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AU700075B2 - Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricating it - Google Patents

Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricating it Download PDF

Info

Publication number
AU700075B2
AU700075B2 AU23294/95A AU2329495A AU700075B2 AU 700075 B2 AU700075 B2 AU 700075B2 AU 23294/95 A AU23294/95 A AU 23294/95A AU 2329495 A AU2329495 A AU 2329495A AU 700075 B2 AU700075 B2 AU 700075B2
Authority
AU
Australia
Prior art keywords
metallic foil
circuit
laminate
support
fabricating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU23294/95A
Other languages
English (en)
Other versions
AU2329495A (en
Inventor
Yoshinori Hatanaka
Masashi Nishimura
Shinya Uchibori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyake Inc
Original Assignee
Miyake Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP07167978A external-priority patent/JP3116209B2/ja
Application filed by Miyake Inc filed Critical Miyake Inc
Publication of AU2329495A publication Critical patent/AU2329495A/en
Priority to AU87868/98A priority Critical patent/AU723222B2/en
Application granted granted Critical
Publication of AU700075B2 publication Critical patent/AU700075B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/0672—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with resonating marks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Burglar Alarm Systems (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AU23294/95A 1994-12-01 1995-06-27 Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricating it Ceased AU700075B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU87868/98A AU723222B2 (en) 1994-12-01 1998-10-01 Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricating it

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP6-323506 1994-12-01
JP32350694 1994-12-01
JP07167978A JP3116209B2 (ja) 1994-12-01 1995-06-10 共振タグ等の回路様金属箔シートの製造方法
JP7-167978 1995-06-10

Related Child Applications (1)

Application Number Title Priority Date Filing Date
AU87868/98A Division AU723222B2 (en) 1994-12-01 1998-10-01 Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricating it

Publications (2)

Publication Number Publication Date
AU2329495A AU2329495A (en) 1996-06-06
AU700075B2 true AU700075B2 (en) 1998-12-17

Family

ID=26491853

Family Applications (1)

Application Number Title Priority Date Filing Date
AU23294/95A Ceased AU700075B2 (en) 1994-12-01 1995-06-27 Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricating it

Country Status (8)

Country Link
KR (1) KR100197509B1 (pt)
CN (1) CN1100999C (pt)
AU (1) AU700075B2 (pt)
BR (1) BR9502961A (pt)
CA (1) CA2153022C (pt)
MY (1) MY117567A (pt)
SG (1) SG71080A1 (pt)
TW (1) TW404092B (pt)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10651320B2 (en) 2010-11-19 2020-05-12 Dsm Ip Assets B.V. Method of manufacturing a circuit board by punching
US10672928B2 (en) 2011-06-06 2020-06-02 Dsm Ip Assets B.V. Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5754110A (en) * 1996-03-07 1998-05-19 Checkpoint Systems, Inc. Security tag and manufacturing method
KR100605480B1 (ko) 2004-04-19 2006-07-31 고상근 알에프아이디 시스템의 태그 제조방법
JP5377096B2 (ja) 2008-09-08 2013-12-25 株式会社東芝 高周波パッケージ装置およびその製造方法
KR20120028418A (ko) 2010-09-14 2012-03-23 삼성모바일디스플레이주식회사 유기 발광 표시 장치용 밀봉기판의 제조 방법 및 유기 발광 표시 장치용 밀봉기판
CN112621891B (zh) * 2019-09-24 2022-10-14 泰州隆基乐叶光伏科技有限公司 导电金属箔冲压方法及冲压装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0063347A1 (de) * 1981-04-22 1982-10-27 IVO Irion & Vosseler Zählerfabrik GmbH & Co. Prägefolie zum Aufbringen von Leiterbahnen
EP0255073A1 (de) * 1986-07-30 1988-02-03 Actron Entwicklungs AG Schaltungsanordnung und Resonanzetikette sowie Verfahren zu ihrer Herstellung
EP0423651A1 (de) * 1989-10-20 1991-04-24 Kobe Properties Limited Verfahren zur Herstellung einer Schaltungsanordnung, sowie Schaltungsanordnung auf einer Trägerfolie

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0063347A1 (de) * 1981-04-22 1982-10-27 IVO Irion & Vosseler Zählerfabrik GmbH & Co. Prägefolie zum Aufbringen von Leiterbahnen
EP0255073A1 (de) * 1986-07-30 1988-02-03 Actron Entwicklungs AG Schaltungsanordnung und Resonanzetikette sowie Verfahren zu ihrer Herstellung
EP0423651A1 (de) * 1989-10-20 1991-04-24 Kobe Properties Limited Verfahren zur Herstellung einer Schaltungsanordnung, sowie Schaltungsanordnung auf einer Trägerfolie

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10651320B2 (en) 2010-11-19 2020-05-12 Dsm Ip Assets B.V. Method of manufacturing a circuit board by punching
US10672928B2 (en) 2011-06-06 2020-06-02 Dsm Ip Assets B.V. Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body

Also Published As

Publication number Publication date
AU2329495A (en) 1996-06-06
TW404092B (en) 2000-09-01
BR9502961A (pt) 1997-05-27
SG71080A1 (en) 2000-03-21
CA2153022A1 (en) 1996-06-02
CA2153022C (en) 1999-11-30
KR100197509B1 (ko) 1999-06-15
KR960021510A (ko) 1996-07-18
MY117567A (en) 2004-07-31
CN1100999C (zh) 2003-02-05
CN1126841A (zh) 1996-07-17

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