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AU2900099A - Adhesive composition and precursor thereof - Google Patents

Adhesive composition and precursor thereof

Info

Publication number
AU2900099A
AU2900099A AU29000/99A AU2900099A AU2900099A AU 2900099 A AU2900099 A AU 2900099A AU 29000/99 A AU29000/99 A AU 29000/99A AU 2900099 A AU2900099 A AU 2900099A AU 2900099 A AU2900099 A AU 2900099A
Authority
AU
Australia
Prior art keywords
precursor
adhesive composition
adhesive
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU29000/99A
Inventor
Yuji Hiroshige
Kohichiro Kawate
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of AU2900099A publication Critical patent/AU2900099A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C09J167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
AU29000/99A 1998-03-31 1999-03-08 Adhesive composition and precursor thereof Abandoned AU2900099A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10086631A JPH11293217A (en) 1998-03-31 1998-03-31 Adhesive composition and its precursor
JP10/86631 1998-03-31
PCT/US1999/005017 WO1999050369A1 (en) 1998-03-31 1999-03-08 Adhesive composition and precursor thereof

Publications (1)

Publication Number Publication Date
AU2900099A true AU2900099A (en) 1999-10-18

Family

ID=13892387

Family Applications (1)

Application Number Title Priority Date Filing Date
AU29000/99A Abandoned AU2900099A (en) 1998-03-31 1999-03-08 Adhesive composition and precursor thereof

Country Status (4)

Country Link
EP (1) EP1068277A1 (en)
JP (1) JPH11293217A (en)
AU (1) AU2900099A (en)
WO (1) WO1999050369A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064276A (en) * 2000-08-22 2002-02-28 Nippon Steel Chem Co Ltd Light or thermosetting resin composition and multilayer printed wiring board
JP4605681B2 (en) * 2000-11-28 2011-01-05 日本化薬株式会社 Polycresol resin, epoxy resin composition and cured product thereof
JP2002327165A (en) * 2001-04-20 2002-11-15 Three M Innovative Properties Co Thermosetting adhesive film and adhesive structure given by using the same
DE102005027551A1 (en) 2005-06-14 2006-12-21 Basf Ag Method for producing a composite of stones and a plastic
EP3350275B1 (en) * 2015-09-15 2020-10-21 3M Innovative Properties Company An adhesive composition and an article manufactured therefrom

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4282136A (en) * 1979-04-09 1981-08-04 Hunt Earl R Flame retardant epoxy molding compound method and encapsulated device
JPH021789A (en) * 1988-02-24 1990-01-08 Matsushita Electric Works Ltd Epoxy resin adhesive and electrical circuit board
US5073605A (en) * 1988-07-14 1991-12-17 General Electric Company Bromine-bisphenol reacted bisphenol and novolak epoxy resins with polyphenylene ether
JP2915168B2 (en) * 1991-05-29 1999-07-05 ポリプラスチックス株式会社 Flame retardant polybutylene terephthalate resin composition
WO1996028512A1 (en) * 1995-03-10 1996-09-19 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Flame-retardant polyethylene terephthalate resin compositions

Also Published As

Publication number Publication date
WO1999050369A1 (en) 1999-10-07
EP1068277A1 (en) 2001-01-17
JPH11293217A (en) 1999-10-26

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase