AU4575300A - Method for making an integrated circuit portable device with electric conduction paths - Google Patents
Method for making an integrated circuit portable device with electric conduction pathsInfo
- Publication number
- AU4575300A AU4575300A AU45753/00A AU4575300A AU4575300A AU 4575300 A AU4575300 A AU 4575300A AU 45753/00 A AU45753/00 A AU 45753/00A AU 4575300 A AU4575300 A AU 4575300A AU 4575300 A AU4575300 A AU 4575300A
- Authority
- AU
- Australia
- Prior art keywords
- making
- integrated circuit
- portable device
- electric conduction
- conduction paths
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H10W20/023—
-
- H10W90/00—
-
- H10W72/07532—
-
- H10W72/07533—
-
- H10W72/59—
-
- H10W72/834—
-
- H10W72/884—
-
- H10W72/952—
-
- H10W90/20—
-
- H10W90/732—
-
- H10W90/752—
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9907056A FR2794570B1 (en) | 1999-06-04 | 1999-06-04 | METHOD FOR MANUFACTURING PORTABLE DEVICE WITH INTEGRATED CIRCUIT WITH ELECTRICAL CONDUCTION PATHS |
| FR9907056 | 1999-06-04 | ||
| PCT/FR2000/001264 WO2000075985A1 (en) | 1999-06-04 | 2000-05-11 | Method for making an integrated circuit portable device with electric conduction paths |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU4575300A true AU4575300A (en) | 2000-12-28 |
Family
ID=9546371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU45753/00A Abandoned AU4575300A (en) | 1999-06-04 | 2000-05-11 | Method for making an integrated circuit portable device with electric conduction paths |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU4575300A (en) |
| FR (1) | FR2794570B1 (en) |
| WO (1) | WO2000075985A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6910268B2 (en) * | 2001-03-27 | 2005-06-28 | Formfactor, Inc. | Method for fabricating an IC interconnect system including an in-street integrated circuit wafer via |
| SG102639A1 (en) | 2001-10-08 | 2004-03-26 | Micron Technology Inc | Apparatus and method for packing circuits |
| SG142115A1 (en) | 2002-06-14 | 2008-05-28 | Micron Technology Inc | Wafer level packaging |
| DE10244446B4 (en) * | 2002-09-24 | 2004-08-19 | Infineon Technologies Ag | Semiconductor chip stack |
| SG119185A1 (en) | 2003-05-06 | 2006-02-28 | Micron Technology Inc | Method for packaging circuits and packaged circuits |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5749252A (en) * | 1980-09-09 | 1982-03-23 | Matsushita Electronics Corp | Manufacture of semiconductor device |
| DE3446780A1 (en) * | 1984-12-21 | 1986-07-03 | Brown, Boveri & Cie Ag, 6800 Mannheim | METHOD AND JOINING MATERIAL FOR METALLICALLY CONNECTING COMPONENTS |
| US4984358A (en) * | 1989-03-10 | 1991-01-15 | Microelectronics And Computer Technology Corporation | Method of assembling stacks of integrated circuit dies |
| US5311401A (en) * | 1991-07-09 | 1994-05-10 | Hughes Aircraft Company | Stacked chip assembly and manufacturing method therefor |
| WO1995025341A1 (en) * | 1994-03-15 | 1995-09-21 | Irvine Sensors Corporation | 3d stack of ic chips having leads reached by vias through passivation covering access plane |
| US5521434A (en) * | 1994-10-17 | 1996-05-28 | International Business Machines Corporation | Semiconductor chip and electronic module with integrated surface interconnects/components |
| US5673478A (en) * | 1995-04-28 | 1997-10-07 | Texas Instruments Incorporated | Method of forming an electronic device having I/O reroute |
| US5657537A (en) * | 1995-05-30 | 1997-08-19 | General Electric Company | Method for fabricating a stack of two dimensional circuit modules |
| US5818107A (en) * | 1997-01-17 | 1998-10-06 | International Business Machines Corporation | Chip stacking by edge metallization |
| JP2002515651A (en) * | 1998-05-13 | 2002-05-28 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Semiconductor device and method of manufacturing semiconductor device |
-
1999
- 1999-06-04 FR FR9907056A patent/FR2794570B1/en not_active Expired - Fee Related
-
2000
- 2000-05-11 WO PCT/FR2000/001264 patent/WO2000075985A1/en not_active Ceased
- 2000-05-11 AU AU45753/00A patent/AU4575300A/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| FR2794570B1 (en) | 2003-07-18 |
| WO2000075985A1 (en) | 2000-12-14 |
| FR2794570A1 (en) | 2000-12-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |