AU4991799A - Temperature control of electronic devices using power following feedback - Google Patents
Temperature control of electronic devices using power following feedbackInfo
- Publication number
- AU4991799A AU4991799A AU49917/99A AU4991799A AU4991799A AU 4991799 A AU4991799 A AU 4991799A AU 49917/99 A AU49917/99 A AU 49917/99A AU 4991799 A AU4991799 A AU 4991799A AU 4991799 A AU4991799 A AU 4991799A
- Authority
- AU
- Australia
- Prior art keywords
- temperature control
- electronic devices
- power following
- following feedback
- feedback
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
-
- H10W40/00—
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Control Of Temperature (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US9272098P | 1998-07-14 | 1998-07-14 | |
| US60092720 | 1998-07-14 | ||
| PCT/US1999/015846 WO2000004582A1 (en) | 1998-07-14 | 1999-07-14 | Temperature control of electronic devices using power following feedback |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU4991799A true AU4991799A (en) | 2000-02-07 |
Family
ID=22234752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU49917/99A Abandoned AU4991799A (en) | 1998-07-14 | 1999-07-14 | Temperature control of electronic devices using power following feedback |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4703850B2 (en) |
| KR (1) | KR100755295B1 (en) |
| AU (1) | AU4991799A (en) |
| DE (1) | DE19983379B4 (en) |
| WO (1) | WO2000004582A1 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6794620B1 (en) * | 2001-11-07 | 2004-09-21 | Advanced Micro Devices, Inc. | Feedforward temperature control of device under test |
| DE10203790A1 (en) * | 2002-01-31 | 2003-06-26 | Siemens Ag | Method for operating a semiconductor component avoids temperature fluctuations by actively boosting temperature under low electrical load so as to match temperature level to that under high load |
| US6825681B2 (en) | 2002-07-19 | 2004-11-30 | Delta Design, Inc. | Thermal control of a DUT using a thermal control substrate |
| US7313500B2 (en) | 2004-11-05 | 2007-12-25 | Schweitzer Engineering Labortories, Inc. | Method to increase the maximum allowable ambient temperature rating of an electronic device |
| DE102005001163B3 (en) | 2005-01-10 | 2006-05-18 | Erich Reitinger | Semiconductor wafers` testing method, involves testing wafer by probes, and reducing heating energy with constant cooling efficiency, under consideration of detected increase of temperature of fluids flowing via tempered chuck device |
| US9570643B2 (en) | 2013-10-28 | 2017-02-14 | General Electric Company | System and method for enhanced convection cooling of temperature-dependent power producing and power consuming electrical devices |
| JP7143226B2 (en) * | 2016-06-15 | 2022-09-28 | ワットロー・エレクトリック・マニュファクチャリング・カンパニー | Power converter for thermal system |
| US10514416B2 (en) | 2017-09-29 | 2019-12-24 | Advantest Corporation | Electronic component handling apparatus and electronic component testing apparatus |
| CN109932630B (en) * | 2017-12-15 | 2021-08-03 | 朋程科技股份有限公司 | Over-temperature detection circuit and test method thereof |
| JP7266481B2 (en) * | 2019-07-19 | 2023-04-28 | 東京エレクトロン株式会社 | Temperature control device, temperature control method, and inspection device |
| JP7534047B2 (en) * | 2020-12-07 | 2024-08-14 | 東京エレクトロン株式会社 | Inspection device control method and inspection device |
| WO2025191634A1 (en) * | 2024-03-11 | 2025-09-18 | 株式会社日立ハイテク | Plasma processing apparatus |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4330809A (en) * | 1979-12-31 | 1982-05-18 | Crown International, Inc. | Thermal protection circuit for the die of a transistor |
| US4637020A (en) * | 1983-08-01 | 1987-01-13 | Fairchild Semiconductor Corporation | Method and apparatus for monitoring automated testing of electronic circuits |
| US4686627A (en) * | 1984-12-24 | 1987-08-11 | Honeywell Inc. | Electrical test apparatus |
| WO1987001813A1 (en) * | 1985-09-23 | 1987-03-26 | Sharetree Limited | An oven for the burn-in of integrated circuits |
| DE3536098A1 (en) * | 1985-10-09 | 1987-04-09 | Siemens Ag | Device for monitoring the temperature of an electrical component |
| US4713612A (en) * | 1986-07-14 | 1987-12-15 | Hughes Aircraft Company | Method and apparatus for determination of junction-to-case thermal resistance for a hybrid circuit element |
| US5324916A (en) * | 1991-11-01 | 1994-06-28 | Hewlett-Packard Company | System and method for dynamic power compensation |
| US5287292A (en) * | 1992-10-16 | 1994-02-15 | Picopower Technology, Inc. | Heat regulator for integrated circuits |
| JPH07263526A (en) * | 1994-03-17 | 1995-10-13 | Hitachi Ltd | Wafer chuck and method for cooling semiconductor element |
| JP2986381B2 (en) * | 1994-08-16 | 1999-12-06 | インターナショナル・ビジネス・マシーンズ・コーポレイション | Electronic chip temperature control device and method |
| JPH09264647A (en) * | 1996-03-27 | 1997-10-07 | Nec Corp | Electronic apparatus cooling circuit |
| US6476627B1 (en) * | 1996-10-21 | 2002-11-05 | Delta Design, Inc. | Method and apparatus for temperature control of a device during testing |
-
1999
- 1999-07-14 AU AU49917/99A patent/AU4991799A/en not_active Abandoned
- 1999-07-14 WO PCT/US1999/015846 patent/WO2000004582A1/en not_active Ceased
- 1999-07-14 KR KR1020017000633A patent/KR100755295B1/en not_active Expired - Lifetime
- 1999-07-14 JP JP2000560611A patent/JP4703850B2/en not_active Expired - Lifetime
- 1999-07-14 DE DE19983379T patent/DE19983379B4/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| WO2000004582A8 (en) | 2000-05-18 |
| JP2002520630A (en) | 2002-07-09 |
| WO2000004582A1 (en) | 2000-01-27 |
| KR20010071917A (en) | 2001-07-31 |
| JP4703850B2 (en) | 2011-06-15 |
| WO2000004582A9 (en) | 2000-07-20 |
| DE19983379T1 (en) | 2001-09-13 |
| KR100755295B1 (en) | 2007-09-05 |
| DE19983379B4 (en) | 2011-08-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |