AU2594399A - Components with releasable leads - Google Patents

Components with releasable leads

Info

Publication number: AU2594399A
Authority: AU; Australia
Prior art keywords: components; releasable; leads; releasable leads
Prior art date: 1998-02-09
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU25943/99A

Inventor

Hamid Eslampour

Belgacem Haba

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Adeia Semiconductor Solutions LLC

Original Assignee

Tessera LLC

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1998-02-09

Filing date

1999-02-09

Publication date

1999-08-23

1999-02-09 Application filed by Tessera LLC filed Critical Tessera LLC

1999-08-23 Publication of AU2594399A publication Critical patent/AU2594399A/en

Status Abandoned legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H10W70/05—
- H10W70/68—
- H10W70/688—
- H10W72/00—
- H10W72/20—
- H10W90/701—
- H10W44/212—
- H10W44/216—
- H10W72/072—
- H10W72/07236—
- H10W72/241—

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Wire Bonding (AREA)
Lead Frames For Integrated Circuits (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)

AU25943/99A 1998-02-09 1999-02-09 Components with releasable leads Abandoned AU2594399A (en)

Applications Claiming Priority (7)

Application Number	Priority Date	Filing Date	Title
US2075098A	1998-02-09	1998-02-09
US09020750		1998-02-09
US19537198A	1998-11-18	1998-11-18
US09195371		1998-11-18
US22566999A	1999-01-05	1999-01-05
US09225669		1999-01-05
PCT/US1999/002748 WO1999040761A1 (en)	1998-02-09	1999-02-09	Components with releasable leads

Publications (1)

Publication Number	Publication Date
AU2594399A true AU2594399A (en)	1999-08-23

Family

ID=27361503

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU25943/99A Abandoned AU2594399A (en)	1998-02-09	1999-02-09	Components with releasable leads

Country Status (5)

Country	Link
EP (1)	EP1059019A4 (en)
JP (1)	JP2002503038A (en)
KR (1)	KR100721725B1 (en)
AU (1)	AU2594399A (en)
WO (1)	WO1999040761A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6221750B1 (en)	1998-10-28	2001-04-24	Tessera, Inc.	Fabrication of deformable leads of microelectronic elements
US8021976B2 (en)	2002-10-15	2011-09-20	Megica Corporation	Method of wire bonding over active area of a semiconductor circuit
US7498196B2 (en)	2001-03-30	2009-03-03	Megica Corporation	Structure and manufacturing method of chip scale package
US8637778B2 (en)	2010-04-08	2014-01-28	Intel Corporation	Debond interconnect structures
JP6133093B2 (en) *	2013-03-25	2017-05-24	本田技研工業株式会社	Power converter

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5086337A (en) *	1987-01-19	1992-02-04	Hitachi, Ltd.	Connecting structure of electronic part and electronic device using the structure
US5679977A (en) *	1990-09-24	1997-10-21	Tessera, Inc.	Semiconductor chip assemblies, methods of making same and components for same
US5148266A (en) *	1990-09-24	1992-09-15	Ist Associates, Inc.	Semiconductor chip assemblies having interposer and flexible lead
JP3151219B2 (en) *	1992-07-24	2001-04-03	テツセラ，インコーポレイテッド	Semiconductor connection structure with detachable lead support and method of manufacturing the same
US5772451A (en) *	1993-11-16	1998-06-30	Form Factor, Inc.	Sockets for electronic components and methods of connecting to electronic components
US5518964A (en) *	1994-07-07	1996-05-21	Tessera, Inc.	Microelectronic mounting with multiple lead deformation and bonding
KR100407055B1 (en) *	1995-09-18	2004-03-31	테세라, 인코포레이티드	Microelectronic lead structures with dielectric layers

1999
- 1999-02-09 AU AU25943/99A patent/AU2594399A/en not_active Abandoned
- 1999-02-09 KR KR1020007008667A patent/KR100721725B1/en not_active Expired - Fee Related
- 1999-02-09 JP JP2000531040A patent/JP2002503038A/en not_active Withdrawn
- 1999-02-09 EP EP99905891A patent/EP1059019A4/en not_active Withdrawn
- 1999-02-09 WO PCT/US1999/002748 patent/WO1999040761A1/en not_active Ceased

Also Published As

Publication number	Publication date
EP1059019A1 (en)	2000-12-13
JP2002503038A (en)	2002-01-29
KR100721725B1 (en)	2007-05-28
EP1059019A4 (en)	2007-10-17
KR20010040775A (en)	2001-05-15
WO1999040761A1 (en)	1999-08-12

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AU2002300638A1 (en)	2003-02-13	Formworking

Legal Events

Date	Code	Title	Description
2000-10-26	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase