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AU2003299987A1 - Ultrasonic bonding of electrical devices - Google Patents

Ultrasonic bonding of electrical devices

Info

Publication number
AU2003299987A1
AU2003299987A1 AU2003299987A AU2003299987A AU2003299987A1 AU 2003299987 A1 AU2003299987 A1 AU 2003299987A1 AU 2003299987 A AU2003299987 A AU 2003299987A AU 2003299987 A AU2003299987 A AU 2003299987A AU 2003299987 A1 AU2003299987 A1 AU 2003299987A1
Authority
AU
Australia
Prior art keywords
electrical devices
ultrasonic bonding
ultrasonic
bonding
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003299987A
Inventor
Michael Kober
Stefan Mieslinger
Herbert J. Neuhaus
Bin Zou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NanoPierce Technologies Inc
Original Assignee
NanoPierce Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NanoPierce Technologies Inc filed Critical NanoPierce Technologies Inc
Publication of AU2003299987A1 publication Critical patent/AU2003299987A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H10W72/07233—
    • H10W72/07251—
    • H10W72/07255—
    • H10W72/07541—
    • H10W72/20—
    • H10W72/251—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/952—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
AU2003299987A 2003-01-03 2003-12-23 Ultrasonic bonding of electrical devices Abandoned AU2003299987A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US43786603P 2003-01-03 2003-01-03
US60/437,866 2003-01-03
PCT/US2003/041397 WO2004062842A1 (en) 2003-01-03 2003-12-23 Ultrasonic bonding of electrical devices

Publications (1)

Publication Number Publication Date
AU2003299987A1 true AU2003299987A1 (en) 2004-08-10

Family

ID=32713242

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003299987A Abandoned AU2003299987A1 (en) 2003-01-03 2003-12-23 Ultrasonic bonding of electrical devices

Country Status (2)

Country Link
AU (1) AU2003299987A1 (en)
WO (1) WO2004062842A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007020475A1 (en) 2007-04-27 2008-11-06 Häusermann GmbH Method for producing a printed circuit board with a cavity for the integration of components and printed circuit board and application
GB2458942B (en) * 2008-04-03 2013-04-03 Amberjac Projects Ltd Improvements in or relating to battery modules
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
US8858744B2 (en) 2011-11-18 2014-10-14 Nike, Inc. Multi-functional manufacturing tool
US8958901B2 (en) 2011-11-18 2015-02-17 Nike, Inc. Automated manufacturing of shoe parts
US8755925B2 (en) 2011-11-18 2014-06-17 Nike, Inc. Automated identification and assembly of shoe parts
US9451810B2 (en) 2011-11-18 2016-09-27 Nike, Inc. Automated identification of shoe parts
US8960745B2 (en) 2011-11-18 2015-02-24 Nike, Inc Zoned activation manufacturing vacuum tool
US9010827B2 (en) 2011-11-18 2015-04-21 Nike, Inc. Switchable plate manufacturing vacuum tool
US10552551B2 (en) 2011-11-18 2020-02-04 Nike, Inc. Generation of tool paths for shore assembly
US8696043B2 (en) 2011-11-18 2014-04-15 Nike, Inc. Hybrid pickup tool
US8849620B2 (en) 2011-11-18 2014-09-30 Nike, Inc. Automated 3-D modeling of shoe parts
US20130240152A1 (en) * 2012-03-15 2013-09-19 Nike, Inc. Hollow tip welding tool
CN109822206A (en) * 2019-03-26 2019-05-31 上海工程技术大学 An ultra-thin aluminum-copper ultrasonic welding process
CN115815776B (en) * 2023-02-15 2023-05-16 中北大学 Ultrasonic-electric field assisted vacuum hot-pressing heterogeneous interface diffusion forming device and process

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59111337A (en) * 1982-12-16 1984-06-27 Matsushita Electric Ind Co Ltd Bonding method
US6045026A (en) * 1998-02-23 2000-04-04 Micron Technology, Inc. Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
JP2000068327A (en) * 1998-08-20 2000-03-03 Matsushita Electric Ind Co Ltd Component mounting method and equipment

Also Published As

Publication number Publication date
WO2004062842A1 (en) 2004-07-29

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase