AU2305384A - Improved gold sulphite electroplating solutions - Google Patents
Improved gold sulphite electroplating solutionsInfo
- Publication number
- AU2305384A AU2305384A AU23053/84A AU2305384A AU2305384A AU 2305384 A AU2305384 A AU 2305384A AU 23053/84 A AU23053/84 A AU 23053/84A AU 2305384 A AU2305384 A AU 2305384A AU 2305384 A AU2305384 A AU 2305384A
- Authority
- AU
- Australia
- Prior art keywords
- electroplating solutions
- improved gold
- gold sulphite
- sulphite
- improved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 title 1
- SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical compound [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 title 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US461341 | 1983-01-28 | ||
| US06/461,341 US4435253A (en) | 1983-01-28 | 1983-01-28 | Gold sulphite electroplating solutions and methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2305384A true AU2305384A (en) | 1984-08-02 |
| AU561858B2 AU561858B2 (en) | 1987-05-21 |
Family
ID=23832180
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU23053/84A Ceased AU561858B2 (en) | 1983-01-28 | 1983-12-30 | Improved gold sulphite electroplating solutions |
| AU2305383A Pending AU2305383A (en) | 1983-01-28 | 1983-12-30 | Improved gold sulphite electroplating solutions |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2305383A Pending AU2305383A (en) | 1983-01-28 | 1983-12-30 | Improved gold sulphite electroplating solutions |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US4435253A (en) |
| JP (1) | JPH0657877B2 (en) |
| AU (2) | AU561858B2 (en) |
| BR (1) | BR8400347A (en) |
| CA (1) | CA1244373A (en) |
| DE (1) | DE3400670A1 (en) |
| FR (1) | FR2540142B1 (en) |
| GB (1) | GB2134138B (en) |
| IT (1) | IT1177510B (en) |
| NL (1) | NL8400075A (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5129143A (en) * | 1982-11-29 | 1992-07-14 | Amp Incorporated | Durable plating for electrical contact terminals |
| US5277790A (en) * | 1992-07-10 | 1994-01-11 | Technic Incorporated | Non-cyanide electroplating solution for gold or alloys thereof |
| DE4226167C2 (en) * | 1992-08-07 | 1996-10-24 | Sel Alcatel Ag | Method for electrically conductive connection using flip-chip technology |
| US5632438A (en) * | 1995-10-12 | 1997-05-27 | International Business Machines Corporation | Direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization |
| DE19745602C1 (en) * | 1997-10-08 | 1999-07-15 | Atotech Deutschland Gmbh | Method and solution for the production of gold layers |
| DE10110743A1 (en) * | 2001-02-28 | 2002-09-05 | Wieland Dental & Technik Gmbh | Bath for the electrodeposition of gold and gold alloys and its use |
| US20050092616A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Baths, methods, and tools for superconformal deposition of conductive materials other than copper |
| DE102005036133C5 (en) | 2005-07-26 | 2017-07-13 | Ivoclar Vivadent Ag | Bath for the electrodeposition of gold and gold alloys and additive mixture for such a bath |
| US8420520B2 (en) * | 2006-05-18 | 2013-04-16 | Megica Corporation | Non-cyanide gold electroplating for fine-line gold traces and gold pads |
| DE102009024396A1 (en) | 2009-06-09 | 2010-12-16 | Coventya Spa | Cyanide-free electrolyte for electrodeposition of gold or its alloys |
| DE102010053676A1 (en) | 2010-12-07 | 2012-06-14 | Coventya Spa | Electrolyte for the electrodeposition of gold alloys and process for its production |
| CN105112953A (en) * | 2015-09-17 | 2015-12-02 | 深圳市瑞世兴科技有限公司 | Cyanide-free gold plating solution |
| IT202200022545A1 (en) * | 2022-11-03 | 2024-05-03 | Valmet Plating S R L | Additive for gold-based galvanic baths |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3475292A (en) | 1966-02-10 | 1969-10-28 | Technic | Gold plating bath and process |
| US3562120A (en) * | 1966-09-07 | 1971-02-09 | Sel Rex Corp | Plating of smooth,semibright gold deposits |
| US3644184A (en) * | 1970-06-29 | 1972-02-22 | Sel Rex Corp | Electrolytic gold plating solutions and methods for using same |
| US3666640A (en) | 1971-04-23 | 1972-05-30 | Sel Rex Corp | Gold plating bath and process |
| US3776822A (en) * | 1972-03-27 | 1973-12-04 | Engelhard Min & Chem | Gold plating electrolyte |
| US4012294A (en) * | 1972-08-10 | 1977-03-15 | Oxy Metal Industries Corporation | Gold sulfite baths containing organophosphorous compounds |
| JPS5090538A (en) * | 1973-12-13 | 1975-07-19 | ||
| US3990954A (en) | 1973-12-17 | 1976-11-09 | Oxy Metal Industries Corporation | Sulfite gold plating bath and process |
| DE2445538C2 (en) | 1974-09-20 | 1984-05-30 | Schering AG, 1000 Berlin und 4709 Bergkamen | Cyanide-free bath and process for the electrodeposition of precious metal alloys |
| JPS53129260A (en) * | 1977-04-19 | 1978-11-11 | Junkosha Co Ltd | Production of continuous porous body comprising hydrophilic tetra fluorinated ethylene resin |
| US4199416A (en) | 1977-05-03 | 1980-04-22 | Johnson, Matthey & Co., Limited | Composition for the electroplating of gold |
| CH622829A5 (en) * | 1977-08-29 | 1981-04-30 | Systemes Traitements Surfaces | |
| CS227302B2 (en) * | 1978-08-04 | 1984-04-16 | Uniroyal Inc | Method of inhibiting oxidative degradation of organic materials |
| JPS5534235A (en) * | 1978-08-31 | 1980-03-10 | Dainippon Toryo Co Ltd | Coating composition |
| JPS5826436B2 (en) * | 1979-06-19 | 1983-06-02 | ニナ アレクサンドロフナ スマグノヴア | Electrolyte for gold plating |
| JPS5684495A (en) * | 1979-12-12 | 1981-07-09 | Electroplating Eng Of Japan Co | Pure gold plating liquid |
| JPS56108892A (en) * | 1980-01-31 | 1981-08-28 | Electroplating Eng Of Japan Co | Plating solution with pure gold |
| US4253920A (en) | 1980-03-20 | 1981-03-03 | American Chemical & Refining Company, Incorporated | Composition and method for gold plating |
-
1983
- 1983-01-28 US US06/461,341 patent/US4435253A/en not_active Expired - Lifetime
- 1983-12-30 AU AU23053/84A patent/AU561858B2/en not_active Ceased
- 1983-12-30 AU AU2305383A patent/AU2305383A/en active Pending
-
1984
- 1984-01-05 CA CA000444728A patent/CA1244373A/en not_active Expired
- 1984-01-10 NL NL8400075A patent/NL8400075A/en not_active Application Discontinuation
- 1984-01-11 DE DE19843400670 patent/DE3400670A1/en active Granted
- 1984-01-19 FR FR8400801A patent/FR2540142B1/en not_active Expired
- 1984-01-25 JP JP59011802A patent/JPH0657877B2/en not_active Expired - Lifetime
- 1984-01-25 IT IT47591/84A patent/IT1177510B/en active
- 1984-01-27 GB GB08402223A patent/GB2134138B/en not_active Expired
- 1984-01-27 BR BR8400347A patent/BR8400347A/en not_active IP Right Cessation
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