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AU2447900A - Apparatus and process for the slicing of monocrystalline silicon ingots - Google Patents

Apparatus and process for the slicing of monocrystalline silicon ingots

Info

Publication number
AU2447900A
AU2447900A AU24479/00A AU2447900A AU2447900A AU 2447900 A AU2447900 A AU 2447900A AU 24479/00 A AU24479/00 A AU 24479/00A AU 2447900 A AU2447900 A AU 2447900A AU 2447900 A AU2447900 A AU 2447900A
Authority
AU
Australia
Prior art keywords
slicing
monocrystalline silicon
silicon ingots
ingots
monocrystalline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU24479/00A
Inventor
Kobayashi Masayuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Europe Ltd
Original Assignee
Shin Etsu Handotai Europe Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Europe Ltd filed Critical Shin Etsu Handotai Europe Ltd
Publication of AU2447900A publication Critical patent/AU2447900A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU24479/00A 1999-02-12 2000-02-10 Apparatus and process for the slicing of monocrystalline silicon ingots Abandoned AU2447900A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9903081 1999-02-12
GBGB9903081.9A GB9903081D0 (en) 1999-02-12 1999-02-12 Improvements in or relating to the slicing of monocrystalline silicon ingots
PCT/GB2000/000393 WO2000047383A1 (en) 1999-02-12 2000-02-10 Apparatus and process for the slicing of monocrystalline silicon ingots

Publications (1)

Publication Number Publication Date
AU2447900A true AU2447900A (en) 2000-08-29

Family

ID=10847539

Family Applications (1)

Application Number Title Priority Date Filing Date
AU24479/00A Abandoned AU2447900A (en) 1999-02-12 2000-02-10 Apparatus and process for the slicing of monocrystalline silicon ingots

Country Status (3)

Country Link
AU (1) AU2447900A (en)
GB (1) GB9903081D0 (en)
WO (1) WO2000047383A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2777903B1 (en) * 2013-03-15 2017-07-26 Toyo Advanced Technologies Co., Ltd. ingot feeding system and method
FR3010922B1 (en) * 2013-09-24 2016-07-01 Commissariat Energie Atomique METHOD AND DEVICE FOR WIRED CUTTING OF A MATERIAL
EP3015237A1 (en) * 2014-10-29 2016-05-04 Applied Materials Switzerland Sàrl Wire monitoring system
EP3015238A1 (en) * 2014-10-29 2016-05-04 Applied Materials Switzerland Sàrl Wire monitoring system
CN111497045A (en) * 2020-04-24 2020-08-07 江苏晶科天晟能源有限公司 Optimized production process of solar monocrystalline silicon wafer
CN111873202A (en) * 2020-08-25 2020-11-03 青岛高测科技股份有限公司 Diamond wire cutting force measuring device and using method
CN115256664B (en) * 2022-07-25 2024-10-25 江苏拓正茂源新能源有限公司 Adjustable cutting machine for polycrystalline silicon rods

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4228782A (en) * 1978-09-08 1980-10-21 Rca Corporation System for regulating the applied blade-to-boule force during the slicing of wafers
JPS5741118A (en) * 1980-08-22 1982-03-08 Sumitomo Electric Ind Ltd Cutting of work
DE3469498D1 (en) * 1984-06-27 1988-04-07 Meyer & Burger Ag Maschf Cutting machine with measuring device and utilization of this measuring device
JPH0687118A (en) * 1992-09-04 1994-03-29 Nippon Steel Corp Cutting method with wire saw
JP2885270B2 (en) * 1995-06-01 1999-04-19 信越半導体株式会社 Wire saw device and work cutting method
JP2891187B2 (en) * 1995-06-22 1999-05-17 信越半導体株式会社 Wire saw device and cutting method
JP3107143B2 (en) * 1995-07-14 2000-11-06 株式会社東京精密 Wire traverse device for wire saw

Also Published As

Publication number Publication date
WO2000047383A1 (en) 2000-08-17
GB9903081D0 (en) 1999-03-31

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase