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AU6032394A - Self aligning surface mount electrical component - Google Patents

Self aligning surface mount electrical component

Info

Publication number
AU6032394A
AU6032394A AU60323/94A AU6032394A AU6032394A AU 6032394 A AU6032394 A AU 6032394A AU 60323/94 A AU60323/94 A AU 60323/94A AU 6032394 A AU6032394 A AU 6032394A AU 6032394 A AU6032394 A AU 6032394A
Authority
AU
Australia
Prior art keywords
electrical component
surface mount
self aligning
aligning surface
mount electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU60323/94A
Inventor
Allen David Hertz
David A Tribbey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of AU6032394A publication Critical patent/AU6032394A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W70/421—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
AU60323/94A 1993-01-22 1994-01-19 Self aligning surface mount electrical component Abandoned AU6032394A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US801993A 1993-01-22 1993-01-22
PCT/US1994/000769 WO1994017568A1 (en) 1993-01-22 1994-01-19 Self aligning surface mount electrical component
US008019 1995-10-27

Publications (1)

Publication Number Publication Date
AU6032394A true AU6032394A (en) 1994-08-15

Family

ID=21729386

Family Applications (1)

Application Number Title Priority Date Filing Date
AU60323/94A Abandoned AU6032394A (en) 1993-01-22 1994-01-19 Self aligning surface mount electrical component

Country Status (2)

Country Link
AU (1) AU6032394A (en)
WO (1) WO1994017568A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4429002A1 (en) * 1994-08-16 1996-02-22 Siemens Nixdorf Inf Syst Terminal posts for electronic modules with flat connection fields

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4600970A (en) * 1984-05-29 1986-07-15 Rca Corporation Leadless chip carriers having self-aligning mounting pads
JPS61269345A (en) * 1985-05-24 1986-11-28 Hitachi Ltd Semiconductor device
GB8522429D0 (en) * 1985-09-10 1985-10-16 Plessey Co Plc Alignment for hybrid device
US4831724A (en) * 1987-08-04 1989-05-23 Western Digital Corporation Apparatus and method for aligning surface mountable electronic components on printed circuit board pads

Also Published As

Publication number Publication date
WO1994017568A1 (en) 1994-08-04

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