AU3869000A - Methods to produce robust multilayer circuitry for electronic packaging - Google Patents

Methods to produce robust multilayer circuitry for electronic packaging

Info

Publication number: AU3869000A
Authority: AU; Australia
Prior art keywords: methods; electronic packaging; produce robust; multilayer circuitry; robust multilayer
Prior art date: 1999-04-01
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU38690/00A

Inventor

Daniel E. Baxter

Samuel Fu

Pradeep Gandhi

Gary E. Legerton

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Ormet Corp

Original Assignee

Ormet Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-04-01

Filing date

2000-03-06

Publication date

2000-10-23

2000-03-06 Application filed by Ormet Corp filed Critical Ormet Corp

2000-10-23 Publication of AU3869000A publication Critical patent/AU3869000A/en

Status Abandoned legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0574—Stacked resist layers used for different processes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing Of Printed Wiring (AREA)

AU38690/00A 1999-04-01 2000-03-06 Methods to produce robust multilayer circuitry for electronic packaging Abandoned AU3869000A (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US28366099A	1999-04-01	1999-04-01
US09283660		1999-04-01
PCT/US2000/005821 WO2000059645A1 (en)	1999-04-01	2000-03-06	Methods to produce robust multilayer circuitry for electronic packaging

Publications (1)

Publication Number	Publication Date
AU3869000A true AU3869000A (en)	2000-10-23

Family

ID=23087025

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU38690/00A Abandoned AU3869000A (en)	1999-04-01	2000-03-06	Methods to produce robust multilayer circuitry for electronic packaging

Country Status (2)

Country	Link
AU (1)	AU3869000A (en)
WO (1)	WO2000059645A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7059948B2 (en)	2000-12-22	2006-06-13	Applied Materials	Articles for polishing semiconductor substrates
US6887776B2 (en)	2003-04-11	2005-05-03	Applied Materials, Inc.	Methods to form metal lines using selective electrochemical deposition
US8221518B2 (en)	2009-04-02	2012-07-17	Ormet Circuits, Inc.	Conductive compositions containing blended alloy fillers
US8840700B2 (en)	2009-11-05	2014-09-23	Ormet Circuits, Inc.	Preparation of metallurgic network compositions and methods of use thereof
US9583453B2 (en)	2012-05-30	2017-02-28	Ormet Circuits, Inc.	Semiconductor packaging containing sintering die-attach material
US12053934B2 (en)	2012-06-18	2024-08-06	Ormet Circuits, Inc.	Conductive film adhesive
US9005330B2 (en)	2012-08-09	2015-04-14	Ormet Circuits, Inc.	Electrically conductive compositions comprising non-eutectic solder alloys
US11440142B2 (en)	2012-11-16	2022-09-13	Ormet Circuits, Inc.	Alternative compositions for high temperature soldering applications
US10446412B2 (en)	2015-04-13	2019-10-15	Printcb Ltd.	Printing of multi-layer circuits
CN112166653A (en)	2018-03-15	2021-01-01	以色列商普林特电路板有限公司	Two-component printable conductive composition
US11432402B2 (en) *	2018-10-11	2022-08-30	Microchip Technology Caldicot Limited	Flipped-conductor-patch lamination for ultra fine-line substrate creation
JPWO2020179874A1 (en) *	2019-03-06	2020-09-10

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3433251A1 (en) *	1984-08-16	1986-02-27	Robert Bosch Gmbh, 7000 Stuttgart	METHOD FOR PRODUCING GALVANIC SOLDER LAYERS ON INORGANIC SUBSTRATES
US5716663A (en) *	1990-02-09	1998-02-10	Toranaga Technologies	Multilayer printed circuit
JP2665134B2 (en) *	1993-09-03	1997-10-22	日本黒鉛工業株式会社	Flexible circuit board and method of manufacturing the same
US5922397A (en) *	1997-03-03	1999-07-13	Ormet Corporation	Metal-plating of cured and sintered transient liquid phase sintering pastes
US6068782A (en) *	1998-02-11	2000-05-30	Ormet Corporation	Individual embedded capacitors for laminated printed circuit boards

2000
- 2000-03-06 AU AU38690/00A patent/AU3869000A/en not_active Abandoned
- 2000-03-06 WO PCT/US2000/005821 patent/WO2000059645A1/en not_active Ceased

Also Published As

Publication number	Publication date
WO2000059645A1 (en)	2000-10-12

Publication	Publication Date	Title
SG102597A1 (en)	2004-03-26	Method for the packaging of electronic components
AU2001263067A1 (en)	2001-11-26	Electronic product design system
AU2001270964A1 (en)	2002-05-06	Transferring electronic content
AU1777601A (en)	2001-05-30	Electronic book having electronic commerce features
AU2001269662A1 (en)	2002-01-14	Electronic stamp
AU5171800A (en)	2000-12-18	Massively parallel interface for electronic circuit
AU2002215278A1 (en)	2002-06-11	Electronic commerce system
EP1041715B8 (en)	2007-10-10	Electronic component
AU4337600A (en)	2000-11-14	Interactive electronic book
AU2606801A (en)	2001-07-16	Electronic safe deposit box
AU3869000A (en)	2000-10-23	Methods to produce robust multilayer circuitry for electronic packaging
AU4579500A (en)	2000-11-21	Small electronic articles for personal use
AU2002326665A1 (en)	2003-03-10	Technique to minimize crosstalk in electronic packages
AU2033101A (en)	2001-06-18	A method and an arrangement relating to electronic circuitry
AU2001290235A1 (en)	2002-04-08	Electronic commerce system
AU2001280117A1 (en)	2002-03-04	Case for electronic parts
AU2002230594A1 (en)	2002-06-03	Electronic commerce system
AU2003221179A1 (en)	2003-10-08	Modular electronic device
AU3364201A (en)	2001-07-09	Electronic circuit
AU1242401A (en)	2001-05-08	Electronic document/form generator
AU2751300A (en)	2000-08-25	Electronic packaging system
GB2358563B (en)	2002-01-16	Electronic circuitry
AU2001237570A1 (en)	2001-10-15	Electronic commerce
GB2349524B (en)	2001-09-19	Electronic circuitry
AU9336101A (en)	2001-10-30	Electronic browser

Legal Events

Date	Code	Title	Description
2002-03-07	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase