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AU2003297065A1 - Chamber for uniform substrate heating - Google Patents

Chamber for uniform substrate heating

Info

Publication number
AU2003297065A1
AU2003297065A1 AU2003297065A AU2003297065A AU2003297065A1 AU 2003297065 A1 AU2003297065 A1 AU 2003297065A1 AU 2003297065 A AU2003297065 A AU 2003297065A AU 2003297065 A AU2003297065 A AU 2003297065A AU 2003297065 A1 AU2003297065 A1 AU 2003297065A1
Authority
AU
Australia
Prior art keywords
chamber
substrate heating
uniform substrate
uniform
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003297065A
Other versions
AU2003297065A8 (en
Inventor
Akihiro Hosokawa
Makoto Inagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of AU2003297065A1 publication Critical patent/AU2003297065A1/en
Publication of AU2003297065A8 publication Critical patent/AU2003297065A8/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10P72/0434
    • H10P72/0431
AU2003297065A 2002-12-17 2003-12-15 Chamber for uniform substrate heating Abandoned AU2003297065A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US43406402P 2002-12-17 2002-12-17
US60/434,064 2002-12-17
PCT/US2003/039783 WO2004061914A2 (en) 2002-12-17 2003-12-15 Chamber for uniform substrate heating

Publications (2)

Publication Number Publication Date
AU2003297065A1 true AU2003297065A1 (en) 2004-07-29
AU2003297065A8 AU2003297065A8 (en) 2008-03-13

Family

ID=32713006

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003297065A Abandoned AU2003297065A1 (en) 2002-12-17 2003-12-15 Chamber for uniform substrate heating

Country Status (6)

Country Link
JP (1) JP2006515433A (en)
KR (1) KR101035828B1 (en)
CN (1) CN1748285B (en)
AU (1) AU2003297065A1 (en)
TW (1) TWI279828B (en)
WO (1) WO2004061914A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7326877B2 (en) * 2004-12-01 2008-02-05 Ultratech, Inc. Laser thermal processing chuck with a thermal compensating heater module
KR100707788B1 (en) * 2005-02-04 2007-04-13 주식회사 테라세미콘 Thin film transistor liquid crystal display heat treatment method and the heat treatment apparatus
KR101073550B1 (en) 2009-10-29 2011-10-14 삼성모바일디스플레이주식회사 Apparatus for thermal processing of substrate
CN102300342A (en) * 2010-06-24 2011-12-28 北京北方微电子基地设备工艺研究中心有限责任公司 Support plate heating device and plasma processor using same
US8517657B2 (en) * 2010-06-30 2013-08-27 WD Media, LLC Corner chamber with heater
CN102508381B (en) * 2011-11-29 2015-02-11 深圳市华星光电技术有限公司 Baking device for liquid crystal display panel
CN104269368A (en) * 2014-08-29 2015-01-07 沈阳拓荆科技有限公司 Device and method utilizing front end module for heating wafers
JP2019119903A (en) * 2017-12-28 2019-07-22 キヤノントッキ株式会社 Device for heating substrate and film deposition apparatus
JP7191678B2 (en) * 2018-12-27 2022-12-19 株式会社アルバック SUBSTRATE PROCESSING APPARATUS, CASSETTE REMOVAL METHOD OF SUBSTRATE PROCESSING APPARATUS
US11319627B2 (en) * 2018-12-27 2022-05-03 Ulvac, Inc. Vacuum processing apparatus
CN112363335A (en) * 2020-11-12 2021-02-12 深圳市华星光电半导体显示技术有限公司 Liquid crystal display panel baking equipment
CN114959659B (en) * 2022-03-31 2023-11-28 松山湖材料实验室 Heating device for sample heating
CN120569514A (en) * 2022-12-30 2025-08-29 周星工程股份有限公司 Substrate processing apparatus and substrate processing method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3474258B2 (en) * 1994-04-12 2003-12-08 東京エレクトロン株式会社 Heat treatment apparatus and heat treatment method
US5626680A (en) * 1995-03-03 1997-05-06 Silicon Valley Group, Inc. Thermal processing apparatus and process
US5850071A (en) * 1996-02-16 1998-12-15 Kokusai Electric Co., Ltd. Substrate heating equipment for use in a semiconductor fabricating apparatus
US6310328B1 (en) * 1998-12-10 2001-10-30 Mattson Technologies, Inc. Rapid thermal processing chamber for processing multiple wafers
US6765178B2 (en) * 2000-12-29 2004-07-20 Applied Materials, Inc. Chamber for uniform substrate heating

Also Published As

Publication number Publication date
WO2004061914A3 (en) 2008-01-17
KR20040054514A (en) 2004-06-25
CN1748285A (en) 2006-03-15
AU2003297065A8 (en) 2008-03-13
KR101035828B1 (en) 2011-05-20
TW200416798A (en) 2004-09-01
WO2004061914A2 (en) 2004-07-22
JP2006515433A (en) 2006-05-25
TWI279828B (en) 2007-04-21
CN1748285B (en) 2010-04-28

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase