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AU6768500A - Apparatus and method for protecting electronic assembly contacts - Google Patents

Apparatus and method for protecting electronic assembly contacts

Info

Publication number
AU6768500A
AU6768500A AU67685/00A AU6768500A AU6768500A AU 6768500 A AU6768500 A AU 6768500A AU 67685/00 A AU67685/00 A AU 67685/00A AU 6768500 A AU6768500 A AU 6768500A AU 6768500 A AU6768500 A AU 6768500A
Authority
AU
Australia
Prior art keywords
electronic assembly
assembly contacts
protecting electronic
protecting
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU67685/00A
Inventor
Thomas H Dozier
Douglas S. Ondricek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of AU6768500A publication Critical patent/AU6768500A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
AU67685/00A 1999-08-13 2000-08-10 Apparatus and method for protecting electronic assembly contacts Abandoned AU6768500A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US37446799A 1999-08-13 1999-08-13
US09374467 1999-08-13
PCT/US2000/022145 WO2001013422A1 (en) 1999-08-13 2000-08-10 Apparatus and method for protecting electronic assembly contacts

Publications (1)

Publication Number Publication Date
AU6768500A true AU6768500A (en) 2001-03-13

Family

ID=23476962

Family Applications (1)

Application Number Title Priority Date Filing Date
AU67685/00A Abandoned AU6768500A (en) 1999-08-13 2000-08-10 Apparatus and method for protecting electronic assembly contacts

Country Status (3)

Country Link
AU (1) AU6768500A (en)
TW (1) TW503498B (en)
WO (1) WO2001013422A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030027438A1 (en) * 2001-06-25 2003-02-06 Xpeqt Ag Test/burn in socket assembly with improved resistance to thermally induced mechanical stress
CN101793912B (en) * 2009-02-03 2011-12-28 京元电子股份有限公司 Tube to tray conversion device
DE202017100381U1 (en) 2017-01-25 2017-02-03 Hiwin Technologies Corp. Linear module with a lubrication support
KR102654550B1 (en) * 2023-12-12 2024-04-04 주식회사 프로이천 Hybrid floating block

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3838413A1 (en) * 1988-11-12 1990-05-17 Mania Gmbh ADAPTER FOR ELECTRONIC TEST DEVICES FOR PCBS AND THE LIKE
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
JPH08213128A (en) * 1995-02-08 1996-08-20 Texas Instr Japan Ltd socket
US5783461A (en) * 1996-10-03 1998-07-21 Micron Technology, Inc. Temporary semiconductor package having hard-metal, dense-array ball contacts and method of fabrication

Also Published As

Publication number Publication date
TW503498B (en) 2002-09-21
WO2001013422A1 (en) 2001-02-22

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase