AU5485400A - High density substrate and methods for manufacturing same - Google Patents
High density substrate and methods for manufacturing sameInfo
- Publication number
- AU5485400A AU5485400A AU54854/00A AU5485400A AU5485400A AU 5485400 A AU5485400 A AU 5485400A AU 54854/00 A AU54854/00 A AU 54854/00A AU 5485400 A AU5485400 A AU 5485400A AU 5485400 A AU5485400 A AU 5485400A
- Authority
- AU
- Australia
- Prior art keywords
- methods
- high density
- manufacturing same
- density substrate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US33261999A | 1999-06-14 | 1999-06-14 | |
| US09332619 | 1999-06-14 | ||
| PCT/US2000/016220 WO2000078107A1 (en) | 1999-06-14 | 2000-06-14 | High density substrate and methods for manufacturing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU5485400A true AU5485400A (en) | 2001-01-02 |
Family
ID=23299053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU54854/00A Abandoned AU5485400A (en) | 1999-06-14 | 2000-06-14 | High density substrate and methods for manufacturing same |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1190606A1 (en) |
| JP (1) | JP2003501301A (en) |
| KR (1) | KR20020011439A (en) |
| CN (1) | CN1370388A (en) |
| AU (1) | AU5485400A (en) |
| CA (1) | CA2374863A1 (en) |
| WO (1) | WO2000078107A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101021011B1 (en) * | 2003-11-14 | 2011-03-09 | 엘지이노텍 주식회사 | Manufacturing method of printed circuit board |
| TWI504326B (en) * | 2008-08-29 | 2015-10-11 | Ajinomoto Kk | Circuit board manufacturing method |
| TWI499690B (en) * | 2009-03-13 | 2015-09-11 | Ajinomoto Kk | Paste metal laminates |
| KR101022943B1 (en) * | 2009-10-12 | 2011-03-16 | 삼성전기주식회사 | Carrier member for substrate manufacturing and method for manufacturing substrate using same |
| JP6487641B2 (en) * | 2014-06-30 | 2019-03-20 | 中野製薬株式会社 | Styling cosmetics |
| CN113811093A (en) * | 2021-08-09 | 2021-12-17 | 广州方邦电子股份有限公司 | Metal foil, copper-clad laminated board, circuit board and preparation method of circuit board |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4357395A (en) * | 1980-08-22 | 1982-11-02 | General Electric Company | Transfer lamination of vapor deposited foils, method and product |
| JPS61209199A (en) * | 1985-03-12 | 1986-09-17 | 尾池工業株式会社 | Conductive transfer foil |
| JPH02141233A (en) * | 1988-11-22 | 1990-05-30 | Toyo Metaraijingu Kk | Laminated transfer film for printed wiring board |
| US6596391B2 (en) * | 1997-05-14 | 2003-07-22 | Honeywell International Inc. | Very ultra thin conductor layers for printed wiring boards |
| JPH1187913A (en) * | 1997-09-12 | 1999-03-30 | Fuji Photo Film Co Ltd | Manufacture of transfer sheet and multilayered circuit board and image-forming method |
-
2000
- 2000-06-14 EP EP00939835A patent/EP1190606A1/en not_active Withdrawn
- 2000-06-14 JP JP2001502628A patent/JP2003501301A/en active Pending
- 2000-06-14 CN CN00811670A patent/CN1370388A/en active Pending
- 2000-06-14 CA CA002374863A patent/CA2374863A1/en not_active Abandoned
- 2000-06-14 WO PCT/US2000/016220 patent/WO2000078107A1/en not_active Ceased
- 2000-06-14 AU AU54854/00A patent/AU5485400A/en not_active Abandoned
- 2000-06-14 KR KR1020017016133A patent/KR20020011439A/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003501301A (en) | 2003-01-14 |
| WO2000078107A1 (en) | 2000-12-21 |
| CA2374863A1 (en) | 2000-12-21 |
| KR20020011439A (en) | 2002-02-08 |
| EP1190606A1 (en) | 2002-03-27 |
| CN1370388A (en) | 2002-09-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |