AU2003222499A1 - Method of calibrating marking in laser marking system - Google Patents

Method of calibrating marking in laser marking system

Info

Publication number: AU2003222499A1
Authority: AU; Australia
Prior art keywords: marking; calibrating; laser; laser marking; marking system
Prior art date: 2002-04-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2003222499A

Inventor

Young-Sik Byun

Byoung-Hwan Kim

Tae-Jung Kim

Goo-Cheol Kwon

Jeong-Ku Lee

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

EO Technics Co Ltd

Original Assignee

EO Technics Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-04-26

Filing date

2003-04-25

Publication date

2003-11-10

2002-04-26 Priority claimed from KR1020020023108A external-priority patent/KR20030084406A/en

2003-02-17 Priority claimed from KR10-2003-0009877A external-priority patent/KR100520899B1/en

2003-04-25 Application filed by EO Technics Co Ltd filed Critical EO Technics Co Ltd

2003-11-10 Publication of AU2003222499A1 publication Critical patent/AU2003222499A1/en

Status Abandoned legal-status Critical Current

Classifications

- H10P72/0614—
- H10P72/53—
- H10W46/00—
- H10P72/741—
- H10W46/601—

AU2003222499A 2002-04-26 2003-04-25 Method of calibrating marking in laser marking system Abandoned AU2003222499A1 (en)

Applications Claiming Priority (5)

Application Number	Priority Date	Filing Date	Title
KR1020020023108A KR20030084406A (en)	2002-04-26	2002-04-26	Laser marking method using camera
KR10-2002-0023108		2002-04-26
KR10-2003-0009877		2003-02-17
KR10-2003-0009877A KR100520899B1 (en)	2003-02-17	2003-02-17	Calibrating method of marking for lazer marking system
PCT/KR2003/000841 WO2003092069A1 (en)	2002-04-26	2003-04-25	Method of calibrating marking in laser marking system

Publications (1)

Publication Number	Publication Date
AU2003222499A1 true AU2003222499A1 (en)	2003-11-10

Family

ID=29272439

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2003222499A Abandoned AU2003222499A1 (en)	2002-04-26	2003-04-25	Method of calibrating marking in laser marking system

Country Status (5)

Country	Link
JP (1)	JP2005523820A (en)
CN (1)	CN100358142C (en)
AU (1)	AU2003222499A1 (en)
TW (1)	TW592866B (en)
WO (1)	WO2003092069A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20040144760A1 (en)	2002-05-17	2004-07-29	Cahill Steven P.	Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein
CN101327483B (en) *	2007-06-20	2012-02-08	京元电子股份有限公司	Chip sorting device and method
CN101355011B (en) *	2007-07-24	2010-11-17	京元电子股份有限公司	Wafer laser engraving method and system
CN101832772B (en) *	2010-06-01	2012-05-02	郑州辰维科技有限公司	Calibration method for laser dot matrix device of obstacle avoidance system of lunar vehicle
KR101061056B1 (en)	2011-03-29	2011-09-01	주식회사 투아이스펙트라	Glass Plate Marking Device
TWI543830B (en) *	2013-05-10	2016-08-01	財團法人工業技術研究院	Visual error correction method
US9911632B2 (en) *	2013-10-23	2018-03-06	Ats Automation Tooling Systems Inc.	Multiple part decoration system and method
US9950389B1 (en)	2014-09-19	2018-04-24	EMC IP Holding Company LLC	Laser calibration
US20170323708A1 (en) *	2016-05-03	2017-11-09	Texas Instruments Incorporated	Component sheet and method of singulating
CN108074853A (en) *	2017-04-27	2018-05-25	深圳市东飞凌科技有限公司	Wafer alignment method and device
CN114695226A (en) *	2020-12-31	2022-07-01	大族激光科技产业集团股份有限公司	Full-automatic wafer back laser marking device and method
CN114549560B (en) *	2022-03-02	2025-02-14	科为升视觉技术（苏州）有限公司	A chip cutting route calculation method, system and readable storage medium
CN115195322B (en) *	2022-07-29	2023-06-06	韦孚智能科技(上海)有限公司	Visual marking method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH01194322A (en) *	1988-01-29	1989-08-04	Canon Inc	Semiconductor printer
JPH01318947A (en) *	1988-06-20	1989-12-25	Hitachi Ltd	X-ray inspecting apparatus
JPH04330754A (en) *	1991-03-02	1992-11-18	Toshiba Corp	Identifyer of carrier box semiconductor substrate
KR20000008807A (en) *	1998-07-16	2000-02-15	한영수	Method and device for manufacturing resin plate for decoration
US6160831A (en) *	1998-10-26	2000-12-12	Lambda Physik Gmbh	Wavelength calibration tool for narrow band excimer lasers
KR20000008807U (en) *	1998-10-28	2000-05-25	김영환	Marking device for semiconductor package
KR100327101B1 (en) *	1999-08-11	2002-03-18	김주환	An automatic teaching method in marking inspection process of a semiconductor packages

2003
- 2003-04-23 TW TW092109454A patent/TW592866B/en not_active IP Right Cessation
- 2003-04-25 CN CNB03809410XA patent/CN100358142C/en not_active Expired - Fee Related
- 2003-04-25 JP JP2004500330A patent/JP2005523820A/en active Pending
- 2003-04-25 WO PCT/KR2003/000841 patent/WO2003092069A1/en not_active Ceased
- 2003-04-25 AU AU2003222499A patent/AU2003222499A1/en not_active Abandoned

Also Published As

Publication number	Publication date
CN1650428A (en)	2005-08-03
TW200305475A (en)	2003-11-01
TW592866B (en)	2004-06-21
WO2003092069A1 (en)	2003-11-06
JP2005523820A (en)	2005-08-11
CN100358142C (en)	2007-12-26

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Legal Events

Date	Code	Title	Description
2005-01-13	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase