[go: up one dir, main page]

AU6773000A - Apparatus and method for electroplating a material layer onto a wafer - Google Patents

Apparatus and method for electroplating a material layer onto a wafer

Info

Publication number
AU6773000A
AU6773000A AU67730/00A AU6773000A AU6773000A AU 6773000 A AU6773000 A AU 6773000A AU 67730/00 A AU67730/00 A AU 67730/00A AU 6773000 A AU6773000 A AU 6773000A AU 6773000 A AU6773000 A AU 6773000A
Authority
AU
Australia
Prior art keywords
electroplating
wafer
material layer
layer onto
onto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU67730/00A
Inventor
Mehrdad M. Moslehi
Ajit P. Paranjpe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CVC Products Inc
Original Assignee
CVC Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CVC Products Inc filed Critical CVC Products Inc
Publication of AU6773000A publication Critical patent/AU6773000A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
AU67730/00A 1999-08-26 2000-08-14 Apparatus and method for electroplating a material layer onto a wafer Abandoned AU6773000A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US38366199A 1999-08-26 1999-08-26
US09383661 1999-08-26
PCT/US2000/022312 WO2001014618A2 (en) 1999-08-26 2000-08-14 Apparatus and method for electroplating a material layer onto a wafer

Publications (1)

Publication Number Publication Date
AU6773000A true AU6773000A (en) 2001-03-19

Family

ID=23514120

Family Applications (1)

Application Number Title Priority Date Filing Date
AU67730/00A Abandoned AU6773000A (en) 1999-08-26 2000-08-14 Apparatus and method for electroplating a material layer onto a wafer

Country Status (2)

Country Link
AU (1) AU6773000A (en)
WO (1) WO2001014618A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10100297A1 (en) * 2001-01-04 2002-07-18 Gesimat Gmbh Device and method for electrochemical coating

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04143299A (en) * 1990-10-03 1992-05-18 Fujitsu Ltd Electroplating method
JPH05243183A (en) * 1992-02-28 1993-09-21 Nec Corp Manufacture of semiconductor device
JP3289459B2 (en) * 1993-12-29 2002-06-04 カシオ計算機株式会社 Plating method and plating equipment
EP1027480A1 (en) * 1997-09-30 2000-08-16 Semitool, Inc. Electrodes for semiconductor electroplating apparatus and their application
JPH11135462A (en) * 1997-10-28 1999-05-21 Shinjiro Suganuma Semiconductor manufacturing equipment
KR100576757B1 (en) * 1997-12-16 2006-05-03 가부시키가이샤 에바라 세이사꾸쇼 Plating equipment
US6395152B1 (en) * 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US6074544A (en) * 1998-07-22 2000-06-13 Novellus Systems, Inc. Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer

Also Published As

Publication number Publication date
WO2001014618A2 (en) 2001-03-01
WO2001014618A3 (en) 2001-07-26

Similar Documents

Publication Publication Date Title
AU2237599A (en) Apparatus and method for depositing a material on a substrate
GB9914484D0 (en) Polishing apparatus and method for polishing a substrate
AU2002256176A1 (en) Method and apparatus for electrochemically depositing a material onto a workpiece surface
GB2355992B (en) Method and apparatus for forming a film on a substrate
EP0999012A3 (en) Method and apparatus for polishing substrate
SG90780A1 (en) Method and apparatus for dechucking a substrate
AU7378998A (en) Method and apparatus for clamping a substrate
AU3521700A (en) Method and apparatus for processing a wafer
AU1590801A (en) Method and apparatus for applying a coating onto a substrate
SG93262A1 (en) Method and apparatus for preventing edge deposition
AU2001240049A1 (en) Method and apparatus for extruding a coating upon a substrate surface
AU4746497A (en) Method and apparatus for coating a substrate
AU4398700A (en) Device and method for removing thin layers on a support material
GB9801655D0 (en) Method and apparatus for treating a substrate
AU1339401A (en) Method and apparatus for coating a substrate in a vacuum
AU1590701A (en) Method and apparatus for dynamically coating a substrate
AU8585698A (en) Apparatus and method for treating a cathode material provided on a thin-film substrate
EP1208010A4 (en) Method and apparatus for applying chemical watermarks on substrate
AU4175800A (en) Method and apparatus for wafer metrology
AU1471801A (en) Method and apparatus for applying a polychromatic coating onto a substrate
AU3198400A (en) Method and device for rotating a wafer
GB9812850D0 (en) A method and apparatus for dechucking
AU3294400A (en) Method and apparatus for manufacturing coated paper and a coated paper
AU6395700A (en) Method and apparatus for cleaving a substrate
AU3230400A (en) Method and apparatus for etching coated substrates

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase