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BR0318172A - dispositivo de combinação de impedáncia, e, método para fabricar o mesmo - Google Patents

dispositivo de combinação de impedáncia, e, método para fabricar o mesmo

Info

Publication number
BR0318172A
BR0318172A BRPI0318172-3A BR0318172A BR0318172A BR 0318172 A BR0318172 A BR 0318172A BR 0318172 A BR0318172 A BR 0318172A BR 0318172 A BR0318172 A BR 0318172A
Authority
BR
Brazil
Prior art keywords
dielectric
conductive strip
manufacturing
impedance matching
same
Prior art date
Application number
BRPI0318172-3A
Other languages
English (en)
Other versions
BR0318172B1 (pt
Inventor
Maria Cristina Ribeir Carvalho
Luiz Fernando Conrado
Luciene Da Silva Demenicis
Walter Margulis
Daniele Alves Seixas
Original Assignee
Ericsson Telecomunicacoes Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telecomunicacoes Sa filed Critical Ericsson Telecomunicacoes Sa
Publication of BR0318172A publication Critical patent/BR0318172A/pt
Publication of BR0318172B1 publication Critical patent/BR0318172B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling

Landscapes

  • Waveguides (AREA)

Abstract

"DISPOSITIVO DE COMBINAçãO DE IMPEDáNCIA, E, MéTODO PARA FABRICAR O MESMO". Um acoplador de combinação de impedância (1) compreende um substrato dielétrico (10) sobre o qual uma tira condutora (12) é disposta. Uma camada dielétrica (14), preferivelmente um filme dielétrico, é formada no topo da tira condutora e a primeira camada dielétrica para envolver a tira condutora. Uma camada metálica (16, 18) é finalmente provida no topo da camada dielétrica. A camada dielétrica possui uma constante dielétrica que é substancialmente mais alta que a constante dielétrica para o substrato dielétrico, preferivelmente mais de dez vezes mais alta. Um filme dielétrico com uma espessura de menos de 100 mm é vantajoso, preferivelmente entre 5 e 100 mm, e ainda mais preferivelmente entre 10 e 70 mm. A espessura do substrato dielétrico é preferivelmente maior que para o filme dielétrico, preferivelmente mais de dez vezes maior. A tira condutora possui preferivelmente uma largura constante. A espessura do filme dielétrico é preferivelmente maior que 10% da largura da tira condutora.
BRPI0318172-3B1A 2003-03-07 2003-03-07 "dispositivo de combinaÇço de impedÂncia, e, mÉtodo para fabricar o mesmo" BR0318172B1 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/BR2003/000031 WO2004079855A1 (en) 2003-03-07 2003-03-07 Impedance-matching coupler

Publications (2)

Publication Number Publication Date
BR0318172A true BR0318172A (pt) 2006-02-21
BR0318172B1 BR0318172B1 (pt) 2013-08-20

Family

ID=32932162

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0318172-3B1A BR0318172B1 (pt) 2003-03-07 2003-03-07 "dispositivo de combinaÇço de impedÂncia, e, mÉtodo para fabricar o mesmo"

Country Status (8)

Country Link
US (1) US7348865B2 (pt)
EP (1) EP1604424B1 (pt)
JP (1) JP2006514482A (pt)
CN (1) CN100350671C (pt)
AU (1) AU2003209872A1 (pt)
BR (1) BR0318172B1 (pt)
DE (1) DE60307903T2 (pt)
WO (1) WO2004079855A1 (pt)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7388279B2 (en) * 2003-11-12 2008-06-17 Interconnect Portfolio, Llc Tapered dielectric and conductor structures and applications thereof
US7466021B2 (en) * 2003-11-17 2008-12-16 Interconnect Portfolio, Llp Memory packages having stair step interconnection layers
US7433602B2 (en) * 2004-01-13 2008-10-07 Finisar Corporation Implementation of gradual impedance gradient transmission line for optimized matching in fiber optic transmitter laser drivers
US20110298567A1 (en) * 2004-09-24 2011-12-08 Oracle America, Inc., formerly known as Sun Microsystems, Inc. System and method for constant characteristic impedance in a flexible trace interconnect array
US7564695B2 (en) * 2007-07-09 2009-07-21 Canon Kabushiki Kaisha Circuit connection structure and printed circuit board
US7898357B2 (en) * 2008-05-12 2011-03-01 Andrew Llc Coaxial impedance matching adapter and method of manufacture
JPWO2009153956A1 (ja) * 2008-06-17 2011-11-24 パナソニック株式会社 バランを有する半導体装置
US8916996B2 (en) * 2011-07-29 2014-12-23 General Electric Company Electrical distribution system
EP2849543B1 (en) * 2013-09-12 2021-02-24 Socionext Inc. Components and circuits for output termination
CN205564941U (zh) * 2014-02-04 2016-09-07 株式会社村田制作所 高频信号传输线路及电子设备
CN105785299A (zh) * 2014-12-24 2016-07-20 北京无线电计量测试研究所 片上测量系统的共面波导反射幅度标准器及其设计方法
JP6309905B2 (ja) * 2015-02-25 2018-04-11 日本電信電話株式会社 インピーダンス変換器
GB2539714A (en) * 2015-06-26 2016-12-28 Sofant Tech Ltd Impedance matching circuitry
KR102520393B1 (ko) * 2015-11-11 2023-04-12 삼성전자주식회사 디지털 신호의 분기에 따른 반사 손실을 감소시키는 임피던스 매칭 소자 및 이를 포함하는 테스트 시스템
JP6983688B2 (ja) * 2018-02-05 2021-12-17 日本メクトロン株式会社 カテーテル用フレキシブルプリント配線板およびその製造方法
US10707547B2 (en) * 2018-06-26 2020-07-07 Raytheon Company Biplanar tapered line frequency selective limiter
JP7179574B2 (ja) * 2018-10-17 2022-11-29 キヤノン株式会社 通信システム及び通信方法
CN114759330B (zh) * 2022-03-25 2023-04-11 北京邮电大学 一种新型模式转换传输线

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3449813A (en) * 1966-10-10 1969-06-17 Allied Pacific Mfg Co Apparatus for the programmed insertion of terminals
US3419813A (en) * 1967-06-22 1968-12-31 Rca Corp Wide-band transistor power amplifier using a short impedance matching section
BR8906400A (pt) * 1989-12-07 1991-06-11 Brasilia Telecom Acoplador casador de impedancias
US5119048A (en) * 1990-11-05 1992-06-02 Grunwell Randall L Pseudo tapered lines using modified ground planes
US5140288A (en) * 1991-04-08 1992-08-18 Motorola, Inc. Wide band transmission line impedance matching transformer
US6734755B2 (en) * 2002-05-16 2004-05-11 Corning Incorporated Broadband uniplanar coplanar transition

Also Published As

Publication number Publication date
US20060226930A1 (en) 2006-10-12
CN100350671C (zh) 2007-11-21
WO2004079855A1 (en) 2004-09-16
EP1604424A1 (en) 2005-12-14
DE60307903T2 (de) 2007-10-04
EP1604424B1 (en) 2006-08-23
BR0318172B1 (pt) 2013-08-20
JP2006514482A (ja) 2006-04-27
AU2003209872A1 (en) 2004-09-28
DE60307903D1 (de) 2006-10-05
CN1751411A (zh) 2006-03-22
US7348865B2 (en) 2008-03-25
WO2004079855A8 (en) 2005-05-19

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 3A ANUIDA DE.

B08G Application fees: restoration [chapter 8.7 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 20/08/2013, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 14A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)