BR0309043A - Blindagem de interferência eletromagnética (emi) de nìvel de placa - Google Patents
Blindagem de interferência eletromagnética (emi) de nìvel de placaInfo
- Publication number
- BR0309043A BR0309043A BR0309043-4A BR0309043A BR0309043A BR 0309043 A BR0309043 A BR 0309043A BR 0309043 A BR0309043 A BR 0309043A BR 0309043 A BR0309043 A BR 0309043A
- Authority
- BR
- Brazil
- Prior art keywords
- emi
- shield
- electromagnetic interference
- electrically conductive
- level electromagnetic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
- H05K9/0028—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
- H05K9/0035—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids with retainers mounted beforehand on the PCB, e.g. clips
-
- H10W42/20—
-
- H10W72/07251—
-
- H10W72/20—
-
- H10W72/877—
-
- H10W90/724—
-
- H10W90/736—
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
- Water Treatment By Sorption (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
Abstract
"BLINDAGEM DE INTERFERêNCIA ELETROMAGNéTICA (EMI) DE NìVEL DE PLACA". Um substrato (10) tendo pelo menos um componente elétrico (11) disposto no mesmo; uma pluralidade de unidades prendedoras condutivas eletricamente distintas (14) dispostas em um padrão no referido substrato que circunda o pelo menos um componente elétrico; uma blindagem de interferência eletromagnética (EMI) de nível de placa (20) compreendendo uma camada eletricamente condutiva (26); uma pluralidade de aberturas (23) formadas na blindagem de EMI de nivel de placa (20), tal que referidas aberturas (23) correspondem ao modelo das unidades prendedoras eletricamente condutivas (14); com pelo menos um material de interface termicamente condutivo (TCI) (4) disposto sobre pelo menos um componente elétrico; e no qual a camada eletricamente condutiva (26) da blindagem de EMI de nível de placa está em contato elétrico com pelo menos uma unidade prendedora eletricamente condutiva.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/120,251 US6744640B2 (en) | 2002-04-10 | 2002-04-10 | Board-level EMI shield with enhanced thermal dissipation |
| PCT/US2003/007507 WO2003088729A1 (en) | 2002-04-10 | 2003-03-11 | Board-level emi shield with enhanced thermal dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR0309043A true BR0309043A (pt) | 2005-02-01 |
Family
ID=28790069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR0309043-4A BR0309043A (pt) | 2002-04-10 | 2003-03-11 | Blindagem de interferência eletromagnética (emi) de nìvel de placa |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US6744640B2 (pt) |
| EP (1) | EP1493314B1 (pt) |
| JP (1) | JP4317033B2 (pt) |
| KR (1) | KR100590662B1 (pt) |
| CN (1) | CN100438737C (pt) |
| AT (1) | ATE343316T1 (pt) |
| AU (1) | AU2003213838B2 (pt) |
| BR (1) | BR0309043A (pt) |
| CA (1) | CA2481842C (pt) |
| DE (1) | DE60309150T2 (pt) |
| IL (1) | IL164453A (pt) |
| MX (1) | MXPA04009895A (pt) |
| NO (1) | NO336280B1 (pt) |
| WO (1) | WO2003088729A1 (pt) |
Families Citing this family (125)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020120580A1 (en) * | 2001-02-23 | 2002-08-29 | Mayes Robert C. | Secure data transfer apparatus and method |
| US7259969B2 (en) * | 2003-02-26 | 2007-08-21 | Wavezero, Inc. | Methods and devices for connecting and grounding an EMI shield to a printed circuit board |
| CN1810068A (zh) * | 2003-06-19 | 2006-07-26 | 波零公司 | 印刷电路板的emi吸收屏蔽 |
| US7106588B2 (en) * | 2003-10-27 | 2006-09-12 | Delphi Technologies, Inc. | Power electronic system with passive cooling |
| KR100652621B1 (ko) * | 2003-11-21 | 2006-12-06 | 엘지전자 주식회사 | 휴대용 단말기의 방열장치 |
| WO2005059995A2 (en) * | 2003-12-18 | 2005-06-30 | Rf Module And Optical Design Limited | Semiconductor package with integrated heatsink and electromagnetic shield |
| US20050231932A1 (en) * | 2004-04-15 | 2005-10-20 | Motorola, Inc. | Reinforcement for substrate assemblies |
| US20060002099A1 (en) * | 2004-06-30 | 2006-01-05 | Stoneham Edward B | Electromagnetic shield assembly |
| US7813145B2 (en) * | 2004-06-30 | 2010-10-12 | Endwave Corporation | Circuit structure with multifunction circuit cover |
| US7190053B2 (en) * | 2004-09-16 | 2007-03-13 | Rosemount Inc. | Field device incorporating circuit card assembly as environmental and EMI/RFI shield |
| US20060082986A1 (en) * | 2004-10-14 | 2006-04-20 | Chen Chi H | Housing for memory card |
| US7254034B2 (en) * | 2004-12-15 | 2007-08-07 | Lucent Technologies Inc. | Thermal management for shielded circuit packs |
| US7273357B2 (en) * | 2005-08-10 | 2007-09-25 | Mitsubishi Heavy Industries, Ltd. | Control device for electric compressor |
| TWI286921B (en) * | 2005-09-09 | 2007-09-11 | Quanta Comp Inc | Apparatus for minimizing electromagnetic interference and manufacturing method thereof |
| US7491899B2 (en) * | 2005-10-06 | 2009-02-17 | Laird Technologies, Inc. | EMI shields and related manufacturing methods |
| US20070090533A1 (en) * | 2005-10-24 | 2007-04-26 | Texas Instruments Incorporated | Closed loop thermally enhanced flip chip BGA |
| US7595468B2 (en) * | 2005-11-07 | 2009-09-29 | Intel Corporation | Passive thermal solution for hand-held devices |
| US7287432B2 (en) * | 2005-11-17 | 2007-10-30 | Rosemount Inc. | Process transmitter with overpressure vent |
| US20080080160A1 (en) * | 2005-12-16 | 2008-04-03 | Laird Technologies, Inc. | Emi shielding assemblies |
| USD549706S1 (en) | 2005-12-16 | 2007-08-28 | Laird Technologies, Inc. | Frame for an EMI shield assembly |
| US7262369B1 (en) * | 2006-03-09 | 2007-08-28 | Laird Technologies, Inc. | Combined board level EMI shielding and thermal management |
| USD548738S1 (en) | 2005-12-16 | 2007-08-14 | Laird Technologies, Inc. | EMI shield assembly |
| USD549231S1 (en) | 2005-12-16 | 2007-08-21 | Laird Technologies, Inc. | Cover for an EMI shield assembly |
| JP2007194830A (ja) * | 2006-01-18 | 2007-08-02 | Mitsumi Electric Co Ltd | チューナモジュール |
| US7623360B2 (en) | 2006-03-09 | 2009-11-24 | Laird Technologies, Inc. | EMI shielding and thermal management assemblies including frames and covers with multi-position latching |
| US7317618B2 (en) * | 2006-03-09 | 2008-01-08 | Laird Technologies, Inc. | Combined board level shielding and thermal management |
| US7463496B2 (en) * | 2006-03-09 | 2008-12-09 | Laird Technologies, Inc. | Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith |
| WO2007113079A1 (de) * | 2006-03-31 | 2007-10-11 | Siemens Home And Office Communication Devices Gmbh & Co. Kg | Kühlkörper und dessen verwendung als kühl- und abschirmvorrichtung |
| US7138584B1 (en) * | 2006-04-07 | 2006-11-21 | Lotes Co., Ltd. | Electrical connector |
| US9713258B2 (en) | 2006-04-27 | 2017-07-18 | International Business Machines Corporation | Integrated circuit chip packaging |
| US20080002384A1 (en) * | 2006-06-30 | 2008-01-03 | Motorola, Inc. | Apparatus for providing radio frequency shielding and heat dissipation for electronic components |
| TWI316748B (en) | 2006-07-17 | 2009-11-01 | Via Tech Inc | Cooling module against esd and electronic package, assembly, and system using the same |
| CN100468725C (zh) * | 2006-07-25 | 2009-03-11 | 威盛电子股份有限公司 | 抗静电放电的散热模块和其系统 |
| US20080115967A1 (en) * | 2006-11-22 | 2008-05-22 | Giboney Kirk S | Shield For A Microwave Circuit Module |
| US8081484B2 (en) | 2006-11-30 | 2011-12-20 | Cisco Technology, Inc. | Method and apparatus for supporting a computer chip on a printed circuit board assembly |
| KR101422249B1 (ko) * | 2007-03-09 | 2014-08-13 | 삼성전자주식회사 | 소자 방열 장치 |
| CN201104378Y (zh) * | 2007-04-04 | 2008-08-20 | 华为技术有限公司 | 屏蔽和散热装置 |
| JP4508214B2 (ja) * | 2007-05-23 | 2010-07-21 | ソニー株式会社 | 表示装置 |
| US20080310114A1 (en) * | 2007-06-18 | 2008-12-18 | Lucent Technologies Inc. | Heat-transfer device for an electromagnetic interference (emi) shield using conductive bristles |
| US20090002949A1 (en) * | 2007-06-29 | 2009-01-01 | Lucent Technologies Inc. | Heat transfer for electronic component via an electromagnetic interference (emi) shield having shield deformation |
| US20090027859A1 (en) * | 2007-07-26 | 2009-01-29 | Giacoma Lawrence M | Surface mounted heat sink and electromagnetic shield |
| US7504592B1 (en) | 2007-08-31 | 2009-03-17 | Laird Technologies, Inc. | Electromagnetic interference shields and related manufacturing methods |
| US20090091888A1 (en) * | 2007-10-09 | 2009-04-09 | Chao-Chun Lin | Emi shielding and heat dissipating structure |
| US20090243012A1 (en) * | 2008-03-28 | 2009-10-01 | Micron Technology, Inc. | Electromagnetic interference shield structures for semiconductor components |
| TWI382519B (zh) * | 2008-04-21 | 2013-01-11 | 日月光半導體製造股份有限公司 | 利用外蓋之電子元件封裝模組 |
| US7928326B2 (en) * | 2009-02-27 | 2011-04-19 | Hewlett-Packard Development Company, L.P. | Thermoformed EMI shield |
| US7952881B2 (en) * | 2009-03-31 | 2011-05-31 | Motorola Solutions, Inc. | Thermal-electrical assembly for a portable communication device |
| JP4842346B2 (ja) * | 2009-04-21 | 2011-12-21 | シャープ株式会社 | 電子部品モジュールおよびその製造方法 |
| JP5322282B2 (ja) * | 2009-04-24 | 2013-10-23 | Necエンジニアリング株式会社 | 電子機器の放熱装置 |
| US7965514B2 (en) | 2009-06-05 | 2011-06-21 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
| US8477499B2 (en) | 2009-06-05 | 2013-07-02 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
| DE102009033258B4 (de) * | 2009-07-14 | 2019-01-10 | Sew-Eurodrive Gmbh & Co Kg | Gehäuse |
| JP2011054640A (ja) * | 2009-08-31 | 2011-03-17 | Funai Electric Co Ltd | シールドパッケージ基板 |
| FR2951048A1 (fr) * | 2009-10-07 | 2011-04-08 | Valeo Vision | Module de commande electronique pour un dispositif d'eclairage et/ou signalisation de vehicule |
| JP5593714B2 (ja) * | 2010-01-29 | 2014-09-24 | 富士通株式会社 | 電子素子のシールド構造及びこれを備えた電子装置 |
| FR2957192B1 (fr) * | 2010-03-03 | 2013-10-25 | Hispano Suiza Sa | Module electronique de puissance pour un actionneur pour aeronef |
| DE102010036910A1 (de) * | 2010-08-08 | 2012-02-09 | Ssb Wind Systems Gmbh & Co. Kg | Elektrische Vorrichtung |
| US20120061135A1 (en) * | 2010-09-14 | 2012-03-15 | Laird Technologies, Inc. | Compliant multilayered thermally-conductive interface assemblies having emi shielding properties |
| KR20120045893A (ko) * | 2010-11-01 | 2012-05-09 | 삼성전기주식회사 | 반도체 패키지 모듈 |
| TW201225752A (en) * | 2010-12-10 | 2012-06-16 | Askey Computer Corp | Printed circuit board grounding structure for use with communication apparatus |
| US8513541B2 (en) | 2011-01-21 | 2013-08-20 | Remy Technologies, L.L.C. | Method of blocking electro-magnetic interference (EMI) in an electric machine and apparatus |
| US8637981B2 (en) * | 2011-03-30 | 2014-01-28 | International Rectifier Corporation | Dual compartment semiconductor package with temperature sensor |
| EP2685797B1 (en) * | 2011-05-06 | 2017-12-13 | Huawei Device Co., Ltd. | Composite material and electron device |
| US20130014983A1 (en) * | 2011-07-14 | 2013-01-17 | Texas Instruments Incorporated | Device contactor with integrated rf shield |
| CN103124484B (zh) * | 2011-11-21 | 2017-01-25 | 富泰华工业(深圳)有限公司 | 电子设备 |
| US9516795B2 (en) * | 2012-01-10 | 2016-12-06 | Brocade Communications Systems, Inc | Printed circuit board cover |
| JP5652453B2 (ja) | 2012-09-28 | 2015-01-14 | 株式会社村田製作所 | 複合モジュールおよびこれを備えた電子機器 |
| JP6127429B2 (ja) * | 2012-09-28 | 2017-05-17 | 富士通株式会社 | 冷却装置及び電子装置 |
| CN104813758B (zh) * | 2012-11-21 | 2018-01-05 | 株式会社钟化 | 散热结构体 |
| US9554486B2 (en) * | 2013-02-22 | 2017-01-24 | Xcerra Corporation | Heat dissipation system |
| US9411385B2 (en) * | 2013-05-13 | 2016-08-09 | Google Technology Holdings LLC | Electronic device assembly with compression gasket |
| US9252512B2 (en) | 2013-08-14 | 2016-02-02 | Hamilton Sundstrand Corporation | Power connector having enhanced thermal conduction characteristics |
| TWI533793B (zh) * | 2013-10-25 | 2016-05-11 | 緯創資通股份有限公司 | 電子裝置及其電磁波屏蔽模組 |
| CN203722975U (zh) * | 2013-11-19 | 2014-07-16 | 中兴通讯股份有限公司 | 一种移动终端散热装置和屏蔽罩架 |
| BR112016016041A2 (pt) * | 2014-01-08 | 2021-08-17 | Interdigital Ce Patent Holdings | blindagem de sintonizador de rf de altura dupla |
| KR102334326B1 (ko) * | 2014-02-24 | 2021-12-02 | 삼성전자주식회사 | 하드웨어 쉴드 장치 및 이를 포함하는 전자 장치 |
| CN107079609B (zh) * | 2014-02-24 | 2020-04-07 | 三星电子株式会社 | 硬件屏蔽设备以及包括硬件屏蔽设备的电子设备 |
| US10103087B2 (en) * | 2014-03-18 | 2018-10-16 | Huawei Device (Dongguan) Co., Ltd. | Heat dissipation assembly and electronic device |
| JP6402421B2 (ja) * | 2014-03-25 | 2018-10-10 | 北川工業株式会社 | 電磁波シールド部材、及び電磁波シールド構造 |
| KR101941024B1 (ko) * | 2014-03-27 | 2019-01-22 | 삼성전자주식회사 | 쉴드 캔 조립체 및 그것을 갖는 전자 장치 |
| US9420734B2 (en) * | 2014-04-01 | 2016-08-16 | Advanced Micro Devices, Inc. | Combined electromagnetic shield and thermal management device |
| CN104979678B (zh) * | 2014-04-10 | 2018-04-17 | 泰科电子(上海)有限公司 | 连接器壳体组件和具有其的连接器 |
| US20170181335A1 (en) * | 2014-09-30 | 2017-06-22 | Panasomic Intellectual Property Management Co., Ltd. | Shield cover and electronic apparatus |
| KR102286337B1 (ko) * | 2014-10-17 | 2021-08-04 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전자파 차폐 구조물과 방열패드 및 이들을 포함하는 전자회로기판 조립체 |
| KR102340828B1 (ko) * | 2014-10-23 | 2021-12-17 | 삼성전자주식회사 | 인쇄회로기판 어셈블리 제조 방법 |
| US9224672B1 (en) | 2014-12-17 | 2015-12-29 | Microsoft Technology Licensing, Llc | Thermal management of electronic components |
| US9635789B2 (en) | 2015-01-30 | 2017-04-25 | Laird Technologies, Inc. | Board level electromagnetic interference (EMI) shields with increased under-shield space |
| KR102413323B1 (ko) * | 2015-02-06 | 2022-06-27 | 엘지전자 주식회사 | 이동 단말기 |
| JP6418041B2 (ja) * | 2015-04-06 | 2018-11-07 | 株式会社デンソー | 電子制御装置 |
| US20160309577A1 (en) | 2015-04-14 | 2016-10-20 | Laird Technologies, Inc. | Circuit assemblies and related methods |
| EP3295778B1 (en) | 2015-05-11 | 2020-01-29 | Laird Technologies, Inc. | Board level shields with adjustable covers |
| US9968004B2 (en) * | 2015-09-25 | 2018-05-08 | Laird Technologies, Inc. | Thermal interface materials including electrically-conductive material |
| JP2017069278A (ja) * | 2015-09-28 | 2017-04-06 | 積水化学工業株式会社 | 発泡複合シート、多層発泡複合シート、及びこれらの製造方法 |
| EP3348124B1 (en) * | 2015-10-16 | 2021-05-26 | Laird Technologies, Inc. | Thermally-conductive electromagnetic interference (emi) absorbers positioned or positionable between board level shields and heat sinks |
| US9788413B2 (en) * | 2015-11-09 | 2017-10-10 | Motorola Solutions, Inc. | Electromagnetic interference shielding assembly and method of providing electromagnetic interference shielding |
| US20170181266A1 (en) * | 2015-12-22 | 2017-06-22 | Thomson Licensing | Electronic circuit board shielding with open window heat transfer path |
| US9823718B2 (en) * | 2016-01-13 | 2017-11-21 | Microsoft Technology Licensing, Llc | Device cooling |
| KR102583890B1 (ko) | 2016-02-18 | 2023-10-05 | 삼성전자주식회사 | 열 수집/확산 구조를 가진 전자 장치 |
| JPWO2017159531A1 (ja) * | 2016-03-16 | 2018-12-13 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器 |
| US10327332B2 (en) | 2016-10-06 | 2019-06-18 | Microsoft Technology Licensing, Llc | Connecting a flexible circuit to other structures |
| US10687447B2 (en) | 2016-10-14 | 2020-06-16 | Laird Technologies, Inc. | Methods of applying thermal interface materials to board level shields |
| JP6363687B2 (ja) * | 2016-12-26 | 2018-07-25 | デクセリアルズ株式会社 | 半導体装置 |
| KR102398672B1 (ko) * | 2017-05-18 | 2022-05-17 | 삼성전자주식회사 | 방열구조를 포함하는 전자 장치 |
| WO2019014439A1 (en) * | 2017-07-12 | 2019-01-17 | Laird Technologies, Inc. | ASSEMBLIES COMPRISING CARD LEVEL PROTECTIONS AND THERMAL INTERFACE MATERIALS |
| US10561041B2 (en) * | 2017-10-18 | 2020-02-11 | Pimems, Inc. | Titanium thermal module |
| US10893637B2 (en) | 2018-02-21 | 2021-01-12 | Samsung Electronics Co., Ltd. | Electronic device including shield member for shielding at least part of magnetic force generated by magnetic substance and connection portion including property of nonmagnetic substance connected to shield member |
| CN108200752A (zh) * | 2018-03-05 | 2018-06-22 | 昇业科技股份有限公司 | 具防emi遮蔽结构的散热装置 |
| JP7213621B2 (ja) * | 2018-04-04 | 2023-01-27 | デクセリアルズ株式会社 | 半導体装置 |
| JP7107766B2 (ja) * | 2018-06-26 | 2022-07-27 | デクセリアルズ株式会社 | 電子機器 |
| JP6379319B1 (ja) * | 2018-06-28 | 2018-08-22 | デクセリアルズ株式会社 | 半導体装置 |
| KR102620179B1 (ko) * | 2018-07-24 | 2024-01-03 | 삼성전자주식회사 | 방열 구조를 갖는 전자 장치 |
| TWI674835B (zh) * | 2018-08-14 | 2019-10-11 | 健鼎科技股份有限公司 | 印刷電路板及其製造方法 |
| TWI674825B (zh) * | 2018-08-14 | 2019-10-11 | 健鼎科技股份有限公司 | 印刷電路板及其製造方法 |
| JP7345088B2 (ja) * | 2019-02-08 | 2023-09-15 | パナソニックIpマネジメント株式会社 | 熱伝導シートおよびこれを用いた電子機器 |
| JP7381219B2 (ja) * | 2019-04-23 | 2023-11-15 | 日立Astemo株式会社 | 電子制御装置 |
| JP7253048B2 (ja) * | 2019-05-23 | 2023-04-05 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器 |
| KR102651418B1 (ko) | 2019-07-25 | 2024-03-27 | 삼성전자 주식회사 | 차폐 시트 및 방열 부재를 포함하는 전자 장치 |
| US10674646B1 (en) * | 2019-10-25 | 2020-06-02 | Aliner Industries Inc. | EMI shield with increased heat dissipating effect |
| KR102885259B1 (ko) * | 2020-07-31 | 2025-11-14 | 삼성전자주식회사 | 차폐 및 방열 구조를 포함하는 전자 장치 |
| US11435795B1 (en) * | 2021-04-14 | 2022-09-06 | Dell Products L.P. | EMI shield system and method for hyperbaric fan cooling systems |
| KR102896365B1 (ko) * | 2021-06-09 | 2025-12-05 | 삼성전자 주식회사 | 열 방출 구조를 포함하는 전자 장치 |
| US12022640B1 (en) * | 2021-11-09 | 2024-06-25 | Cisco Technology, Inc. | Multi-column graphite-over-foam assembly |
| CN114206090B (zh) * | 2021-11-30 | 2024-04-16 | 四川天邑康和通信股份有限公司 | 一种能够有效解决pon/全光网关发热和屏蔽信号互绕的方法 |
| CN120814345A (zh) * | 2023-03-20 | 2025-10-17 | 高通股份有限公司 | 包括包含填充有热界面材料的多个开口的屏蔽层的设备 |
| DE102024206796B3 (de) * | 2024-07-18 | 2025-10-30 | Schaeffler Technologies AG & Co. KG | Gehäuseelement für elektronische Komponenten und Anordnung |
Family Cites Families (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5148266A (en) | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies having interposer and flexible lead |
| US5148265A (en) | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies with fan-in leads |
| US5153379A (en) | 1990-10-09 | 1992-10-06 | Motorola, Inc. | Shielded low-profile electronic component assembly |
| US5175613A (en) | 1991-01-18 | 1992-12-29 | Digital Equipment Corporation | Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips |
| CA2084499C (en) | 1992-02-12 | 1998-11-03 | William F. Weber | Emi shield apparatus and methods |
| US5485037A (en) * | 1993-04-12 | 1996-01-16 | Amkor Electronics, Inc. | Semiconductor device having a thermal dissipator and electromagnetic shielding |
| US5355016A (en) | 1993-05-03 | 1994-10-11 | Motorola, Inc. | Shielded EPROM package |
| US5367434A (en) | 1993-05-06 | 1994-11-22 | Motorola, Inc. | Electrical module assembly |
| US5591941A (en) | 1993-10-28 | 1997-01-07 | International Business Machines Corporation | Solder ball interconnected assembly |
| US5436803A (en) | 1993-12-16 | 1995-07-25 | Schlegel Corporation | Emi shielding having flexible conductive envelope |
| KR970005712B1 (ko) * | 1994-01-11 | 1997-04-19 | 삼성전자 주식회사 | 고 열방출용 반도체 패키지 |
| GB2288286A (en) | 1994-03-30 | 1995-10-11 | Plessey Semiconductors Ltd | Ball grid array arrangement |
| US5802699A (en) | 1994-06-07 | 1998-09-08 | Tessera, Inc. | Methods of assembling microelectronic assembly with socket for engaging bump leads |
| US5632631A (en) | 1994-06-07 | 1997-05-27 | Tessera, Inc. | Microelectronic contacts with asperities and methods of making same |
| US5615824A (en) | 1994-06-07 | 1997-04-01 | Tessera, Inc. | Soldering with resilient contacts |
| US5495399A (en) | 1994-07-05 | 1996-02-27 | Motorola, Inc. | Shield with detachable grasp support member |
| US5572070A (en) * | 1995-02-06 | 1996-11-05 | Rjr Polymers, Inc. | Integrated circuit packages with heat dissipation for high current load |
| GB2297868B (en) | 1995-02-07 | 1999-04-28 | Nokia Mobile Phones Ltd | A shielding device |
| US5597979A (en) | 1995-05-12 | 1997-01-28 | Schlegel Corporation | EMI shielding having flexible condustive sheet and I/O Gasket |
| JP3123638B2 (ja) | 1995-09-25 | 2001-01-15 | 株式会社三井ハイテック | 半導体装置 |
| US6058018A (en) | 1996-04-05 | 2000-05-02 | Berg Technology, Inc. | Electronic card |
| US5748455A (en) | 1996-04-23 | 1998-05-05 | Ericsson, Inc. | Electromagnetic shield for a radiotelephone |
| US5759047A (en) | 1996-05-24 | 1998-06-02 | International Business Machines Corporation | Flexible circuitized interposer with apertured member and method for making same |
| US5744759A (en) | 1996-05-29 | 1998-04-28 | International Business Machines Corporation | Circuit boards that can accept a pluggable tab module that can be attached or removed without solder |
| US5838551A (en) | 1996-08-01 | 1998-11-17 | Northern Telecom Limited | Electronic package carrying an electronic component and assembly of mother board and electronic package |
| SE507255C2 (sv) | 1996-08-22 | 1998-05-04 | Ericsson Telefon Ab L M | Skärmskydd |
| US5956576A (en) * | 1996-09-13 | 1999-09-21 | International Business Machines Corporation | Enhanced protection of semiconductors with dual surface seal |
| US5892245A (en) | 1996-11-11 | 1999-04-06 | Emulation Technology, Inc. | Ball grid array package emulator |
| US5787580A (en) | 1996-11-19 | 1998-08-04 | Lg Information & Communications, Ltd. | Method for making radio-frequency module by ball grid array package |
| SE511926C2 (sv) | 1997-04-16 | 1999-12-20 | Ericsson Telefon Ab L M | Skärmningshölje jämte förfarande för framställning och användning av ett skärmningshölje samt mobiltelefon med skärmningshölje |
| GB2324649A (en) | 1997-04-16 | 1998-10-28 | Ibm | Shielded semiconductor package |
| US6034429A (en) | 1997-04-18 | 2000-03-07 | Amkor Technology, Inc. | Integrated circuit package |
| JPH118488A (ja) | 1997-05-29 | 1999-01-12 | Koninkl Philips Electron Nv | 電磁遮蔽スクリーン及びそのスクリーンを有する回路支持体 |
| DE29710640U1 (de) | 1997-06-18 | 1997-08-21 | Siemens AG, 80333 München | Schirmung |
| US6060659A (en) | 1997-07-29 | 2000-05-09 | Lucent Technologies Inc. | Electronic isolation shield and a method of determining the minimum number of securing points required on the shield to sufficiently secure the shield to a circuit board |
| US5990418A (en) * | 1997-07-29 | 1999-11-23 | International Business Machines Corporation | Hermetic CBGA/CCGA structure with thermal paste cooling |
| US6097964A (en) | 1997-09-04 | 2000-08-01 | Nokia Mobile Phones Limited | Navigation key for a handset |
| US5939784A (en) | 1997-09-09 | 1999-08-17 | Amkor Technology, Inc. | Shielded surface acoustical wave package |
| US6051781A (en) | 1997-09-24 | 2000-04-18 | Autosplice, Inc. | Surface mount electromagnetic frequency interference shield clip |
| US5953206A (en) * | 1997-10-15 | 1999-09-14 | Hewlett-Packard Company | Thermal dissipation and EMI shielding structure for notebook computers |
| JPH11162601A (ja) | 1997-11-27 | 1999-06-18 | Texas Instr Japan Ltd | ソケット |
| US6010340A (en) | 1998-03-04 | 2000-01-04 | Internatinal Business Machines Corporation | Solder column tip compliancy modification for use in a BGA socket connector |
| US6122167A (en) | 1998-06-02 | 2000-09-19 | Dell Usa, L.P. | Integrated hybrid cooling with EMI shielding for a portable computer |
| US6136131A (en) | 1998-06-02 | 2000-10-24 | Instrument Specialties Company, Inc. | Method of shielding and obtaining access to a component on a printed circuit board |
| US6027346A (en) | 1998-06-29 | 2000-02-22 | Xandex, Inc. | Membrane-supported contactor for semiconductor test |
| US5951305A (en) | 1998-07-09 | 1999-09-14 | Tessera, Inc. | Lidless socket and method of making same |
| US6126467A (en) | 1998-07-22 | 2000-10-03 | Enplas Corporation | Socket for electrical parts |
| US6137693A (en) | 1998-07-31 | 2000-10-24 | Agilent Technologies Inc. | High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding |
| US6037667A (en) | 1998-08-24 | 2000-03-14 | Micron Technology, Inc. | Socket assembly for use with solder ball |
| US6400018B2 (en) | 1998-08-27 | 2002-06-04 | 3M Innovative Properties Company | Via plug adapter |
| US6075255A (en) | 1998-09-14 | 2000-06-13 | Silicon Integrated Systems Company | Contactor system for a ball grid array device |
| EP1125329A1 (en) | 1998-10-14 | 2001-08-22 | Minnesota Mining And Manufacturing Company | Tape ball grid array with interconnected ground plane |
| US6347035B1 (en) | 1998-10-30 | 2002-02-12 | Fujitsu Limited | Low profile EMI shield with heat spreading plate |
| US6069407A (en) | 1998-11-18 | 2000-05-30 | Vlsi Technology, Inc. | BGA package using PCB and tape in a die-up configuration |
| US6097609A (en) | 1998-12-30 | 2000-08-01 | Intel Corporation | Direct BGA socket |
| US6178097B1 (en) | 1999-01-22 | 2001-01-23 | Dial Tool Industries, Inc. | RF shield having removable cover |
| US6075700A (en) * | 1999-02-02 | 2000-06-13 | Compaq Computer Corporation | Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures |
| US6157546A (en) | 1999-03-26 | 2000-12-05 | Ericsson Inc. | Shielding apparatus for electronic devices |
| US6095842A (en) | 1999-04-19 | 2000-08-01 | Hon Hai Precision Ind. Co., Ltd. | Contact with dual compliant pin sections used in a ZIF socket |
| US6195267B1 (en) | 1999-06-23 | 2001-02-27 | Ericsson Inc. | Gel structure for combined EMI shielding and thermal control of microelectronic assemblies |
| US6111761A (en) | 1999-08-23 | 2000-08-29 | Motorola, Inc. | Electronic assembly |
| US6487073B2 (en) | 1999-12-01 | 2002-11-26 | Cool Options, Inc. | Thermally conductive electronic device case |
| US6377475B1 (en) * | 2001-02-26 | 2002-04-23 | Gore Enterprise Holdings, Inc. | Removable electromagnetic interference shield |
-
2002
- 2002-04-10 US US10/120,251 patent/US6744640B2/en not_active Expired - Lifetime
-
2003
- 2003-03-11 JP JP2003585487A patent/JP4317033B2/ja not_active Expired - Fee Related
- 2003-03-11 EP EP03711531A patent/EP1493314B1/en not_active Expired - Lifetime
- 2003-03-11 DE DE60309150T patent/DE60309150T2/de not_active Expired - Lifetime
- 2003-03-11 KR KR1020047016038A patent/KR100590662B1/ko not_active Expired - Fee Related
- 2003-03-11 AU AU2003213838A patent/AU2003213838B2/en not_active Ceased
- 2003-03-11 WO PCT/US2003/007507 patent/WO2003088729A1/en not_active Ceased
- 2003-03-11 AT AT03711531T patent/ATE343316T1/de not_active IP Right Cessation
- 2003-03-11 CN CNB038133075A patent/CN100438737C/zh not_active Expired - Fee Related
- 2003-03-11 BR BR0309043-4A patent/BR0309043A/pt not_active Application Discontinuation
- 2003-03-11 MX MXPA04009895A patent/MXPA04009895A/es active IP Right Grant
- 2003-03-11 CA CA2481842A patent/CA2481842C/en not_active Expired - Fee Related
-
2004
- 2004-10-08 IL IL164453A patent/IL164453A/en not_active IP Right Cessation
- 2004-10-29 NO NO20044695A patent/NO336280B1/no not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE60309150D1 (de) | 2006-11-30 |
| KR20040099415A (ko) | 2004-11-26 |
| EP1493314B1 (en) | 2006-10-18 |
| IL164453A0 (en) | 2005-12-18 |
| US6744640B2 (en) | 2004-06-01 |
| CN1659942A (zh) | 2005-08-24 |
| JP4317033B2 (ja) | 2009-08-19 |
| CN100438737C (zh) | 2008-11-26 |
| US20030193794A1 (en) | 2003-10-16 |
| WO2003088729A1 (en) | 2003-10-23 |
| NO336280B1 (no) | 2015-07-06 |
| CA2481842C (en) | 2012-06-26 |
| DE60309150T2 (de) | 2007-08-30 |
| NO20044695L (no) | 2004-10-29 |
| AU2003213838B2 (en) | 2005-11-03 |
| EP1493314A1 (en) | 2005-01-05 |
| KR100590662B1 (ko) | 2006-06-19 |
| AU2003213838A1 (en) | 2003-10-27 |
| JP2006513556A (ja) | 2006-04-20 |
| ATE343316T1 (de) | 2006-11-15 |
| CA2481842A1 (en) | 2003-10-23 |
| MXPA04009895A (es) | 2004-12-07 |
| HK1068204A1 (en) | 2005-04-22 |
| IL164453A (en) | 2009-05-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| BR0309043A (pt) | Blindagem de interferência eletromagnética (emi) de nìvel de placa | |
| BR0207558A (pt) | Blindagem de interferência eletromagnética removìvel | |
| BR9808555A (pt) | Alojamento de blindagem elétrica, processo de sua produção, e, telefone celular. | |
| IT1244945B (it) | Schermo elettromagnetico per circuito elettrico. | |
| BRPI0601294B1 (pt) | conjunto de teclado e terminal portátil | |
| TW222037B (en) | Electronic card and connector assembly for use therewith | |
| ES2042949T3 (es) | Placa de circuito impreso. | |
| DE69119506D1 (de) | Leiterplatte mit EMI-Unterdrückung | |
| BR9714585A (pt) | Encaixes moldados para fixação de componente eletrônico | |
| DE60207989D1 (de) | Elektronische einrichtung | |
| BR0307364A (pt) | Método para embutir um componente em uma base e produzir um contato | |
| BR9916035A (pt) | Etiqueta, e, métodos para fabricar e para desativar a mesma | |
| KR910015078A (ko) | 고주파회로용 패키지 | |
| BR9813221A (pt) | Aparelho para acondicionar circuitos microeletrÈnicos, estação base de telefone celular e processo para fabricar uma estação base de telefone celular | |
| DE602004013357D1 (de) | Schaltungs-sicherheit | |
| ES2195856T3 (es) | Placa de circuitos impresos para señales electricas y opticas asi como procedimiento para su fabricacion. | |
| WO2002096124A3 (en) | Telecommunications chassis and card | |
| BR9813324A (pt) | Radiotelefone, e, conexão elétrica de interface de borda | |
| JPS6480094A (en) | Printed wiring board | |
| WO2002082877A3 (en) | Telecommunications chassis and card | |
| BR8003169A (pt) | Circuito de interface para um teclado eletronico em aparelhos telefonicos | |
| SE9600085D0 (sv) | Skärmning av elektroniska komponenter som plastinbakats direkt på kretskort | |
| JP3619719B2 (ja) | 電気機器の表示部 | |
| SE523463C2 (sv) | Anordning för fingeravtrycksläsning | |
| DE3867562D1 (de) | Gehaeuse fuer elektronische baugruppen mit auf einer gehaeuseflaeche angeordneten bedienelementen, insbesondere tastaturen. |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
| B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
| B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
| B09B | Patent application refused [chapter 9.2 patent gazette] |
Free format text: INDEFIRO O PEDIDO DE ACORDO COM ART. 8O COMBINADO COM ART. 13 DA LPI |
|
| B09B | Patent application refused [chapter 9.2 patent gazette] |
Free format text: MANTIDO O INDEFERIMENTO UMA VEZ QUE NAO FOI APRESENTADO RECURSO DENTRO DO PRAZO LEGAL. |