AU3105400A - Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces - Google Patents

Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces

Info

Publication number: AU3105400A
Authority: AU; Australia
Prior art keywords: workpieces; electroplating; holding; methods; during electropolishing
Prior art date: 1998-11-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU31054/00A

Inventor

Felix Gutman

Voha Nuch

Hui Wang

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

ACM Research Inc

Original Assignee

ACM Research Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1998-11-28

Filing date

1999-11-24

Publication date

2000-06-19

1999-11-24 Application filed by ACM Research Inc filed Critical ACM Research Inc

2000-06-19 Publication of AU3105400A publication Critical patent/AU3105400A/en

Status Abandoned legal-status Critical Current

Classifications

- H10P72/7606—
- H10P72/50—
- H10P14/47—
- H10P72/7624—
- H10P72/7626—
- H10P95/04—

AU31054/00A 1998-11-28 1999-11-24 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces Abandoned AU3105400A (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US11013698P	1998-11-28	1998-11-28
US60110136		1998-11-28
PCT/US1999/028106 WO2000033356A2 (en)	1998-11-28	1999-11-24	Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces

Publications (1)

Publication Number	Publication Date
AU3105400A true AU3105400A (en)	2000-06-19

Family

ID=22331393

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU31054/00A Abandoned AU3105400A (en)	1998-11-28	1999-11-24	Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces

Country Status (9)

Country	Link
EP (1)	EP1133786A2 (en)
JP (2)	JP2002531702A (en)
KR (3)	KR100562011B1 (en)
CN (2)	CN100382235C (en)
AU (1)	AU3105400A (en)
CA (1)	CA2352160A1 (en)
IL (1)	IL143316A (en)
TW (1)	TW430919B (en)
WO (1)	WO2000033356A2 (en)

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JP2006511699A (en) *	2002-07-22	2006-04-06	エーシーエムリサーチ，インコーポレイティド	Adaptive electropolishing and barrier and sacrificial layer removal using thickness measurements
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JP3860111B2 (en) *	2002-12-19	2006-12-20	大日本スクリーン製造株式会社	Plating apparatus and plating method
US7842169B2 (en)	2003-03-04	2010-11-30	Applied Materials, Inc.	Method and apparatus for local polishing control
US7186164B2 (en)	2003-12-03	2007-03-06	Applied Materials, Inc.	Processing pad assembly with zone control
US7390744B2 (en)	2004-01-29	2008-06-24	Applied Materials, Inc.	Method and composition for polishing a substrate
US7084064B2 (en)	2004-09-14	2006-08-01	Applied Materials, Inc.	Full sequence metal and barrier layer electrochemical mechanical processing
US7520968B2 (en)	2004-10-05	2009-04-21	Applied Materials, Inc.	Conductive pad design modification for better wafer-pad contact
US7427340B2 (en)	2005-04-08	2008-09-23	Applied Materials, Inc.	Conductive pad
US7422982B2 (en)	2006-07-07	2008-09-09	Applied Materials, Inc.	Method and apparatus for electroprocessing a substrate with edge profile control
US8804535B2 (en) *	2009-03-25	2014-08-12	Avaya Inc.	System and method for sending packets using another device's network address
TWI410531B (en) *	2010-05-07	2013-10-01	Taiwan Semiconductor Mfg	Vertical plating equipment and plating method thereof
KR101211826B1 (en) *	2010-06-14	2012-12-18	연세대학교 산학협력단	Apparatus and method for polishing workpiece using magnetorheological fluid)
JP5782398B2 (en)	2012-03-27	2015-09-24	株式会社荏原製作所	Plating method and plating apparatus
US9399827B2 (en)	2013-04-29	2016-07-26	Applied Materials, Inc.	Microelectronic substrate electro processing system
WO2014179968A1 (en) *	2013-05-09	2014-11-13	Acm Research (Shanghai) Inc.	Apparatus and method for plating and/or polishing wafer
KR101353378B1 (en) *	2013-08-19	2014-01-22	주식회사 케이엠	Mixing joint for syringe
CN104465481A (en) *	2013-09-22	2015-03-25	盛美半导体设备（上海）有限公司	Wafer chuck
CN105297127B (en) *	2014-05-30	2019-04-05	盛美半导体设备（上海）有限公司	Ejecting device with electrode
JP6449091B2 (en) *	2015-04-20	2019-01-09	東京エレクトロン株式会社	Slip ring, support mechanism and plasma processing apparatus
US10053793B2 (en) *	2015-07-09	2018-08-21	Lam Research Corporation	Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
GB201701166D0 (en) *	2017-01-24	2017-03-08	Picofluidics Ltd	An apparatus for electrochemically processing semiconductor substrates
KR102156430B1 (en) *	2020-04-28	2020-09-15	주식회사 스마트코리아피씨비	Rotary Plating Equipment for Circuit Board
EP3998374A4 (en)	2020-09-16	2022-08-03	Changxin Memory Technologies, Inc.	AIR LEAK DETECTION DEVICE AND METHOD, AND WAFER ELECTRODEPOSITION METHOD
CN114262920A (en) *	2020-09-16	2022-04-01	长鑫存储技术有限公司	Wafer electroplating equipment, air leakage detection device and method and wafer electroplating method
CN112144096B (en) *	2020-09-25	2022-05-10	深圳市生利科技有限公司	Zinc-nickel alloy electroplating equipment
CN113013078A (en) *	2021-03-04	2021-06-22	苏州竣合信半导体科技有限公司	Compatible chip positioning groove for positioning chip and using method thereof

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1999
- 1999-11-24 KR KR1020057000594A patent/KR100562011B1/en not_active Expired - Fee Related
- 1999-11-24 IL IL14331699A patent/IL143316A/en not_active IP Right Cessation
- 1999-11-24 WO PCT/US1999/028106 patent/WO2000033356A2/en not_active Ceased
- 1999-11-24 KR KR10-2001-7006569A patent/KR100516776B1/en not_active Expired - Fee Related
- 1999-11-24 CN CNB2005100037736A patent/CN100382235C/en not_active Expired - Fee Related
- 1999-11-24 EP EP99965053A patent/EP1133786A2/en not_active Withdrawn
- 1999-11-24 AU AU31054/00A patent/AU3105400A/en not_active Abandoned
- 1999-11-24 CN CNB998137944A patent/CN1191605C/en not_active Expired - Fee Related
- 1999-11-24 JP JP2000585913A patent/JP2002531702A/en active Pending
- 1999-11-24 CA CA002352160A patent/CA2352160A1/en not_active Abandoned
- 1999-11-24 KR KR10-2004-7011238A patent/KR100503553B1/en not_active Expired - Fee Related
- 1999-11-26 TW TW088120687A patent/TW430919B/en not_active IP Right Cessation
2006
- 2006-11-22 JP JP2006315540A patent/JP2007119923A/en active Pending

Also Published As

Publication number	Publication date
EP1133786A2 (en)	2001-09-19
JP2007119923A (en)	2007-05-17
IL143316A (en)	2005-03-20
CN1346510A (en)	2002-04-24
KR20010086051A (en)	2001-09-07
KR20040070317A (en)	2004-08-06
KR100503553B1 (en)	2005-07-26
CN1632914A (en)	2005-06-29
IL143316A0 (en)	2002-04-21
WO2000033356A2 (en)	2000-06-08
KR100516776B1 (en)	2005-09-26
KR20050013179A (en)	2005-02-02
JP2002531702A (en)	2002-09-24
CN1191605C (en)	2005-03-02
CA2352160A1 (en)	2000-06-08
WO2000033356A3 (en)	2001-07-12
TW430919B (en)	2001-04-21
KR100562011B1 (en)	2006-03-22
WO2000033356A9 (en)	2001-08-02
CN100382235C (en)	2008-04-16

Publication	Publication Date	Title
AU3105400A (en)	2000-06-19	Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
IL140713A0 (en)	2002-02-10	Methods and apparatus for electropolishing metal interconnections on semiconductor devices
GB2292254B (en)	1998-12-23	Method for polishing semiconductor substrate and apparatus for the same
SG82654A1 (en)	2001-08-21	Two-piece clamp ring for holding semiconductor wafer or other workpiece
GB9726603D0 (en)	1998-02-18	Treatment method of semiconductor wafers and the like and treatment system for the same
AU3246701A (en)	2001-07-16	Method and apparatus for the treatment of substrates
AU2002257352A1 (en)	2002-12-09	Apparatus and methods for electrochemical processing of microelectronic workpieces
GB2372007B (en)	2004-01-21	Electrochemical machining method and apparatus
GB2330200B (en)	2000-09-27	Methods and apparatus for the in-process detection of workpieces
AU2001293745A1 (en)	2002-06-20	Device and method for the surface treatment of workpieces
AU2001229381A1 (en)	2001-07-24	Semiconductor workpiece proximity plating methods and apparatus
SG93851A1 (en)	2003-01-21	Method and apparatus for processing semiconductor substrates
AU3308699A (en)	1999-09-15	Apparatus and method for cleaning semiconductor wafers
EP0999012A3 (en)	2003-01-29	Method and apparatus for polishing substrate
AU2002343330A1 (en)	2003-03-10	Apparatus and methods for electrochemical processing of microelectronic workpieces
AU1974700A (en)	2000-07-03	Method and device for grinding workpieces with centers which comprise form variations
GB9904259D0 (en)	1999-04-21	Apparatus and method for the face-up surface treatment of wafers
EP1122016A4 (en)	2005-01-19	Apparatus for electrodischarge machining
SG87092A1 (en)	2002-03-19	Wafer, apparatus and method of chamfering wafer
GB9914083D0 (en)	1999-08-18	Method and apparatus for improved semiconductor wafer polishing
EP1147842A4 (en)	2004-06-09	Apparatus for electrodischarge machining
GB9321900D0 (en)	1993-12-15	Method and apparatus for the treatment of semiconductor substrates
AU1658300A (en)	2000-07-03	Method and tool holder for turning inside contours of workpieces
AU7070296A (en)	1996-11-18	Method and device for testing the hardness of workpieces and device for carrying out this process
AU5968594A (en)	1995-08-29	Process and device for the electrolytic surface coating of workpieces

Legal Events

Date	Code	Title	Description
2001-08-23	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase