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AU2003211032A1 - Solder paste formulations, methods of production and uses thereof - Google Patents

Solder paste formulations, methods of production and uses thereof

Info

Publication number
AU2003211032A1
AU2003211032A1 AU2003211032A AU2003211032A AU2003211032A1 AU 2003211032 A1 AU2003211032 A1 AU 2003211032A1 AU 2003211032 A AU2003211032 A AU 2003211032A AU 2003211032 A AU2003211032 A AU 2003211032A AU 2003211032 A1 AU2003211032 A1 AU 2003211032A1
Authority
AU
Australia
Prior art keywords
production
methods
solder paste
paste formulations
formulations
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003211032A
Inventor
John Lalena
Kim-Chi Le
Martin Weiser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of AU2003211032A1 publication Critical patent/AU2003211032A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU2003211032A 2002-02-13 2003-02-12 Solder paste formulations, methods of production and uses thereof Abandoned AU2003211032A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US35775402P 2002-02-13 2002-02-13
US60/357,754 2002-02-13
PCT/US2003/004374 WO2003068447A1 (en) 2002-02-13 2003-02-12 Solder paste formulations, methods of production and uses thereof

Publications (1)

Publication Number Publication Date
AU2003211032A1 true AU2003211032A1 (en) 2003-09-04

Family

ID=27734762

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003211032A Abandoned AU2003211032A1 (en) 2002-02-13 2003-02-12 Solder paste formulations, methods of production and uses thereof

Country Status (3)

Country Link
AU (1) AU2003211032A1 (en)
TW (1) TW200414958A (en)
WO (1) WO2003068447A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6830632B1 (en) 2002-07-24 2004-12-14 Lucas Milhaupt, Inc. Flux cored preforms for brazing
BRPI0618466A2 (en) 2005-11-10 2011-08-30 Wolverine Tube Inc flux composition, continuous length elastomeric brazing material containing a flux, as well as methods for the manufacture of brazing material and for brazing welding
US8274014B2 (en) 2006-05-25 2012-09-25 Bellman-Melcor Development, Llc Filler metal with flux for brazing and soldering and method of making and using same
EP2091686B1 (en) 2006-12-11 2016-06-15 Lucas-Milhaupt, Inc. Low and non-silver filler metals and alloys and corresponding joinder systems and methods
WO2011053506A1 (en) 2009-10-26 2011-05-05 Lucas-Milhaupt, Inc. Low silver, low nickel brazing material
CN102267025B (en) * 2011-07-28 2013-07-03 常州佳讯光电产业发展有限公司 No-clean low-rosin soldering flux
EP2703115B1 (en) * 2012-08-28 2019-10-09 SAXONIA Technical Materials GmbH Soldering paste
US9314862B2 (en) 2013-05-30 2016-04-19 Lucas-Milhaupt, Inc. Process for flux coating braze preforms and discrete parts
US9731383B2 (en) 2014-07-09 2017-08-15 Bellman-Melcor Development, Llc Filler metal with flux for brazing and soldering and method of using same
CN104384747B (en) * 2014-10-08 2017-10-13 深圳市唯特偶新材料股份有限公司 One kind exempts from refrigeration solder(ing) paste and preparation method thereof
US10744601B2 (en) 2015-08-07 2020-08-18 Bellman-Melcor Development, Llc Bonded brazing ring system and method for adhering a brazing ring to a tube
CN109226993A (en) * 2018-08-30 2019-01-18 桂林电子科技大学 A kind of micron of copper-silver paste Heat Conduction Material and preparation method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4218248A (en) * 1978-04-21 1980-08-19 Scm Corporation Process for the manufacture of metal joining paste
US4619715A (en) * 1984-09-11 1986-10-28 Scm Corporation Fusible powdered metal paste
US4988395A (en) * 1989-01-31 1991-01-29 Senju Metal Industry Co., Ltd. Water-soluble soldering flux and paste solder using the flux
JP3220635B2 (en) * 1996-02-09 2001-10-22 松下電器産業株式会社 Solder alloy and cream solder

Also Published As

Publication number Publication date
WO2003068447A1 (en) 2003-08-21
TW200414958A (en) 2004-08-16

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase