AU2270288A - Apparatus for the application of materials - Google Patents

Apparatus for the application of materials

Info

Publication number: AU2270288A
Authority: AU; Australia
Prior art keywords: materials; application
Prior art date: 1987-09-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

AU22702/88A

Other versions

AU605631B2 (en

Inventor

Rolf Adam

Hans Dr. Aichert

Hans Dr. Betz

Gregor A. Campbell

Robert W. Conn

Anton Dr. Dietrich

Gonde Dr. Dittmer

Daniel M. Goebel

Klaus Dr. Hartig

Friedrich Hass

Rainer Dr. Ludwig

Max Dr. Mayr

Alfred Dr. Thelen

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Dr Alfred Thelen

Original Assignee

Leybold AG

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-09-21

Filing date

1988-09-21

Publication date

1989-03-23

1988-05-20 Priority claimed from US07/197,040 external-priority patent/US4885070A/en

1988-09-21 Application filed by Leybold AG filed Critical Leybold AG

1989-03-23 Publication of AU2270288A publication Critical patent/AU2270288A/en

1991-01-17 Application granted granted Critical

1991-01-17 Publication of AU605631B2 publication Critical patent/AU605631B2/en

1993-07-22 Assigned to DR. ALFRED THELEN reassignment DR. ALFRED THELEN Alteration of Name(s) in Register under S187 Assignors: LEYBOLD AKTIENGESELLSCHAFT

2008-09-21 Anticipated expiration legal-status Critical

Status Ceased legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/46—Sputtering by ion beam produced by an external ion source

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Physics & Mathematics (AREA)
Plasma & Fusion (AREA)
Analytical Chemistry (AREA)
Physical Vapour Deposition (AREA)

AU22702/88A 1987-09-21 1988-09-21 Apparatus for the application of materials Ceased AU605631B2 (en)

Applications Claiming Priority (6)

Application Number	Priority Date	Filing Date	Title
DE3731693		1987-09-21
DE3731693		1987-09-21
US15520688A	1988-02-12	1988-02-12
US197040		1988-05-20
US07/197,040 US4885070A (en)	1988-02-12	1988-05-20	Method and apparatus for the application of materials
US155206		1993-11-22

Publications (2)

Publication Number	Publication Date
AU2270288A true AU2270288A (en)	1989-03-23
AU605631B2 AU605631B2 (en)	1991-01-17

Family

ID=27196521

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU22702/88A Ceased AU605631B2 (en)	1987-09-21	1988-09-21	Apparatus for the application of materials

Country Status (5)

Country	Link
EP (1)	EP0308680A1 (en)
JP (1)	JPH01108374A (en)
CN (1)	CN1033297A (en)
AU (1)	AU605631B2 (en)
RU (1)	RU1797629C (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN113846304A (en) *	2021-11-26	2021-12-28	北京航空航天大学	Target head, magnetron sputtering target gun and magnetron sputtering system

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3904991A1 (en) *	1989-02-18	1990-08-23	Leybold Ag	Cathode sputtering device
DE4026367A1 (en) *	1990-06-25	1992-03-12	Leybold Ag	DEVICE FOR COATING SUBSTRATES
UA73290C2 (en) *	1999-08-04	2005-07-15	Дженерал Електрік Компані	An electron beam apparatus for producing a coating by condensation of vapour phase (variants)
US6264804B1 (en)	2000-04-12	2001-07-24	Ske Technology Corp.	System and method for handling and masking a substrate in a sputter deposition system
CH696013A5 (en) *	2002-10-03	2006-11-15	Tetra Laval Holdings & Finance	An apparatus for treating a strip-like material in a plasma-assisted process.
US7879209B2 (en) *	2004-08-20	2011-02-01	Jds Uniphase Corporation	Cathode for sputter coating
JP4820996B2 (en) *	2005-05-30	2011-11-24	大学共同利用機関法人自然科学研究機構	Noble gas immobilization device and immobilization method
JP4983087B2 (en) *	2006-04-27	2012-07-25	富士通セミコンダクター株式会社	Film-forming method, semiconductor device manufacturing method, computer-readable recording medium, sputtering apparatus
JP6447459B2 (en) *	2015-10-28	2019-01-09	住友金属鉱山株式会社	Film forming method and apparatus, and film forming apparatus manufacturing apparatus
SG11202005894VA (en)	2017-12-22	2020-07-29	Institute Of Geological And Nuclear Sciences Ltd	Ion beam sputtering apparatus and method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4090941A (en) *	1977-03-18	1978-05-23	United Technologies Corporation	Cathode sputtering apparatus
GB1544612A (en) *	1978-01-04	1979-04-25	Dmitriev J	Apparatus for ion plasma coating of articles
DE3107914A1 (en) *	1981-03-02	1982-09-16	Leybold-Heraeus GmbH, 5000 Köln	METHOD AND DEVICE FOR COATING MOLDED PARTS BY CATODENSIONING

1988
- 1988-08-26 EP EP19880113900 patent/EP0308680A1/en not_active Withdrawn
- 1988-09-20 RU SU884356495A patent/RU1797629C/en active
- 1988-09-21 AU AU22702/88A patent/AU605631B2/en not_active Ceased
- 1988-09-21 JP JP23514088A patent/JPH01108374A/en active Pending
- 1988-09-21 CN CN 88106899 patent/CN1033297A/en active Pending

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN113846304A (en) *	2021-11-26	2021-12-28	北京航空航天大学	Target head, magnetron sputtering target gun and magnetron sputtering system
CN113846304B (en) *	2021-11-26	2022-02-11	北京航空航天大学	Target head, magnetron sputtering target gun and magnetron sputtering system

Also Published As

Publication number	Publication date
RU1797629C (en)	1993-02-23
CN1033297A (en)	1989-06-07
AU605631B2 (en)	1991-01-17
EP0308680A1 (en)	1989-03-29
JPH01108374A (en)	1989-04-25

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