AU255050B2 - Method and device for dip soldering metal projections of electric component parts to printed wiring provided ona mounting plate
- Google Patents
Method and device for dip soldering metal projections of electric component parts to printed wiring provided ona mounting plate
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
HENRICUS JOSEPH VAN DUK and HENRI CAREL HABERKORN VAN RUSEWUK JOHANNES
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NVfiledCriticalPhilips Gloeilampenfabrieken NV
Application grantedgrantedCritical
Publication of AU1447362ApublicationCriticalpatent/AU1447362A/en
Publication of AU255050B2publicationCriticalpatent/AU255050B2/en
AU14473/62A1961-02-201962-02-19Method and device for dip soldering metal projections of electric component parts to printed wiring provided ona mounting plate
ExpiredAU255050B2
(en)