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AU5616194A - Electronic package sealed with a dispensable adhesive - Google Patents

Electronic package sealed with a dispensable adhesive

Info

Publication number
AU5616194A
AU5616194A AU56161/94A AU5616194A AU5616194A AU 5616194 A AU5616194 A AU 5616194A AU 56161/94 A AU56161/94 A AU 56161/94A AU 5616194 A AU5616194 A AU 5616194A AU 5616194 A AU5616194 A AU 5616194A
Authority
AU
Australia
Prior art keywords
electronic package
package sealed
dispensable adhesive
dispensable
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU56161/94A
Inventor
George Anthony Brathwaite
Paul Robert Hoffman
Dexin Liang
Deepak Mahulikar
Anthony M Pasqualoni
German Jamlig Ramirez
Linda E Strauman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of AU5616194A publication Critical patent/AU5616194A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W95/00—
    • H10W76/60—
    • H10W72/5449—
AU56161/94A 1992-12-09 1993-11-22 Electronic package sealed with a dispensable adhesive Abandoned AU5616194A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US98786792A 1992-12-09 1992-12-09
US987867 1992-12-09
PCT/US1993/011337 WO1994014193A1 (en) 1992-12-09 1993-11-22 Electronic package sealed with a dispensable adhesive

Publications (1)

Publication Number Publication Date
AU5616194A true AU5616194A (en) 1994-07-04

Family

ID=25533645

Family Applications (1)

Application Number Title Priority Date Filing Date
AU56161/94A Abandoned AU5616194A (en) 1992-12-09 1993-11-22 Electronic package sealed with a dispensable adhesive

Country Status (5)

Country Link
EP (1) EP0673547A4 (en)
JP (1) JPH08505266A (en)
AU (1) AU5616194A (en)
CA (1) CA2150569A1 (en)
WO (1) WO1994014193A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE508138C2 (en) * 1996-12-20 1998-08-31 Ericsson Telefon Ab L M Method and apparatus for connecting electrical component to circuit board
SE508139C2 (en) * 1996-12-20 1998-08-31 Ericsson Telefon Ab L M Method and apparatus for connecting electrical component to circuit board
KR100697624B1 (en) * 2005-07-18 2007-03-22 삼성전자주식회사 Package substrate having surface structure for adhesive flow control and semiconductor package using same
JP6888114B2 (en) * 2017-11-09 2021-06-16 Ｎｇｋエレクトロデバイス株式会社 Lid and electronics
JP6929210B2 (en) * 2017-12-11 2021-09-01 株式会社ブリヂストン tire

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4139726A (en) * 1978-01-16 1979-02-13 Allen-Bradley Company Packaged microcircuit and method for assembly thereof
US4622433A (en) * 1984-03-30 1986-11-11 Diacon, Inc. Ceramic package system using low temperature sealing glasses
US4629824A (en) * 1984-12-24 1986-12-16 Gte Products Corporation IC package sealing technique
US4704626A (en) * 1985-07-08 1987-11-03 Olin Corporation Graded sealing systems for semiconductor package
US5013871A (en) * 1988-02-10 1991-05-07 Olin Corporation Kit for the assembly of a metal electronic package
US5023398A (en) * 1988-10-05 1991-06-11 Olin Corporation Aluminum alloy semiconductor packages
US5098864A (en) * 1989-11-29 1992-03-24 Olin Corporation Process for manufacturing a metal pin grid array package
US5117279A (en) * 1990-03-23 1992-05-26 Motorola, Inc. Semiconductor device having a low temperature uv-cured epoxy seal
US5043534A (en) * 1990-07-02 1991-08-27 Olin Corporation Metal electronic package having improved resistance to electromagnetic interference

Also Published As

Publication number Publication date
EP0673547A1 (en) 1995-09-27
JPH08505266A (en) 1996-06-04
CA2150569A1 (en) 1994-06-23
WO1994014193A1 (en) 1994-06-23
EP0673547A4 (en) 1996-03-13

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