12-17 Siemens Alfred Electric semiconductor device
DE1153461B (de) * 1960-06-23 1963-08-29 Siemens Ag Halbleiteranordnung
DE1141029B (de) * 1960-06-23 1962-12-13 Siemens Ag Halbleiteranordnung und Verfahren zu ihrer Herstellung
US3399332A (en) * 1965-12-29 1968-08-27 Texas Instruments Inc Heat-dissipating support for semiconductor device
US3919764A (en) * 1969-06-06 1975-11-18 Union Carbide Corp Method of making metallic composite materials
DE2039806C3 (de) * 1970-08-11 1975-05-07 Brown, Boveri & Cie Ag, 6800 Mannheim Halbleiterbauelement mit Druckkontakten
US3800192A (en) * 1970-08-11 1974-03-26 O Schaerli Semiconductor circuit element with pressure contact means
JPS5333059A (en) * 1976-09-08 1978-03-28 Mitsubishi Electric Corp Semiconductor device
CA1083263A (en) * 1977-06-29 1980-08-05 Norman Hascoe Prefabricated composite metallic heat-transmitting plate unit
US4385310A (en) * 1978-03-22 1983-05-24 General Electric Company Structured copper strain buffer
US4283464A (en) * 1979-05-08 1981-08-11 Norman Hascoe Prefabricated composite metallic heat-transmitting plate unit

Also Published As

Publication number Publication date
CA1181265A (en) 1985-01-22
JPS56150834A (en) 1981-11-21
SE8002365L (sv) 1981-09-28
DE3110034A1 (de) 1982-01-28
GB2074373A (en) 1981-10-28
US4401728A (en) 1983-08-30
GB2074373B (en) 1984-05-10
FR2479565A1 (fr) 1981-10-02
SE420964B (sv) 1981-11-09

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