BR8004063A - Modulo de encapsulacao - Google Patents

Modulo de encapsulacao

Info

Publication number: BR8004063A
Authority: BR; Brazil
Prior art keywords: encapsulation module; encapsulation; module
Prior art date: 1979-06-29

Application number

BR8004063A

Other languages

English (en)

Inventor

D Thompson

Original Assignee

Ibm

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1979-06-29

Filing date

1980-06-27

Publication date

1981-01-21

1980-06-27 Application filed by Ibm filed Critical Ibm

1981-01-21 Publication of BR8004063A publication Critical patent/BR8004063A/pt

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
- H10W44/601—
- H10W72/07251—
- H10W72/20—
- H10W90/724—

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Coupling Device And Connection With Printed Circuit (AREA)
Structure Of Printed Boards (AREA)
Multi-Conductor Connections (AREA)

BR8004063A 1979-06-29 1980-06-27 Modulo de encapsulacao BR8004063A (pt)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US06/053,660 US4237522A (en)	1979-06-29	1979-06-29	Chip package with high capacitance, stacked vlsi/power sheets extending through slots in substrate

Publications (1)

Publication Number	Publication Date
BR8004063A true BR8004063A (pt)	1981-01-21

Family

ID=21985743

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BR8004063A BR8004063A (pt)	1979-06-29	1980-06-27	Modulo de encapsulacao

Country Status (11)

Country	Link
US (1)	US4237522A (pt)
EP (1)	EP0022176B1 (pt)
JP (1)	JPS58187B2 (pt)
BR (1)	BR8004063A (pt)
CA (1)	CA1137646A (pt)
DE (1)	DE3061605D1 (pt)
DK (1)	DK277580A (pt)
ES (1)	ES492742A0 (pt)
FI (1)	FI802059A7 (pt)
IT (1)	IT1150994B (pt)
NO (1)	NO801801L (pt)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4295183A (en) *	1979-06-29	1981-10-13	International Business Machines Corporation	Thin film metal package for LSI chips
US4281361A (en) *	1980-03-17	1981-07-28	The United States Of America As Represented By The Secretary Of The Navy	Simplified multilayer circuit board
US4328530A (en) *	1980-06-30	1982-05-04	International Business Machines Corporation	Multiple layer, ceramic carrier for high switching speed VLSI chips
US4349862A (en) *	1980-08-11	1982-09-14	International Business Machines Corporation	Capacitive chip carrier and multilayer ceramic capacitors
US4453176A (en) *	1981-12-31	1984-06-05	International Business Machines Corporation	LSI Chip carrier with buried repairable capacitor with low inductance leads
JPS6012095U (ja) *	1983-06-29	1985-01-26	黒崎窯業株式会社	熱交換器
US4535388A (en) *	1984-06-29	1985-08-13	International Business Machines Corporation	High density wired module
JPS6156493A (ja) *	1984-08-28	1986-03-22	日本電気株式会社	多層回路基板の電源配線構造
US4945399A (en) *	1986-09-30	1990-07-31	International Business Machines Corporation	Electronic package with integrated distributed decoupling capacitors
US4744008A (en) *	1986-11-18	1988-05-10	International Business Machines Corporation	Flexible film chip carrier with decoupling capacitors
US4907068A (en) *	1987-01-21	1990-03-06	Siemens Aktiengesellschaft	Semiconductor arrangement having at least one semiconductor body
US4868634A (en) *	1987-03-13	1989-09-19	Citizen Watch Co., Ltd.	IC-packaged device
US4855809A (en) *	1987-11-24	1989-08-08	Texas Instruments Incorporated	Orthogonal chip mount system module and method
US5025306A (en) *	1988-08-09	1991-06-18	Texas Instruments Incorporated	Assembly of semiconductor chips
US5027253A (en) *	1990-04-09	1991-06-25	Ibm Corporation	Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
US5343366A (en) *	1992-06-24	1994-08-30	International Business Machines Corporation	Packages for stacked integrated circuit chip cubes
DE4237083C2 (de) *	1992-11-03	2002-11-28	Diehl Stiftung & Co	Anordnung von miteinander verschalteten Baugruppen
JPH0828244B2 (ja) *	1993-04-28	1996-03-21	日本電気株式会社	マルチチップパッケージの給電構造
US5765279A (en) *	1995-05-22	1998-06-16	Fujitsu Limited	Methods of manufacturing power supply distribution structures for multichip modules
US5657537A (en) *	1995-05-30	1997-08-19	General Electric Company	Method for fabricating a stack of two dimensional circuit modules
US9054094B2 (en)	1997-04-08	2015-06-09	X2Y Attenuators, Llc	Energy conditioning circuit arrangement for integrated circuit
US7321485B2 (en)	1997-04-08	2008-01-22	X2Y Attenuators, Llc	Arrangement for energy conditioning
US7336468B2 (en)	1997-04-08	2008-02-26	X2Y Attenuators, Llc	Arrangement for energy conditioning
US6657313B1 (en) *	1999-01-19	2003-12-02	International Business Machines Corporation	Dielectric interposer for chip to substrate soldering
GB2439862A (en)	2005-03-01	2008-01-09	X2Y Attenuators Llc	Conditioner with coplanar conductors
US7983024B2 (en) *	2007-04-24	2011-07-19	Littelfuse, Inc.	Fuse card system for automotive circuit protection
US9275966B2 (en) *	2012-06-21	2016-03-01	Freescale Semiconductor, Inc.	Semiconductor device apparatus and assembly with opposite die orientations

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2995686A (en) *	1959-03-02	1961-08-08	Sylvania Electric Prod	Microelectronic circuit module
US3243661A (en) *	1963-06-25	1966-03-29	United Aircraft Corp	Enhanced micro-modules
US3312870A (en) *	1964-03-13	1967-04-04	Hughes Aircraft Co	Electrical transmission system
US3353070A (en) *	1965-12-13	1967-11-14	Bunker Ramo	Molded sandwich electrical connector with improved connector pins and encapsulating structure
US3437882A (en) *	1966-01-14	1969-04-08	Texas Instruments Inc	Circuit board structure with interconnecting means
FR1520294A (fr) *	1966-04-25	1968-04-05	Texas Instruments Inc	Perfectionnements aux réseaux de circuits intégrés et à leurs procédés de fabrication
US3436604A (en) *	1966-04-25	1969-04-01	Texas Instruments Inc	Complex integrated circuit array and method for fabricating same
US3418535A (en) *	1967-01-23	1968-12-24	Elco Corp	Interconnection matrix for dual-in-line packages
US3522485A (en) *	1967-11-21	1970-08-04	Automatic Radio Mfg Co	Modular circuit construction
GB1152809A (en) *	1968-05-07	1969-05-21	Standard Telephones Cables Ltd	Electric Circuit Assembly
US3671812A (en) *	1970-07-01	1972-06-20	Martin Marietta Corp	High density packaging of electronic components in three-dimensional modules
GB1278380A (en) *	1970-08-13	1972-06-21	Standard Telephones Cables Ltd	Electrical circuit assembly
US3949274A (en) *	1974-05-30	1976-04-06	International Business Machines Corporation	Packaging and interconnection for superconductive circuitry
US4109298A (en) *	1976-07-26	1978-08-22	Texas Instruments Incorporated	Connector with printed wiring board structure

1979
- 1979-06-29 US US06/053,660 patent/US4237522A/en not_active Expired - Lifetime
1980
- 1980-04-14 CA CA000349745A patent/CA1137646A/en not_active Expired
- 1980-05-20 JP JP55066054A patent/JPS58187B2/ja not_active Expired
- 1980-06-03 EP EP80103083A patent/EP0022176B1/de not_active Expired
- 1980-06-03 DE DE8080103083T patent/DE3061605D1/de not_active Expired
- 1980-06-17 NO NO801801A patent/NO801801L/no unknown
- 1980-06-23 IT IT22957/80A patent/IT1150994B/it active
- 1980-06-25 ES ES492742A patent/ES492742A0/es active Granted
- 1980-06-27 BR BR8004063A patent/BR8004063A/pt unknown
- 1980-06-27 DK DK277580A patent/DK277580A/da not_active Application Discontinuation
- 1980-06-27 FI FI802059A patent/FI802059A7/fi not_active Application Discontinuation

Also Published As

Publication number	Publication date
JPS567458A (en)	1981-01-26
NO801801L (no)	1980-12-30
US4237522A (en)	1980-12-02
FI802059A7 (fi)	1981-01-01
IT8022957A0 (it)	1980-06-23
DE3061605D1 (en)	1983-02-17
JPS58187B2 (ja)	1983-01-05
IT1150994B (it)	1986-12-17
CA1137646A (en)	1982-12-14
EP0022176A1 (de)	1981-01-14
ES8102417A1 (es)	1980-12-16
DK277580A (da)	1980-12-30
EP0022176B1 (de)	1983-01-12
ES492742A0 (es)	1980-12-16

Publication	Publication Date	Title
BR8004063A (pt)	1981-01-21	Modulo de encapsulacao
AR224644A1 (es)	1981-12-30	Procedimiento de encapsulacion mediante policondensacion intersuperficial
IT1097248B (it)	1985-08-26	Modulo di scatola di comando
BR7705660A (pt)	1978-07-04	Modulo disjuntor unitario
IT7827408A0 (it)	1978-09-07	Modulo di raffreddamento perfezionato.
IT1151464B (it)	1986-12-17	Modulo costruttivo leggero
NO150980C (no)	1985-01-23	Kraftmodulhus
IT7830410A0 (it)	1978-12-01	Modulo elettronico perfezionato.
IT7921742V0 (it)	1979-06-05	Modulo di protezione per blocchi di collegamento.
MX152005A (es)	1985-05-23	Modulo mejorado de dispositivo de potencia
AT376996B (de)	1985-01-25	Frostschutzmittel
IT7925872A0 (it)	1979-09-20	Modulo di filtro elettrico.
DK232180A (da)	1981-05-25	Soenderdelingsapparat
SE8000661L (sv)	1980-07-30	Blyror-vermevexlare
ATE4356T1 (de)	1983-08-15	Modulschutzschalter.
ES254482Y (es)	1981-10-01	Modulo de proteccion
BR7908070A (pt)	1980-07-22	Modulo de impressao
BR7901501A (pt)	1980-10-07	Modulo habitacional conico
BR7908648A (pt)	1980-05-13	Modulo hidraulico
BR7704886A (pt)	1979-02-06	Modulo arrimo
BR6200343U (pt)	1982-06-15	Modulo
IT206041Z2 (it)	1987-03-02	Modulo
ES248812Y (es)	1981-06-01	Modulo multifuncional
IT8247502A0 (it)	1982-01-04	Modulo abitativo
PT7174U (pt)	1983-07-06	Modulo injectado