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AU4048197A - Lithography system with remote multisensor alignment - Google Patents

Lithography system with remote multisensor alignment

Info

Publication number
AU4048197A
AU4048197A AU40481/97A AU4048197A AU4048197A AU 4048197 A AU4048197 A AU 4048197A AU 40481/97 A AU40481/97 A AU 40481/97A AU 4048197 A AU4048197 A AU 4048197A AU 4048197 A AU4048197 A AU 4048197A
Authority
AU
Australia
Prior art keywords
multisensor
alignment
remote
lithography system
lithography
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU40481/97A
Inventor
David S. Holbrook
Shepard D. Johnson
Mark S. Lucas
Craig R. Simpson
John D Wallace
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MRS Tech Inc
Original Assignee
MRS Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/693,469 external-priority patent/US5739913A/en
Application filed by MRS Tech Inc filed Critical MRS Tech Inc
Publication of AU4048197A publication Critical patent/AU4048197A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
AU40481/97A 1996-08-02 1997-07-29 Lithography system with remote multisensor alignment Abandoned AU4048197A (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US69229096A 1996-08-02 1996-08-02
US08/693,469 US5739913A (en) 1996-08-02 1996-08-02 Non-contact edge detector
US08693469 1996-08-02
US08692290 1996-08-02
US73381096A 1996-10-18 1996-10-18
US08733810 1996-10-18
PCT/US1997/013362 WO1998006009A1 (en) 1996-08-02 1997-07-29 Lithography system with remote multisensor alignment

Publications (1)

Publication Number Publication Date
AU4048197A true AU4048197A (en) 1998-02-25

Family

ID=27418555

Family Applications (1)

Application Number Title Priority Date Filing Date
AU40481/97A Abandoned AU4048197A (en) 1996-08-02 1997-07-29 Lithography system with remote multisensor alignment

Country Status (2)

Country Link
AU (1) AU4048197A (en)
WO (1) WO1998006009A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG88823A1 (en) 1996-11-28 2002-05-21 Nikon Corp Projection exposure apparatus
JPH10209039A (en) 1997-01-27 1998-08-07 Nikon Corp Projection exposure method and projection exposure apparatus
EP1186959B1 (en) * 2000-09-07 2009-06-17 ASML Netherlands B.V. Method for calibrating a lithographic projection apparatus
US6785005B2 (en) 2001-09-21 2004-08-31 Nikon Corporation Switching type dual wafer stage
US7345736B2 (en) 2004-06-21 2008-03-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7408615B2 (en) * 2004-06-21 2008-08-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7440076B2 (en) * 2005-09-29 2008-10-21 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57183031A (en) * 1981-05-06 1982-11-11 Toshiba Corp Method for wafer exposure and device thereof
US4635373A (en) * 1984-09-07 1987-01-13 Canon Kabushiki Kaisha Wafer conveying apparatus with alignment mechanism
JPH0766192B2 (en) * 1988-05-30 1995-07-19 株式会社オーク製作所 Workpiece positioning method in automatic exposure apparatus
US5715064A (en) * 1994-06-17 1998-02-03 International Business Machines Corporation Step and repeat apparatus having enhanced accuracy and increased throughput
US5648854A (en) * 1995-04-19 1997-07-15 Nikon Corporation Alignment system with large area search for wafer edge and global marks

Also Published As

Publication number Publication date
WO1998006009A1 (en) 1998-02-12

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