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AU3714701A - Thermal expansion compensation for modular printhead assemblies - Google Patents

Thermal expansion compensation for modular printhead assemblies

Info

Publication number
AU3714701A
AU3714701A AU3714701A AU3714701A AU3714701A AU 3714701 A AU3714701 A AU 3714701A AU 3714701 A AU3714701 A AU 3714701A AU 3714701 A AU3714701 A AU 3714701A AU 3714701 A AU3714701 A AU 3714701A
Authority
AU
Australia
Prior art keywords
thermal expansion
expansion compensation
printhead assemblies
modular printhead
modular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
AU3714701A
Inventor
Kia Silverbrook
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silverbrook Research Pty Ltd
Original Assignee
Silverbrook Research Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from AUPQ6059A external-priority patent/AUPQ605900A0/en
Application filed by Silverbrook Research Pty Ltd filed Critical Silverbrook Research Pty Ltd
Priority to AU3714701A priority Critical patent/AU3714701A/en
Priority to AU2001237147A priority patent/AU2001237147B2/en
Publication of AU3714701A publication Critical patent/AU3714701A/en
Priority to AU2005201832A priority patent/AU2005201832B2/en
Pending legal-status Critical Current

Links

AU3714701A 2000-03-06 2001-03-06 Thermal expansion compensation for modular printhead assemblies Pending AU3714701A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU3714701A AU3714701A (en) 2000-03-06 2001-03-06 Thermal expansion compensation for modular printhead assemblies
AU2001237147A AU2001237147B2 (en) 2000-03-06 2001-03-06 Thermal expansion compensation for modular printhead assemblies
AU2005201832A AU2005201832B2 (en) 2000-03-06 2005-05-02 Laminated support structure for silicon printhead modules

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
AUPQ6059A AUPQ605900A0 (en) 2000-03-06 2000-03-06 Thermal expansion compensation for printhead assemblies
PCT/AU2001/000238 WO2001066354A1 (en) 2000-03-06 2001-03-06 Thermal expansion compensation for modular printhead assemblies
AU3714701A AU3714701A (en) 2000-03-06 2001-03-06 Thermal expansion compensation for modular printhead assemblies

Publications (1)

Publication Number Publication Date
AU3714701A true AU3714701A (en) 2001-09-17

Family

ID=25623912

Family Applications (2)

Application Number Title Priority Date Filing Date
AU3714701A Pending AU3714701A (en) 2000-03-06 2001-03-06 Thermal expansion compensation for modular printhead assemblies
AU2001237147A Ceased AU2001237147B2 (en) 2000-03-06 2001-03-06 Thermal expansion compensation for modular printhead assemblies

Family Applications After (1)

Application Number Title Priority Date Filing Date
AU2001237147A Ceased AU2001237147B2 (en) 2000-03-06 2001-03-06 Thermal expansion compensation for modular printhead assemblies

Country Status (1)

Country Link
AU (2) AU3714701A (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3520728B2 (en) * 1996-10-28 2004-04-19 セイコーエプソン株式会社 Ink jet recording head and method of manufacturing the same
JPH10128974A (en) * 1996-10-29 1998-05-19 Tec Corp Ink jet printer head
US6039439A (en) * 1998-06-19 2000-03-21 Lexmark International, Inc. Ink jet heater chip module

Also Published As

Publication number Publication date
AU2001237147B2 (en) 2005-02-03

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