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AU4575300A - Method for making an integrated circuit portable device with electric conduction paths - Google Patents

Method for making an integrated circuit portable device with electric conduction paths

Info

Publication number
AU4575300A
AU4575300A AU45753/00A AU4575300A AU4575300A AU 4575300 A AU4575300 A AU 4575300A AU 45753/00 A AU45753/00 A AU 45753/00A AU 4575300 A AU4575300 A AU 4575300A AU 4575300 A AU4575300 A AU 4575300A
Authority
AU
Australia
Prior art keywords
making
integrated circuit
portable device
electric conduction
conduction paths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU45753/00A
Inventor
Bernard Calvas
Jean-Christophe Fidalgo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Publication of AU4575300A publication Critical patent/AU4575300A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W20/023
    • H10W90/00
    • H10W72/07532
    • H10W72/07533
    • H10W72/59
    • H10W72/834
    • H10W72/884
    • H10W72/952
    • H10W90/20
    • H10W90/732
    • H10W90/752
AU45753/00A 1999-06-04 2000-05-11 Method for making an integrated circuit portable device with electric conduction paths Abandoned AU4575300A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9907056A FR2794570B1 (en) 1999-06-04 1999-06-04 METHOD FOR MANUFACTURING PORTABLE DEVICE WITH INTEGRATED CIRCUIT WITH ELECTRICAL CONDUCTION PATHS
FR9907056 1999-06-04
PCT/FR2000/001264 WO2000075985A1 (en) 1999-06-04 2000-05-11 Method for making an integrated circuit portable device with electric conduction paths

Publications (1)

Publication Number Publication Date
AU4575300A true AU4575300A (en) 2000-12-28

Family

ID=9546371

Family Applications (1)

Application Number Title Priority Date Filing Date
AU45753/00A Abandoned AU4575300A (en) 1999-06-04 2000-05-11 Method for making an integrated circuit portable device with electric conduction paths

Country Status (3)

Country Link
AU (1) AU4575300A (en)
FR (1) FR2794570B1 (en)
WO (1) WO2000075985A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6910268B2 (en) * 2001-03-27 2005-06-28 Formfactor, Inc. Method for fabricating an IC interconnect system including an in-street integrated circuit wafer via
SG102639A1 (en) 2001-10-08 2004-03-26 Micron Technology Inc Apparatus and method for packing circuits
SG142115A1 (en) 2002-06-14 2008-05-28 Micron Technology Inc Wafer level packaging
DE10244446B4 (en) * 2002-09-24 2004-08-19 Infineon Technologies Ag Semiconductor chip stack
SG119185A1 (en) 2003-05-06 2006-02-28 Micron Technology Inc Method for packaging circuits and packaged circuits

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5749252A (en) * 1980-09-09 1982-03-23 Matsushita Electronics Corp Manufacture of semiconductor device
DE3446780A1 (en) * 1984-12-21 1986-07-03 Brown, Boveri & Cie Ag, 6800 Mannheim METHOD AND JOINING MATERIAL FOR METALLICALLY CONNECTING COMPONENTS
US4984358A (en) * 1989-03-10 1991-01-15 Microelectronics And Computer Technology Corporation Method of assembling stacks of integrated circuit dies
US5311401A (en) * 1991-07-09 1994-05-10 Hughes Aircraft Company Stacked chip assembly and manufacturing method therefor
WO1995025341A1 (en) * 1994-03-15 1995-09-21 Irvine Sensors Corporation 3d stack of ic chips having leads reached by vias through passivation covering access plane
US5521434A (en) * 1994-10-17 1996-05-28 International Business Machines Corporation Semiconductor chip and electronic module with integrated surface interconnects/components
US5673478A (en) * 1995-04-28 1997-10-07 Texas Instruments Incorporated Method of forming an electronic device having I/O reroute
US5657537A (en) * 1995-05-30 1997-08-19 General Electric Company Method for fabricating a stack of two dimensional circuit modules
US5818107A (en) * 1997-01-17 1998-10-06 International Business Machines Corporation Chip stacking by edge metallization
JP2002515651A (en) * 1998-05-13 2002-05-28 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Semiconductor device and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
FR2794570B1 (en) 2003-07-18
WO2000075985A1 (en) 2000-12-14
FR2794570A1 (en) 2000-12-08

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase