AU7746000A - Atmospheric process and system for controlled and rapid removal of polymers fromhigh depth to width aspect ratio holes - Google Patents

Atmospheric process and system for controlled and rapid removal of polymers fromhigh depth to width aspect ratio holes

Info

Publication number: AU7746000A
Authority: AU; Australia
Prior art keywords: fromhigh; polymers; depth; controlled; aspect ratio
Prior art date: 1999-09-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU77460/00A

Inventor

Lynn David Bollinger

Iskander Tokmouline

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Jetek Inc

Original Assignee

Jetek Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-09-28

Filing date

2000-09-28

Publication date

2001-04-30

2000-09-28 Application filed by Jetek Inc filed Critical Jetek Inc

2001-04-30 Publication of AU7746000A publication Critical patent/AU7746000A/en

Status Abandoned legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K10/00—Welding or cutting by means of a plasma
- B23K10/003—Scarfing, desurfacing or deburring
- H10P50/287—
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Plasma & Fusion (AREA)
Mechanical Engineering (AREA)
Drying Of Semiconductors (AREA)
Arc Welding In General (AREA)
Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

AU77460/00A 1999-09-28 2000-09-28 Atmospheric process and system for controlled and rapid removal of polymers fromhigh depth to width aspect ratio holes Abandoned AU7746000A (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US15640799P	1999-09-28	1999-09-28
US60156407		1999-09-28
PCT/US2000/027113 WO2001023130A1 (en)	1999-09-28	2000-09-28	Atmospheric process and system for controlled and rapid removal of polymers from high depth to width aspect ratio holes

Publications (1)

Publication Number	Publication Date
AU7746000A true AU7746000A (en)	2001-04-30

Family

ID=22559445

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU77460/00A Abandoned AU7746000A (en)	1999-09-28	2000-09-28	Atmospheric process and system for controlled and rapid removal of polymers fromhigh depth to width aspect ratio holes

Country Status (4)

Country	Link
EP (1)	EP1246710A4 (en)
JP (2)	JP2003510824A (en)
AU (1)	AU7746000A (en)
WO (1)	WO2001023130A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2001023130A1 (en) *	1999-09-28	2001-04-05	Jetek, Inc.	Atmospheric process and system for controlled and rapid removal of polymers from high depth to width aspect ratio holes
US6955991B2 (en) *	1999-11-01	2005-10-18	Jetek, Inc.	Atmospheric process and system for controlled and rapid removal of polymers from high depth to width aspect ratio holes
FR2913972B1 (en) *	2007-03-21	2011-11-18	Saint Gobain	METHOD FOR MANUFACTURING A MASK FOR CARRYING OUT A GRID
CN114864482A (en) *	2021-02-04	2022-08-05	中国科学院微电子研究所	Method for manufacturing semiconductor structure

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6159834A (en) *	1984-08-31	1986-03-27	Hitachi Ltd	Detecting method of end point of etching
US4783695A (en) *	1986-09-26	1988-11-08	General Electric Company	Multichip integrated circuit packaging configuration and method
US4891303A (en) *	1988-05-26	1990-01-02	Texas Instruments Incorporated	Trilayer microlithographic process using a silicon-based resist as the middle layer
US5173442A (en) *	1990-07-23	1992-12-22	Microelectronics And Computer Technology Corporation	Methods of forming channels and vias in insulating layers
US5314709A (en) *	1991-03-20	1994-05-24	International Business Machines Corporation	Unzippable polymer mask for screening operations
CA2097388A1 (en) *	1992-07-16	1994-01-17	Susan Nord Bohlke	Topographical selective patterns
JP2787646B2 (en) *	1992-11-27	1998-08-20	三菱電機株式会社	Method for manufacturing semiconductor device
US5302547A (en) *	1993-02-08	1994-04-12	General Electric Company	Systems for patterning dielectrics by laser ablation
JP3147137B2 (en) *	1993-05-14	2001-03-19	セイコーエプソン株式会社	Surface treatment method and device, semiconductor device manufacturing method and device, and liquid crystal display manufacturing method
JPH09246252A (en) *	1996-03-01	1997-09-19	Sony Corp	Semiconductor manufacturing apparatus and semiconductor manufacturing method
KR20000016136A (en) *	1996-05-31	2000-03-25	피터 무몰라	Method for treating articles with a plasma jet
WO1997046056A1 (en) *	1996-05-31	1997-12-04	Ipec Precision, Inc.	Apparatus for generating and deflecting a plasma jet
US5968283A (en) *	1996-10-25	1999-10-19	Lucent Technologies Inc.	Method for heat stripping optical fibers
WO2001023130A1 (en) *	1999-09-28	2001-04-05	Jetek, Inc.	Atmospheric process and system for controlled and rapid removal of polymers from high depth to width aspect ratio holes

2000
- 2000-09-28 WO PCT/US2000/027113 patent/WO2001023130A1/en not_active Ceased
- 2000-09-28 EP EP00967233A patent/EP1246710A4/en not_active Withdrawn
- 2000-09-28 AU AU77460/00A patent/AU7746000A/en not_active Abandoned
- 2000-09-28 JP JP2001526324A patent/JP2003510824A/en active Pending
2007
- 2007-02-26 JP JP2007045525A patent/JP2007235138A/en active Pending

Also Published As

Publication number	Publication date
JP2007235138A (en)	2007-09-13
WO2001023130A1 (en)	2001-04-05
JP2003510824A (en)	2003-03-18
EP1246710A1 (en)	2002-10-09
EP1246710A4 (en)	2007-07-04

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Legal Events

Date	Code	Title	Description
2002-06-06	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase