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AU2003304587A1 - Epoxy resin composition and semiconductor device using the same - Google Patents

Epoxy resin composition and semiconductor device using the same

Info

Publication number
AU2003304587A1
AU2003304587A1 AU2003304587A AU2003304587A AU2003304587A1 AU 2003304587 A1 AU2003304587 A1 AU 2003304587A1 AU 2003304587 A AU2003304587 A AU 2003304587A AU 2003304587 A AU2003304587 A AU 2003304587A AU 2003304587 A1 AU2003304587 A1 AU 2003304587A1
Authority
AU
Australia
Prior art keywords
same
semiconductor device
resin composition
epoxy resin
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003304587A
Inventor
Youichi Hashimoto
Masashi Nakamura
Takayuki Tsuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of AU2003304587A1 publication Critical patent/AU2003304587A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
AU2003304587A 2003-12-01 2003-12-01 Epoxy resin composition and semiconductor device using the same Abandoned AU2003304587A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/015356 WO2005054331A1 (en) 2003-12-01 2003-12-01 Epoxy resin composition and semiconductor device using the same

Publications (1)

Publication Number Publication Date
AU2003304587A1 true AU2003304587A1 (en) 2005-06-24

Family

ID=34640422

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003304587A Abandoned AU2003304587A1 (en) 2003-12-01 2003-12-01 Epoxy resin composition and semiconductor device using the same

Country Status (3)

Country Link
JP (1) JPWO2005054331A1 (en)
AU (1) AU2003304587A1 (en)
WO (1) WO2005054331A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5342221B2 (en) * 2008-12-05 2013-11-13 パナソニック株式会社 Epoxy resin inorganic composite sheet for semiconductor encapsulation and molded product
JP5920040B2 (en) * 2012-06-12 2016-05-18 日立化成株式会社 Thermosetting resin composition and semiconductor device using the same
CN108192288A (en) * 2017-12-29 2018-06-22 定远县丹宝树脂有限公司 A kind of resistance to oil epoxy resin and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0811778B2 (en) * 1987-12-21 1996-02-07 松下電工株式会社 Epoxy resin molding material for semiconductor encapsulation
JPH0668061B2 (en) * 1989-01-19 1994-08-31 松下電工株式会社 Epoxy resin molding material for semiconductor encapsulation
JPH1135803A (en) * 1997-07-23 1999-02-09 Toshiba Chem Corp Epoxy resin composition and bga type semiconductor sealing device
JP2000355620A (en) * 1999-04-15 2000-12-26 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP4710200B2 (en) * 2001-08-30 2011-06-29 住友ベークライト株式会社 Manufacturing method of area mounting type semiconductor sealing epoxy resin composition and area mounting type semiconductor device

Also Published As

Publication number Publication date
WO2005054331A1 (en) 2005-06-16
JPWO2005054331A1 (en) 2007-06-28

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase