Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
  • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
  • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/12—Using specific substances
  • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
  • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
  • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
  • H05K3/061—Etching masks
  • H05K3/064—Photoresists
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
  • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane

Landscapes

• Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Spectroscopy & Molecular Physics (AREA)
• Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• General Physics & Mathematics (AREA)
• Polymerisation Methods In General (AREA)
• Manufacturing Of Printed Circuit Boards (AREA)
• Photosensitive Polymer And Photoresist Processing (AREA)
• Macromonomer-Based Addition Polymer (AREA)
• Laminated Bodies (AREA)
• Paints Or Removers (AREA)
• Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=22345895

Family Applications (1)

Country Status (23)

Families Citing this family (22)

Family Cites Families (6)

• 1972
  • 1972-01-18 ZA ZA720345A patent/ZA72345B/en unknown
  • 1972-01-25 NO NO177/72A patent/NO141804C/en unknown
  • 1972-01-27 AU AU38392/72A patent/AU461461B2/en not_active Expired
  • 1972-01-29 ES ES399317A patent/ES399317A1/en not_active Expired
  • 1972-01-31 FR FR7203150A patent/FR2124974A5/fr not_active Expired
  • 1972-01-31 IL IL38677A patent/IL38677A/en unknown
  • 1972-01-31 BE BE778729A patent/BE778729A/en not_active IP Right Cessation
  • 1972-02-01 SE SE7201145A patent/SE390218B/en unknown
  • 1972-02-01 RO RO7269624A patent/RO64896A/en unknown
  • 1972-02-01 CH CH142672A patent/CH592322A5/xx not_active IP Right Cessation
  • 1972-02-02 GB GB481472A patent/GB1361298A/en not_active Expired
  • 1972-02-02 FI FI271/72A patent/FI57429C/en active
  • 1972-02-02 JP JP1214572A patent/JPS5538961B1/ja active Pending
  • 1972-02-02 LU LU64712A patent/LU64712A1/xx unknown
  • 1972-02-02 CA CA133,755A patent/CA965291A/en not_active Expired
  • 1972-02-03 DE DE2205146A patent/DE2205146C2/en not_active Expired - Lifetime
  • 1972-02-03 IT IT67324/72A patent/IT949005B/en active
  • 1972-02-03 DK DK48172AA patent/DK142623B/en not_active IP Right Cessation
  • 1972-02-03 PL PL1972153265A patent/PL83391B1/pl unknown
  • 1972-02-04 BG BG019648A patent/BG26673A3/en unknown
  • 1972-02-04 NL NLAANVRAGE7201460,A patent/NL176021C/en not_active IP Right Cessation
  • 1972-12-08 DD DD167452A patent/DD101035A5/xx unknown
• 1973
  • 1973-01-03 DK DK1773A patent/DK144184C/en active
• 1982
  • 1982-06-24 HK HK283/82A patent/HK28382A/en unknown
  • 1982-11-26 JP JP57207462A patent/JPS58144824A/en active Granted

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