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AU5083998A - Dimensionally stable solder mask material and method of application - Google Patents

Dimensionally stable solder mask material and method of application

Info

Publication number
AU5083998A
AU5083998A AU50839/98A AU5083998A AU5083998A AU 5083998 A AU5083998 A AU 5083998A AU 50839/98 A AU50839/98 A AU 50839/98A AU 5083998 A AU5083998 A AU 5083998A AU 5083998 A AU5083998 A AU 5083998A
Authority
AU
Australia
Prior art keywords
application
mask material
dimensionally stable
solder mask
stable solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU50839/98A
Inventor
William George Petefish
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WL Gore and Associates Inc
Original Assignee
WL Gore and Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WL Gore and Associates Inc filed Critical WL Gore and Associates Inc
Publication of AU5083998A publication Critical patent/AU5083998A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AU50839/98A 1996-11-08 1997-10-22 Dimensionally stable solder mask material and method of application Abandoned AU5083998A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US74597496A 1996-11-08 1996-11-08
US08745974 1996-11-08
PCT/US1997/018971 WO1998020713A1 (en) 1996-11-08 1997-10-22 Dimensionally stable solder mask material and method of application

Publications (1)

Publication Number Publication Date
AU5083998A true AU5083998A (en) 1998-05-29

Family

ID=24999014

Family Applications (1)

Application Number Title Priority Date Filing Date
AU50839/98A Abandoned AU5083998A (en) 1996-11-08 1997-10-22 Dimensionally stable solder mask material and method of application

Country Status (2)

Country Link
AU (1) AU5083998A (en)
WO (1) WO1998020713A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7381666B2 (en) 2002-12-20 2008-06-03 Kimberly-Clark Worldwide, Inc. Breathable film and fabric having liquid and viral barrier
DE102017102999A1 (en) * 2017-02-15 2018-08-16 Endress+Hauser SE+Co. KG Printed circuit board and method for the production thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2885601A (en) * 1954-05-28 1959-05-05 Rca Corp Insulation of printed circuits
US3433888A (en) * 1967-01-24 1969-03-18 Electro Mechanisms Inc Dimensionally stable flexible laminate and printed circuits made therefrom
US4155801A (en) * 1977-10-27 1979-05-22 Rohr Industries, Inc. Process for masking sheet metal for chemical milling
EP0151490B1 (en) * 1984-02-09 1991-01-16 Toyota Jidosha Kabushiki Kaisha Process for producing ultra-fine ceramic particles
GB8511861D0 (en) * 1985-05-10 1985-06-19 Bourne E Printed circuit boards
GB2195269B (en) * 1986-06-02 1990-01-24 Japan Gore Tex Inc Process for making substrates for printed circuit boards
EP0346522A3 (en) * 1988-06-16 1991-04-03 Nippon CMK Corp. Printed wiring board
JPH06244537A (en) * 1993-02-19 1994-09-02 Junkosha Co Ltd Printed-wiring board
JPH0722741A (en) * 1993-07-01 1995-01-24 Japan Gore Tex Inc Coverlay film and coverlay film coated circuit board
US5538756A (en) * 1994-09-23 1996-07-23 W. L. Gore & Associates High capacitance sheet adhesives and process for making the same

Also Published As

Publication number Publication date
WO1998020713A1 (en) 1998-05-14

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