BR0316671A - Composição adesiva de cura por uv para disco ótico, material e artigos curados - Google Patents
Composição adesiva de cura por uv para disco ótico, material e artigos curadosInfo
- Publication number
- BR0316671A BR0316671A BR0316671-6A BR0316671A BR0316671A BR 0316671 A BR0316671 A BR 0316671A BR 0316671 A BR0316671 A BR 0316671A BR 0316671 A BR0316671 A BR 0316671A
- Authority
- BR
- Brazil
- Prior art keywords
- optical disc
- curing adhesive
- produced
- reflection film
- adhesive composition
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title abstract 10
- 239000000853 adhesive Substances 0.000 title abstract 3
- 230000001070 adhesive effect Effects 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 title abstract 3
- 238000003848 UV Light-Curing Methods 0.000 title abstract 2
- 239000000463 material Substances 0.000 title abstract 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 abstract 1
- 229910001316 Ag alloy Inorganic materials 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 239000004840 adhesive resin Substances 0.000 abstract 1
- 229920006223 adhesive resin Polymers 0.000 abstract 1
- 230000001588 bifunctional effect Effects 0.000 abstract 1
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000001723 curing Methods 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000178 monomer Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/064—Polymers containing more than one epoxy group per molecule
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
- G11B7/252—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers
- G11B7/256—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of layers improving adhesion between layers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
Abstract
"COMPOSIçãO ADESIVA DE CURA POR UV PARA DISCO óTICO, MATERIAL E ARTIGOS CURADOS". A presente invenção refere-se a um adesivo de cura por UV para ligação de substratos de disco ótico de um ou ambos dos quais tendo uma película de reflexo semitransparente de prata, uma liga de prata, ou semelhantes. O diso ótico ligado assim produzido tem uma alta durabilidade equivalente àqueles de discos óticos usando uma película de reflexo semitransparente de ouro convencional e está livre de vazios (bolhas de ar) que podem ser produzidos enquanto o disco ótico é fabricado por um aparelho de fabricação de disco ótico. A degradação em refletância da película de reflexo semitransparente pode ser suprimida mesmo quando o disco ótico produzido é exposto à luz solar direta por um período longo de tempo. A composição de resina adesiva de cura por UV para ligação de substratos de disco ótico contém (A) um (met)acrilato de epóxi, 2,2-dimetóxi-l,2-difeniletan-1-ona e (E) um monómero de (met)acrilato monofuncional, bifuncional, trifuncional, e tem resistividade elétrica de 1000 M<87>.cm ou menos a 25<198>C.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002342037A JP2004175866A (ja) | 2002-11-26 | 2002-11-26 | 光ディスク用接着剤組成物、硬化物および物品 |
| PCT/JP2003/014644 WO2004048490A1 (ja) | 2002-11-26 | 2003-11-18 | 光ディスク用接着剤組成物、硬化物および物品 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR0316671A true BR0316671A (pt) | 2005-10-11 |
Family
ID=32375872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR0316671-6A BR0316671A (pt) | 2002-11-26 | 2003-11-18 | Composição adesiva de cura por uv para disco ótico, material e artigos curados |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US20060074209A1 (pt) |
| EP (1) | EP1566422B1 (pt) |
| JP (1) | JP2004175866A (pt) |
| KR (1) | KR20050083993A (pt) |
| CN (1) | CN100351335C (pt) |
| AU (1) | AU2003280846A1 (pt) |
| BR (1) | BR0316671A (pt) |
| CA (1) | CA2505550A1 (pt) |
| DE (1) | DE60311143T2 (pt) |
| MX (1) | MXPA05005491A (pt) |
| TW (1) | TW200422370A (pt) |
| WO (1) | WO2004048490A1 (pt) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7268058B2 (en) | 2004-01-16 | 2007-09-11 | Intel Corporation | Tri-gate transistors and methods to fabricate same |
| US20080152857A1 (en) * | 2004-08-19 | 2008-06-26 | Nippon Kayaku Kabushiki Kaisha | Adhesive Compositon for Optical Disk, Cured Product and Article |
| JP4766548B2 (ja) * | 2004-08-19 | 2011-09-07 | 日本化薬株式会社 | 光ディスク用接着剤組成物、硬化物および物品 |
| JP5022709B2 (ja) | 2004-11-09 | 2012-09-12 | 出光興産株式会社 | 光半導体封止材料 |
| CN102391822A (zh) * | 2005-03-16 | 2012-03-28 | 日立化成工业株式会社 | 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 |
| US8408901B2 (en) * | 2005-07-28 | 2013-04-02 | L. Stephen Buchanan | Variable land, multiple height flute contour design for endodontic files |
| AU2007273571B2 (en) * | 2006-07-10 | 2011-10-27 | Nippon Kayaku Kabushiki Kaisha | Ultraviolet-curable resin composition and use thereof |
| WO2008018315A1 (en) * | 2006-08-11 | 2008-02-14 | Dic Corporation | Ultraviolet hardening composition for optical disk interlayer, optical disk and process for producing optical disk |
| JP2008077792A (ja) * | 2006-09-22 | 2008-04-03 | Kobe Steel Ltd | 耐久性に優れた光情報記録媒体 |
| WO2008123179A1 (ja) * | 2007-03-26 | 2008-10-16 | Dic Corporation | 光ディスク用紫外線硬化型組成物及び光ディスク |
| WO2009031658A1 (ja) * | 2007-09-05 | 2009-03-12 | Bridgestone Corporation | 接着剤組成物 |
| JP5202637B2 (ja) * | 2008-08-22 | 2013-06-05 | 株式会社ブリヂストン | 帯電ローラ |
| CN102725794B (zh) * | 2010-01-29 | 2015-12-16 | 日本化药株式会社 | 紫外线固化型树脂组合物、固化物及物品 |
| TWI557733B (zh) * | 2015-06-10 | 2016-11-11 | For the analog record player and the analog record player |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58154765A (ja) * | 1982-02-05 | 1983-09-14 | Daicel Chem Ind Ltd | 光硬化性樹脂組成物 |
| JPS6169875A (ja) * | 1984-09-13 | 1986-04-10 | Sumitomo Metal Ind Ltd | ポリオレフイン被覆のプライマ−用活性エネルギ−線硬化性被覆組成物 |
| JPH0715087B2 (ja) * | 1988-07-21 | 1995-02-22 | リンテック株式会社 | 粘接着テープおよびその使用方法 |
| US5426166A (en) * | 1994-01-26 | 1995-06-20 | Caschem, Inc. | Urethane adhesive compositions |
| JPH08106663A (ja) * | 1994-08-10 | 1996-04-23 | Tdk Corp | 光磁気ディスク |
| KR100491543B1 (ko) * | 1995-04-28 | 2005-12-29 | 니폰 가야꾸 가부시끼가이샤 | 자외선경화형접착제조성물 |
| JPH08325524A (ja) * | 1995-06-02 | 1996-12-10 | Tosoh Corp | メタルハブ用接着剤 |
| JPH08325523A (ja) * | 1995-06-02 | 1996-12-10 | Tosoh Corp | メタルハブ用接着剤 |
| JPH08325526A (ja) * | 1995-06-02 | 1996-12-10 | Tosoh Corp | メタルハブ用接着剤 |
| US5622791A (en) * | 1995-08-25 | 1997-04-22 | Valence Technology, Inc. | Photoelectrochemical cell |
| EP0976692B2 (en) * | 1997-01-20 | 2004-12-29 | Sumitomo Electric Industries, Ltd. | Optical fiber equipped with cladding and method of manufacturing the same |
| KR100539141B1 (ko) * | 1997-02-13 | 2005-12-26 | 코닌클리즈케 디에스엠 엔.브이. | 광경화성 수지 조성물 |
| ATE393182T1 (de) * | 1997-03-07 | 2008-05-15 | Huntsman Adv Mat Switzerland | Polymerisierbare ungesättigte verbindungen, härtbare zusammensetzungen die diese verbindungen enthalten und ihre härtungsprodukte |
| JPH1160656A (ja) * | 1997-08-12 | 1999-03-02 | Jsr Corp | 注型重合用放射線硬化性樹脂組成物 |
| JPH11286657A (ja) * | 1998-04-03 | 1999-10-19 | Three Bond Co Ltd | 光ディスク用接着剤組成物 |
| JP2000063446A (ja) * | 1998-08-17 | 2000-02-29 | Jsr Corp | 光硬化型樹脂組成物 |
| JP4213792B2 (ja) * | 1998-09-24 | 2009-01-21 | 日東電工株式会社 | 熱硬化型感圧性接着剤とその接着シ―ト類 |
| JP2001049198A (ja) * | 1999-08-06 | 2001-02-20 | Jsr Corp | 光ディスク用接着剤 |
| JP2002230834A (ja) * | 2000-06-26 | 2002-08-16 | Tdk Corp | 光情報媒体、その製造方法、その記録または再生方法、およびその検査方法 |
| WO2002014449A2 (en) * | 2000-08-15 | 2002-02-21 | Dsm N.V. | Adhesive composition for optical disks |
| JP2002092961A (ja) * | 2000-09-11 | 2002-03-29 | Nippon Kayaku Co Ltd | 光ディスク用接着剤組成物、硬化物および物品 |
| JP2002114949A (ja) * | 2000-10-05 | 2002-04-16 | Nippon Kayaku Co Ltd | 光ディスク用接着剤組成物、硬化物および物品 |
| JP2002256228A (ja) * | 2001-03-01 | 2002-09-11 | Nippon Kayaku Co Ltd | 光ディスク用接着剤組成物、硬化物および物品 |
| JP4222120B2 (ja) * | 2002-10-07 | 2009-02-12 | Jsr株式会社 | 光導波路形成用感光性樹脂組成物および光導波路 |
-
2002
- 2002-11-26 JP JP2002342037A patent/JP2004175866A/ja active Pending
-
2003
- 2003-11-18 AU AU2003280846A patent/AU2003280846A1/en not_active Abandoned
- 2003-11-18 CN CNB2003801038792A patent/CN100351335C/zh not_active Expired - Fee Related
- 2003-11-18 WO PCT/JP2003/014644 patent/WO2004048490A1/ja not_active Ceased
- 2003-11-18 US US10/535,142 patent/US20060074209A1/en not_active Abandoned
- 2003-11-18 CA CA002505550A patent/CA2505550A1/en not_active Abandoned
- 2003-11-18 EP EP03772849A patent/EP1566422B1/en not_active Expired - Lifetime
- 2003-11-18 KR KR1020057009582A patent/KR20050083993A/ko not_active Withdrawn
- 2003-11-18 DE DE60311143T patent/DE60311143T2/de not_active Expired - Fee Related
- 2003-11-18 MX MXPA05005491A patent/MXPA05005491A/es unknown
- 2003-11-18 BR BR0316671-6A patent/BR0316671A/pt not_active Application Discontinuation
- 2003-11-24 TW TW092132916A patent/TW200422370A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004175866A (ja) | 2004-06-24 |
| EP1566422B1 (en) | 2007-01-10 |
| AU2003280846A1 (en) | 2004-06-18 |
| EP1566422A1 (en) | 2005-08-24 |
| CN1714130A (zh) | 2005-12-28 |
| CA2505550A1 (en) | 2004-06-10 |
| DE60311143T2 (de) | 2007-05-10 |
| WO2004048490A1 (ja) | 2004-06-10 |
| US20060074209A1 (en) | 2006-04-06 |
| MXPA05005491A (es) | 2005-07-25 |
| CN100351335C (zh) | 2007-11-28 |
| KR20050083993A (ko) | 2005-08-26 |
| TWI341323B (pt) | 2011-05-01 |
| DE60311143D1 (de) | 2007-02-22 |
| HK1086025A1 (zh) | 2006-09-08 |
| EP1566422A4 (en) | 2005-12-07 |
| TW200422370A (en) | 2004-11-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
| B11Y | Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette] |