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AU7601974A - Heat-recoverable replaceable watch-glass for encapsulating semiconductor chips - Google Patents

Heat-recoverable replaceable watch-glass for encapsulating semiconductor chips

Info

Publication number
AU7601974A
AU7601974A AU76019/74A AU7601974A AU7601974A AU 7601974 A AU7601974 A AU 7601974A AU 76019/74 A AU76019/74 A AU 76019/74A AU 7601974 A AU7601974 A AU 7601974A AU 7601974 A AU7601974 A AU 7601974A
Authority
AU
Australia
Prior art keywords
recoverable
glass
heat
semiconductor chips
encapsulating semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU76019/74A
Other versions
AU502556B2 (en
Inventor
J. F Krumme
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raychem Corp
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/465,561 external-priority patent/US4126758A/en
Application filed by Raychem Corp filed Critical Raychem Corp
Publication of AU7601974A publication Critical patent/AU7601974A/en
Application granted granted Critical
Publication of AU502556B2 publication Critical patent/AU502556B2/en
Expired legal-status Critical Current

Links

Classifications

    • H10W76/157
    • H10W76/12
    • H10W95/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
AU76019/74A 1973-12-03 1974-12-03 Heat-recoverable replaceable watch-glass for encapsulating semiconductor chips Expired AU502556B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US42142973A 1973-12-03 1973-12-03
USUS421,429 1973-12-03
US05/465,561 US4126758A (en) 1973-12-03 1974-04-30 Method for sealing integrated circuit components with heat recoverable cap and resulting package
USUS465,561 1974-04-30

Publications (2)

Publication Number Publication Date
AU7601974A true AU7601974A (en) 1976-06-03
AU502556B2 AU502556B2 (en) 1979-08-02

Family

ID=27025234

Family Applications (1)

Application Number Title Priority Date Filing Date
AU76019/74A Expired AU502556B2 (en) 1973-12-03 1974-12-03 Heat-recoverable replaceable watch-glass for encapsulating semiconductor chips

Country Status (15)

Country Link
JP (1) JPS5842622B2 (en)
AT (1) ATA964874A (en)
AU (1) AU502556B2 (en)
BE (1) BE822904A (en)
CA (1) CA1042116A (en)
CH (1) CH580379A5 (en)
DE (1) DE2457116A1 (en)
ES (1) ES432527A1 (en)
FR (1) FR2253283B1 (en)
GB (1) GB1484177A (en)
HK (1) HK18478A (en)
IL (1) IL46173A (en)
IT (1) IT1033109B (en)
NL (1) NL7415764A (en)
SE (1) SE7415124L (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427884Y2 (en) * 1974-06-27 1979-09-08
JPS57175442U (en) * 1981-04-30 1982-11-05
JPS58100446A (en) * 1981-12-10 1983-06-15 Mitsubishi Electric Corp Vacuum sealing method
JPS60133741A (en) * 1983-12-21 1985-07-16 Fujitsu Ltd Semiconductor device and manufacture thereof
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing
JPH0793393B2 (en) * 1988-02-22 1995-10-09 株式会社東芝 Semiconductor device metal shell
FR2710810B1 (en) * 1993-09-29 1995-12-01 Sagem Waterproof micro-component housing and method of encapsulation in such a housing.

Also Published As

Publication number Publication date
CA1042116A (en) 1978-11-07
BE822904A (en) 1975-06-03
IL46173A0 (en) 1975-03-13
ES432527A1 (en) 1977-03-01
SE7415124L (en) 1975-06-04
NL7415764A (en) 1975-06-05
FR2253283A1 (en) 1975-06-27
CH580379A5 (en) 1976-09-30
JPS5087586A (en) 1975-07-14
HK18478A (en) 1978-04-14
DE2457116A1 (en) 1975-08-21
FR2253283B1 (en) 1979-08-10
IL46173A (en) 1977-08-31
GB1484177A (en) 1977-09-01
ATA964874A (en) 1980-04-15
JPS5842622B2 (en) 1983-09-21
IT1033109B (en) 1979-07-10
AU502556B2 (en) 1979-08-02

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