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AU7381594A - Method and device for magnetron sputtering - Google Patents

Method and device for magnetron sputtering

Info

Publication number
AU7381594A
AU7381594A AU73815/94A AU7381594A AU7381594A AU 7381594 A AU7381594 A AU 7381594A AU 73815/94 A AU73815/94 A AU 73815/94A AU 7381594 A AU7381594 A AU 7381594A AU 7381594 A AU7381594 A AU 7381594A
Authority
AU
Australia
Prior art keywords
magnetron sputtering
magnetron
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU73815/94A
Inventor
Stanislav Kadlec
Jindrich Musil
Antonin Rajsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fyzikalni Ustav AV CR VVI
Original Assignee
Institute of Physics of CAS
Fyzikalni Ustav AV CR VVI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CZ931542A external-priority patent/CZ154293A3/en
Priority claimed from CZ931820A external-priority patent/CZ281073B6/en
Application filed by Institute of Physics of CAS, Fyzikalni Ustav AV CR VVI filed Critical Institute of Physics of CAS
Publication of AU7381594A publication Critical patent/AU7381594A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3494—Adaptation to extreme pressure conditions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3458—Electromagnets in particular for cathodic sputtering apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Physical Vapour Deposition (AREA)
AU73815/94A 1993-07-29 1994-07-28 Method and device for magnetron sputtering Abandoned AU7381594A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CZ1542/93 1993-07-29
CZ931542A CZ154293A3 (en) 1993-07-29 1993-07-29 Process and apparatus for magnetron sputtering
CZ931820A CZ281073B6 (en) 1993-09-03 1993-09-03 Method of sputtering cathode material
CZ1820/93 1993-09-03
PCT/CZ1994/000017 WO1995004368A1 (en) 1993-07-29 1994-07-28 Method and device for magnetron sputtering

Publications (1)

Publication Number Publication Date
AU7381594A true AU7381594A (en) 1995-02-28

Family

ID=25746887

Family Applications (1)

Application Number Title Priority Date Filing Date
AU73815/94A Abandoned AU7381594A (en) 1993-07-29 1994-07-28 Method and device for magnetron sputtering

Country Status (2)

Country Link
AU (1) AU7381594A (en)
WO (1) WO1995004368A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10018143C5 (en) † 2000-04-12 2012-09-06 Oerlikon Trading Ag, Trübbach DLC layer system and method and apparatus for producing such a layer system
US7147759B2 (en) * 2002-09-30 2006-12-12 Zond, Inc. High-power pulsed magnetron sputtering
CN100596312C (en) * 2006-12-31 2010-03-31 中国科学院金属研究所 Magnetron sputtering device
DE112009001457T5 (en) 2008-06-11 2011-04-28 ULVAC, Inc., Chigasaki-shi Sputtering apparatus
JP5979034B2 (en) 2013-02-14 2016-08-24 三菱マテリアル株式会社 Sputtering target for protective film formation
JP5757318B2 (en) * 2013-11-06 2015-07-29 三菱マテリアル株式会社 Protective film forming sputtering target and laminated wiring film

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4865708A (en) * 1988-11-14 1989-09-12 Vac-Tec Systems, Inc. Magnetron sputtering cathode
CZ278295B6 (en) * 1989-08-14 1993-11-17 Fyzikalni Ustav Avcr Process of sputtering layers and apparatus for making the same
GB9108553D0 (en) * 1991-04-22 1991-06-05 Ion Coat Ltd Ionised vapour source

Also Published As

Publication number Publication date
WO1995004368A1 (en) 1995-02-09

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