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BR0314404A - Método para ligar uma superfìcie de polìmero a uma superfìcie eletricamente condutora ou semicondutora e uso do método - Google Patents

Método para ligar uma superfìcie de polìmero a uma superfìcie eletricamente condutora ou semicondutora e uso do método

Info

Publication number
BR0314404A
BR0314404A BR0314404-6A BR0314404A BR0314404A BR 0314404 A BR0314404 A BR 0314404A BR 0314404 A BR0314404 A BR 0314404A BR 0314404 A BR0314404 A BR 0314404A
Authority
BR
Brazil
Prior art keywords
electrically conductive
bonding
polymer
polymer surface
semiconductor
Prior art date
Application number
BR0314404-6A
Other languages
English (en)
Other versions
BRPI0314404B1 (pt
Inventor
Christophe Bureau
Julienne Charlier
Original Assignee
Commissariat Energie Atomique
Alchimer S A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique, Alchimer S A filed Critical Commissariat Energie Atomique
Publication of BR0314404A publication Critical patent/BR0314404A/pt
Publication of BRPI0314404B1 publication Critical patent/BRPI0314404B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C09D5/4476—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications comprising polymerisation in situ
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • C08J5/121—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives by heating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • C08J5/122—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using low molecular chemically inert solvents, swelling or softening agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Wood Science & Technology (AREA)
  • Molecular Biology (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Materials For Medical Uses (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)

Abstract

"MéTODO PARA LIGAR UMA SUPERFìCIE DE POLìMERO A UMA SUPERFìCIE ELETRICAMENTE CONDUTORA OU SEMICONDUTORA E USO DO MéTODO". A invenção refere-se a um método para ligar uma superfície de polímero a uma superfície eletricamente condutora ou semicondutora, sendo que o método é caracterizado pelo fato de compreender: a) o eletroenxerto de uma película orgânica na superfície condutora ou semicondutora; e a seguir b) uma operação para ligar a superfície de polímero à superfície condutora ou semicondutora enxertada dessa maneira. Ela também se refere às aplicações desse método e às estruturas obtidas pela sua implementação.
BRPI0314404A 2002-08-26 2003-08-25 método para ligar uma superfície de polímero a uma superfície eletricamente condutora ou semicondutora e uso do método BRPI0314404B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0210565A FR2843756B1 (fr) 2002-08-26 2002-08-26 Procede de soudage d'une surface polymere avec une surface conductrice ou semi-conductrice et ses applications
PCT/FR2003/050037 WO2004018548A2 (fr) 2002-08-26 2003-08-25 Procede de soudage d'une surface polymere avec une surface conductrice ou semi-conductrice

Publications (2)

Publication Number Publication Date
BR0314404A true BR0314404A (pt) 2005-07-19
BRPI0314404B1 BRPI0314404B1 (pt) 2016-09-27

Family

ID=31198301

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0314404A BRPI0314404B1 (pt) 2002-08-26 2003-08-25 método para ligar uma superfície de polímero a uma superfície eletricamente condutora ou semicondutora e uso do método

Country Status (9)

Country Link
US (1) US7605050B2 (pt)
EP (1) EP1532197B1 (pt)
JP (1) JP4339253B2 (pt)
AU (2) AU2003282208A1 (pt)
BR (1) BRPI0314404B1 (pt)
CA (1) CA2496118C (pt)
ES (1) ES2389468T3 (pt)
FR (1) FR2843756B1 (pt)
WO (1) WO2004018548A2 (pt)

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WO2001017320A1 (en) 1999-08-27 2001-03-08 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
KR20080084812A (ko) 2005-11-22 2008-09-19 쇼킹 테크놀로지스 인코포레이티드 과전압 보호를 위해 전압 변환가능 재료를 포함하는 반도체디바이스
EP1989345B1 (fr) * 2006-02-28 2015-03-11 Commissariat à l'Énergie Atomique et aux Énergies Alternatives Procede de formation de films organiques sur des surfaces conductrices ou semi-conductrices de l'electricite a partir de solutions aqueuses
CA2643491C (en) * 2006-02-28 2015-11-03 Alchimer Formation of organic electro-grafted films on the surface of electrically conductive or semi-conductive surfaces
FR2902102B1 (fr) 2006-06-07 2011-11-18 Univ Paris 13 Procede de greffage de polymeres bioactifs sur des materiaux prothetiques
US11039942B2 (en) * 2006-06-13 2021-06-22 Sino Medical Sciences Technology Inc. Drug eluting stent and method of use of the same for enabling restoration of functional endothelial cell layers
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EP2084748A4 (en) 2006-09-24 2011-09-28 Shocking Technologies Inc FORMULATIONS FOR A VOLTAGE-SWITCHABLE DIELECTRIC MATERIAL WITH A DEVICED VOLTAGE CONTACT BEHAVIOR AND METHOD OF MANUFACTURING THEREOF
WO2008090554A2 (en) * 2007-01-22 2008-07-31 Elutex Ltd. Modified conductive surfaces prepared by electrografting of diazonium salts
FR2929137B1 (fr) * 2008-03-28 2011-03-11 Commissariat Energie Atomique Procede d'electrogreffage localise sur des substrats conducteurs ou semi-conducteurs en presence d'une microelectrode
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
EP2412212A1 (en) 2009-03-26 2012-02-01 Shocking Technologies Inc Components having voltage switchable dielectric materials
FR2954326B1 (fr) * 2009-12-23 2013-01-18 Valois Sas Procede de traitement de surface d'un dispositif de distribution de produit fluide.
FR2954330B1 (fr) * 2009-12-23 2013-01-04 Valois Sas Procede de traitement de surface d'un dispositif de distribution de produit fluide.
US20110162701A1 (en) * 2010-01-03 2011-07-07 Claudio Truzzi Photovoltaic Cells
US20110192462A1 (en) * 2010-01-03 2011-08-11 Alchimer, S.A. Solar cells
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US9320135B2 (en) 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US9224728B2 (en) 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
US8647535B2 (en) 2011-01-07 2014-02-11 International Business Machines Corporation Conductive metal and diffusion barrier seed compositions, and methods of use in semiconductor and interlevel dielectric substrates
CN103536971A (zh) * 2012-07-12 2014-01-29 赛诺医疗科学技术有限公司 药物可控释放的药物洗脱医疗器械及其制备方法
FR3014116A1 (fr) * 2013-12-04 2015-06-05 Commissariat Energie Atomique Primaire d'adherence pour peinture
US11097986B2 (en) 2015-05-29 2021-08-24 Raytheon Technologies Corporation Preceramic ionic systems
WO2019202067A1 (en) * 2018-04-20 2019-10-24 Aveni Method for temporary or permanent wafer bonding
US11121302B2 (en) 2018-10-11 2021-09-14 SeeQC, Inc. System and method for superconducting multi-chip module
CN111893534A (zh) * 2020-06-13 2020-11-06 郑州大学 一种生物镁合金表面聚己内酯涂层的制备方法

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Also Published As

Publication number Publication date
FR2843756A1 (fr) 2004-02-27
AU2009213012A1 (en) 2009-10-08
EP1532197B1 (fr) 2012-06-13
US20050255631A1 (en) 2005-11-17
JP4339253B2 (ja) 2009-10-07
CA2496118A1 (fr) 2004-03-04
EP1532197A2 (fr) 2005-05-25
ES2389468T3 (es) 2012-10-26
FR2843756B1 (fr) 2005-04-22
WO2004018548A3 (fr) 2004-04-08
BRPI0314404B1 (pt) 2016-09-27
CA2496118C (fr) 2012-09-25
AU2009213012B2 (en) 2011-04-28
JP2005536601A (ja) 2005-12-02
AU2003282208A1 (en) 2004-03-11
US7605050B2 (en) 2009-10-20
WO2004018548A2 (fr) 2004-03-04

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Legal Events

Date Code Title Description
B25G Requested change of headquarter approved

Owner name: COMMISSARIAT A L'ENERGIE ATOMIQUE (FR) , ALCHIMER

Free format text: ALTERADA A SEDE DO TITULAR CONFORME REQUERIDO NA PETICAO NO 009090/SP DE 20/05/2005.

B07D Technical examination (opinion) related to article 229 of industrial property law [chapter 7.4 patent gazette]
B07G Grant request does not fulfill article 229-c lpi (prior consent of anvisa) [chapter 7.7 patent gazette]

Free format text: NOTIFICACAO DE DEVOLUCAO DO PEDIDO POR NAO SE ENQUADRAR NO ART. 229-C DA LPI.

B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 27/09/2016, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 21A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2789 DE 18-06-2024 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.