[go: up one dir, main page]

AU7351781A - Ammonia-free electroless nickel plating bath - Google Patents

Ammonia-free electroless nickel plating bath

Info

Publication number
AU7351781A
AU7351781A AU73517/81A AU7351781A AU7351781A AU 7351781 A AU7351781 A AU 7351781A AU 73517/81 A AU73517/81 A AU 73517/81A AU 7351781 A AU7351781 A AU 7351781A AU 7351781 A AU7351781 A AU 7351781A
Authority
AU
Australia
Prior art keywords
ammonia
plating bath
nickel plating
electroless nickel
free electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU73517/81A
Inventor
Michael J. Aleksinas
Anthony J. Marczak
Eugene Yarkosky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Inc filed Critical Enthone Inc
Priority to AU73517/81A priority Critical patent/AU7351781A/en
Priority to GB08123255A priority patent/GB2106937A/en
Priority to FR8114981A priority patent/FR2510612A1/en
Priority to JP56122896A priority patent/JPS5827970A/en
Priority to BR8105075A priority patent/BR8105075A/en
Priority to DE19813131342 priority patent/DE3131342A1/en
Priority to IT49107/81A priority patent/IT1171462B/en
Publication of AU7351781A publication Critical patent/AU7351781A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
AU73517/81A 1981-07-28 1981-07-28 Ammonia-free electroless nickel plating bath Abandoned AU7351781A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
AU73517/81A AU7351781A (en) 1981-07-28 1981-07-28 Ammonia-free electroless nickel plating bath
GB08123255A GB2106937A (en) 1981-07-28 1981-07-28 Electroless nickel plating
FR8114981A FR2510612A1 (en) 1981-07-28 1981-07-31 NON-AMMONIA NON-ELECTROLYTIC NICKEL BATH AND METHOD FOR METALLIZING NON-CONDUCTORS
JP56122896A JPS5827970A (en) 1981-07-28 1981-08-05 Nickel non-electroplating method and bath
BR8105075A BR8105075A (en) 1981-07-28 1981-08-06 NIKELAGE BATH FREE OF AMMONIA, WITHOUT ELECTRICITY AND NON-CONDUCTIVE COATING PROCESS
DE19813131342 DE3131342A1 (en) 1981-07-28 1981-08-07 Ammonia-free electroless nickel-plating bath and method for nickel-plating dielectrics
IT49107/81A IT1171462B (en) 1981-07-28 1981-08-13 NICKEL PLATING BATH FOR REDUCTION WITH NO AMMONIA AND PROCEDURE FOR PLATING NON-CONDUCTIVE MATERIALS

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
AU73517/81A AU7351781A (en) 1981-07-28 1981-07-28 Ammonia-free electroless nickel plating bath
GB08123255A GB2106937A (en) 1981-07-28 1981-07-28 Electroless nickel plating
FR8114981A FR2510612A1 (en) 1981-07-28 1981-07-31 NON-AMMONIA NON-ELECTROLYTIC NICKEL BATH AND METHOD FOR METALLIZING NON-CONDUCTORS
JP56122896A JPS5827970A (en) 1981-07-28 1981-08-05 Nickel non-electroplating method and bath
BR8105075A BR8105075A (en) 1981-07-28 1981-08-06 NIKELAGE BATH FREE OF AMMONIA, WITHOUT ELECTRICITY AND NON-CONDUCTIVE COATING PROCESS
DE19813131342 DE3131342A1 (en) 1981-07-28 1981-08-07 Ammonia-free electroless nickel-plating bath and method for nickel-plating dielectrics
IT49107/81A IT1171462B (en) 1981-07-28 1981-08-13 NICKEL PLATING BATH FOR REDUCTION WITH NO AMMONIA AND PROCEDURE FOR PLATING NON-CONDUCTIVE MATERIALS

Publications (1)

Publication Number Publication Date
AU7351781A true AU7351781A (en) 1983-02-03

Family

ID=34199391

Family Applications (1)

Application Number Title Priority Date Filing Date
AU73517/81A Abandoned AU7351781A (en) 1981-07-28 1981-07-28 Ammonia-free electroless nickel plating bath

Country Status (7)

Country Link
JP (1) JPS5827970A (en)
AU (1) AU7351781A (en)
BR (1) BR8105075A (en)
DE (1) DE3131342A1 (en)
FR (1) FR2510612A1 (en)
GB (1) GB2106937A (en)
IT (1) IT1171462B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10437114B2 (en) 2015-12-01 2019-10-08 Japan Display Inc. Display device
CN113861614B (en) * 2021-09-29 2023-10-31 上海金发科技发展有限公司 ABS modified material with high electroplating binding force and preparation method and application thereof

Also Published As

Publication number Publication date
IT8149107A1 (en) 1983-02-13
GB2106937A (en) 1983-04-20
FR2510612A1 (en) 1983-02-04
IT8149107A0 (en) 1981-08-13
DE3131342A1 (en) 1983-02-24
BR8105075A (en) 1983-03-15
IT1171462B (en) 1987-06-10
JPS5827970A (en) 1983-02-18

Similar Documents

Publication Publication Date Title
GB2093485B (en) Electroless alloy plating
GB2095292B (en) Electroless gold plating
DE3066952D1 (en) Electroless copper plating solution
AU542393B2 (en) Nickel electroplating bath
DE3374420D1 (en) Electroless nickel plating
AU536421B2 (en) Electrodialytically regenerating electroless plating bath
GB2160897B (en) Electroless plating solution
AU541923B2 (en) Electroless gold plating
ZA875186B (en) Chromium mask for electroless nickel or copper plating
AU555641B2 (en) Aqueous electroless nickel plating bath
DE3269823D1 (en) Electroless nickel-boron plating
DE3475535D1 (en) Aqueous alcaline bath for chemically plating copper or nickel
AU544591B2 (en) Electroless copper plating
AU531506B2 (en) Nickel electroplating bath
AU7351781A (en) Ammonia-free electroless nickel plating bath
AU565093B2 (en) Zinc-nickel electroplating bath
AU527954B2 (en) Nickel electroplating bath and use thereof
GB2107741B (en) Electroless plating of nickel onto silicon
GB2150601B (en) Initiation of electroless nickel plating
JPS57194293A (en) Palladium plating bath
PL257842A1 (en) Electroless nickel plating bath
PL272943A1 (en) Nickel plating bath
GB8503104D0 (en) Electroless copper plating
ZA817327B (en) Nickel plating method
IL64206A0 (en) Nickel plating method