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BE768887A - PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE - Google Patents

PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE

Info

Publication number
BE768887A
BE768887A BE768887A BE768887A BE768887A BE 768887 A BE768887 A BE 768887A BE 768887 A BE768887 A BE 768887A BE 768887 A BE768887 A BE 768887A BE 768887 A BE768887 A BE 768887A
Authority
BE
Belgium
Prior art keywords
panels
manufacture
printed circuit
procede
ledit
Prior art date
Application number
BE768887A
Other languages
French (fr)
Inventor
H L Rhodenizer
J J Grunwald
W P Innes
Original Assignee
Macdermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Inc filed Critical Macdermid Inc
Priority to BE768887A priority Critical patent/BE768887A/en
Priority to DE2135384A priority patent/DE2135384C3/en
Publication of BE768887A publication Critical patent/BE768887A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
BE768887A 1971-06-23 1971-06-23 PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE BE768887A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
BE768887A BE768887A (en) 1971-06-23 1971-06-23 PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE
DE2135384A DE2135384C3 (en) 1971-06-23 1971-07-12 Process for the manufacture of printed circuit boards and the product manufactured by this process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE768887A BE768887A (en) 1971-06-23 1971-06-23 PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE
DE2135384A DE2135384C3 (en) 1971-06-23 1971-07-12 Process for the manufacture of printed circuit boards and the product manufactured by this process

Publications (1)

Publication Number Publication Date
BE768887A true BE768887A (en) 1971-11-03

Family

ID=25656911

Family Applications (1)

Application Number Title Priority Date Filing Date
BE768887A BE768887A (en) 1971-06-23 1971-06-23 PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT PANELS AND PANELS OBTAINED BY LEDIT PROCEDE

Country Status (2)

Country Link
BE (1) BE768887A (en)
DE (1) DE2135384C3 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1980000294A1 (en) * 1978-07-13 1980-02-21 Tokyo Shibaura Electric Co Method of fabricating printed circuits
EP0227857B1 (en) * 1985-12-30 1990-03-28 Ibm Deutschland Gmbh Process for making printed circuits
WO2018198981A1 (en) 2017-04-27 2018-11-01 Ａｇｃ株式会社 Antenna and mimo antenna

Also Published As

Publication number Publication date
DE2135384C3 (en) 1980-08-21
DE2135384B2 (en) 1979-12-13
DE2135384A1 (en) 1973-02-01

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