AU5229000A - Method for making a module for chip cards and resulting module - Google Patents
Method for making a module for chip cards and resulting moduleInfo
- Publication number
- AU5229000A AU5229000A AU52290/00A AU5229000A AU5229000A AU 5229000 A AU5229000 A AU 5229000A AU 52290/00 A AU52290/00 A AU 52290/00A AU 5229000 A AU5229000 A AU 5229000A AU 5229000 A AU5229000 A AU 5229000A
- Authority
- AU
- Australia
- Prior art keywords
- module
- metallizing
- gate
- making
- support film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H10W90/754—
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Die Bonding (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Catalysts (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention concerns a method for making a storage medium such as a chip card, comprising a micromodule including a support film (1) bearing a metallizing gate (7), and an integrated circuit chip (9) connected to said metallizing gate. The method comprises steps which consist in: producing a metallizing gate (7) on the micromodule support film (1), and deforming the support film (1) such that at least said transfer zone is at a lower level relative to the plane of said metallizing gate. The invention is applicable to chip cards with flush contacts or without contact.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9908123 | 1999-06-17 | ||
| FR9908123A FR2795204B1 (en) | 1999-06-17 | 1999-06-17 | PROCESS FOR THE MANUFACTURE OF A STORAGE MEDIUM HAVING A THREE-DIMENSIONAL METALIZING GRID SUPPORT OBTAINED |
| PCT/FR2000/001491 WO2000079478A1 (en) | 1999-06-17 | 2000-05-30 | Method for making a module for chip cards and resulting module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU5229000A true AU5229000A (en) | 2001-01-09 |
Family
ID=9547286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU52290/00A Abandoned AU5229000A (en) | 1999-06-17 | 2000-05-30 | Method for making a module for chip cards and resulting module |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1192591B1 (en) |
| CN (1) | CN1370307A (en) |
| AT (1) | ATE237847T1 (en) |
| AU (1) | AU5229000A (en) |
| DE (1) | DE60002204D1 (en) |
| FR (1) | FR2795204B1 (en) |
| WO (1) | WO2000079478A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10358422B3 (en) * | 2003-08-26 | 2005-04-28 | Muehlbauer Ag | Method for producing module bridges |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0688050A1 (en) * | 1994-06-15 | 1995-12-20 | Philips Cartes Et Systemes | Assembly method for integrated circuit card and such obtained card |
| FR2736740A1 (en) * | 1995-07-11 | 1997-01-17 | Trt Telecom Radio Electr | PROCESS FOR PRODUCING AND ASSEMBLING INTEGRATED CIRCUIT BOARD AND CARD THUS OBTAINED |
| FR2741191B1 (en) * | 1995-11-14 | 1998-01-09 | Sgs Thomson Microelectronics | PROCESS FOR MANUFACTURING A MICROMODULE, PARTICULARLY FOR CHIP CARDS |
-
1999
- 1999-06-17 FR FR9908123A patent/FR2795204B1/en not_active Expired - Fee Related
-
2000
- 2000-05-30 AT AT00936989T patent/ATE237847T1/en not_active IP Right Cessation
- 2000-05-30 EP EP00936989A patent/EP1192591B1/en not_active Expired - Lifetime
- 2000-05-30 WO PCT/FR2000/001491 patent/WO2000079478A1/en not_active Ceased
- 2000-05-30 CN CN00811757.8A patent/CN1370307A/en active Pending
- 2000-05-30 DE DE60002204T patent/DE60002204D1/en not_active Expired - Lifetime
- 2000-05-30 AU AU52290/00A patent/AU5229000A/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN1370307A (en) | 2002-09-18 |
| ATE237847T1 (en) | 2003-05-15 |
| DE60002204D1 (en) | 2003-05-22 |
| EP1192591A1 (en) | 2002-04-03 |
| FR2795204B1 (en) | 2001-08-31 |
| WO2000079478A1 (en) | 2000-12-28 |
| EP1192591B1 (en) | 2003-04-16 |
| FR2795204A1 (en) | 2000-12-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |