AU4268999A - Integrated circuit module with one surface comprising an electrically insulated peripheral zone of the integrated circuit, and mixed connection card comprising such a module - Google Patents
Integrated circuit module with one surface comprising an electrically insulated peripheral zone of the integrated circuit, and mixed connection card comprising such a moduleInfo
- Publication number
- AU4268999A AU4268999A AU42689/99A AU4268999A AU4268999A AU 4268999 A AU4268999 A AU 4268999A AU 42689/99 A AU42689/99 A AU 42689/99A AU 4268999 A AU4268999 A AU 4268999A AU 4268999 A AU4268999 A AU 4268999A
- Authority
- AU
- Australia
- Prior art keywords
- integrated circuit
- module
- electrically insulated
- peripheral zone
- connection card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H10W70/699—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10719—Land grid array [LGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H10W90/754—
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9807912A FR2780201B1 (en) | 1998-06-23 | 1998-06-23 | INTEGRATED CIRCUIT MODULE HAVING A FACE COMPRISING AN ELECTRICALLY ISOLATED PERIPHERAL AREA FROM THE INTEGRATED CIRCUIT, AND MIXED CONNECTION CARD COMPRISING SUCH A MODULE |
| FR9807912 | 1998-06-23 | ||
| PCT/FR1999/001437 WO1999067822A1 (en) | 1998-06-23 | 1999-06-16 | Integrated circuit module with one surface comprising an electrically insulated peripheral zone of the integrated circuit, and mixed connection card comprising such a module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU4268999A true AU4268999A (en) | 2000-01-10 |
Family
ID=9527729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU42689/99A Abandoned AU4268999A (en) | 1998-06-23 | 1999-06-16 | Integrated circuit module with one surface comprising an electrically insulated peripheral zone of the integrated circuit, and mixed connection card comprising such a module |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1099254A1 (en) |
| JP (1) | JP2002519849A (en) |
| CN (1) | CN1312957A (en) |
| AU (1) | AU4268999A (en) |
| FR (1) | FR2780201B1 (en) |
| WO (1) | WO1999067822A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5403903B2 (en) | 2007-12-04 | 2014-01-29 | ルネサスエレクトロニクス株式会社 | Semiconductor device, manufacturing method thereof, and signal transmission / reception method using the semiconductor device |
| CN104934676B (en) * | 2015-06-23 | 2018-03-09 | 西安空间无线电技术研究所 | A kind of implementation method of millimeter wave frequency band Waveguide-microbelt transition structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2505091A1 (en) * | 1981-04-30 | 1982-11-05 | Cii Honeywell Bull | DEVICE FOR PROTECTING ELECTRONIC CIRCUITS SUCH AS INTEGRATED CIRCUITS AGAINST ELECTROSTATIC LOADS |
| US4483067A (en) * | 1981-09-11 | 1984-11-20 | U.S. Philips Corporation | Method of manufacturing an identification card and an identification manufactured, for example, by this method |
| FR2664076A1 (en) * | 1990-03-28 | 1992-01-03 | Schlumberger Ind Sa | METHOD FOR MANUFACTURING ELECTRONIC MEMORY CARD |
| FR2716281B1 (en) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Method of manufacturing a contactless card. |
-
1998
- 1998-06-23 FR FR9807912A patent/FR2780201B1/en not_active Expired - Fee Related
-
1999
- 1999-06-16 WO PCT/FR1999/001437 patent/WO1999067822A1/en not_active Ceased
- 1999-06-16 JP JP2000556399A patent/JP2002519849A/en active Pending
- 1999-06-16 CN CN99809474.9A patent/CN1312957A/en active Pending
- 1999-06-16 EP EP99957214A patent/EP1099254A1/en not_active Withdrawn
- 1999-06-16 AU AU42689/99A patent/AU4268999A/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN1312957A (en) | 2001-09-12 |
| JP2002519849A (en) | 2002-07-02 |
| FR2780201A1 (en) | 1999-12-24 |
| FR2780201B1 (en) | 2001-09-21 |
| EP1099254A1 (en) | 2001-05-16 |
| WO1999067822A1 (en) | 1999-12-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |