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BR0309043A - Blindagem de interferência eletromagnética (emi) de nìvel de placa - Google Patents

Blindagem de interferência eletromagnética (emi) de nìvel de placa

Info

Publication number
BR0309043A
BR0309043A BR0309043-4A BR0309043A BR0309043A BR 0309043 A BR0309043 A BR 0309043A BR 0309043 A BR0309043 A BR 0309043A BR 0309043 A BR0309043 A BR 0309043A
Authority
BR
Brazil
Prior art keywords
emi
shield
electromagnetic interference
electrically conductive
level electromagnetic
Prior art date
Application number
BR0309043-4A
Other languages
English (en)
Inventor
Bradley E Reis
William Candy
Original Assignee
Gore Enterprise Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gore Enterprise Holdings Inc filed Critical Gore Enterprise Holdings Inc
Publication of BR0309043A publication Critical patent/BR0309043A/pt

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H05K9/0028Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H05K9/0035Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids with retainers mounted beforehand on the PCB, e.g. clips
    • H10W42/20
    • H10W72/07251
    • H10W72/20
    • H10W72/877
    • H10W90/724
    • H10W90/736

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Water Treatment By Sorption (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)

Abstract

"BLINDAGEM DE INTERFERêNCIA ELETROMAGNéTICA (EMI) DE NìVEL DE PLACA". Um substrato (10) tendo pelo menos um componente elétrico (11) disposto no mesmo; uma pluralidade de unidades prendedoras condutivas eletricamente distintas (14) dispostas em um padrão no referido substrato que circunda o pelo menos um componente elétrico; uma blindagem de interferência eletromagnética (EMI) de nível de placa (20) compreendendo uma camada eletricamente condutiva (26); uma pluralidade de aberturas (23) formadas na blindagem de EMI de nivel de placa (20), tal que referidas aberturas (23) correspondem ao modelo das unidades prendedoras eletricamente condutivas (14); com pelo menos um material de interface termicamente condutivo (TCI) (4) disposto sobre pelo menos um componente elétrico; e no qual a camada eletricamente condutiva (26) da blindagem de EMI de nível de placa está em contato elétrico com pelo menos uma unidade prendedora eletricamente condutiva.
BR0309043-4A 2002-04-10 2003-03-11 Blindagem de interferência eletromagnética (emi) de nìvel de placa BR0309043A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/120,251 US6744640B2 (en) 2002-04-10 2002-04-10 Board-level EMI shield with enhanced thermal dissipation
PCT/US2003/007507 WO2003088729A1 (en) 2002-04-10 2003-03-11 Board-level emi shield with enhanced thermal dissipation

Publications (1)

Publication Number Publication Date
BR0309043A true BR0309043A (pt) 2005-02-01

Family

ID=28790069

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0309043-4A BR0309043A (pt) 2002-04-10 2003-03-11 Blindagem de interferência eletromagnética (emi) de nìvel de placa

Country Status (14)

Country Link
US (1) US6744640B2 (pt)
EP (1) EP1493314B1 (pt)
JP (1) JP4317033B2 (pt)
KR (1) KR100590662B1 (pt)
CN (1) CN100438737C (pt)
AT (1) ATE343316T1 (pt)
AU (1) AU2003213838B2 (pt)
BR (1) BR0309043A (pt)
CA (1) CA2481842C (pt)
DE (1) DE60309150T2 (pt)
IL (1) IL164453A (pt)
MX (1) MXPA04009895A (pt)
NO (1) NO336280B1 (pt)
WO (1) WO2003088729A1 (pt)

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DE60309150D1 (de) 2006-11-30
KR20040099415A (ko) 2004-11-26
EP1493314B1 (en) 2006-10-18
IL164453A0 (en) 2005-12-18
US6744640B2 (en) 2004-06-01
CN1659942A (zh) 2005-08-24
JP4317033B2 (ja) 2009-08-19
CN100438737C (zh) 2008-11-26
US20030193794A1 (en) 2003-10-16
WO2003088729A1 (en) 2003-10-23
NO336280B1 (no) 2015-07-06
CA2481842C (en) 2012-06-26
DE60309150T2 (de) 2007-08-30
NO20044695L (no) 2004-10-29
AU2003213838B2 (en) 2005-11-03
EP1493314A1 (en) 2005-01-05
KR100590662B1 (ko) 2006-06-19
AU2003213838A1 (en) 2003-10-27
JP2006513556A (ja) 2006-04-20
ATE343316T1 (de) 2006-11-15
CA2481842A1 (en) 2003-10-23
MXPA04009895A (es) 2004-12-07
HK1068204A1 (en) 2005-04-22
IL164453A (en) 2009-05-04

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