AU2003297065A1 - Chamber for uniform substrate heating - Google Patents
Chamber for uniform substrate heatingInfo
- Publication number
- AU2003297065A1 AU2003297065A1 AU2003297065A AU2003297065A AU2003297065A1 AU 2003297065 A1 AU2003297065 A1 AU 2003297065A1 AU 2003297065 A AU2003297065 A AU 2003297065A AU 2003297065 A AU2003297065 A AU 2003297065A AU 2003297065 A1 AU2003297065 A1 AU 2003297065A1
- Authority
- AU
- Australia
- Prior art keywords
- chamber
- substrate heating
- uniform substrate
- uniform
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H10P72/0434—
-
- H10P72/0431—
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US43406402P | 2002-12-17 | 2002-12-17 | |
| US60/434,064 | 2002-12-17 | ||
| PCT/US2003/039783 WO2004061914A2 (en) | 2002-12-17 | 2003-12-15 | Chamber for uniform substrate heating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2003297065A1 true AU2003297065A1 (en) | 2004-07-29 |
| AU2003297065A8 AU2003297065A8 (en) | 2008-03-13 |
Family
ID=32713006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003297065A Abandoned AU2003297065A1 (en) | 2002-12-17 | 2003-12-15 | Chamber for uniform substrate heating |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP2006515433A (en) |
| KR (1) | KR101035828B1 (en) |
| CN (1) | CN1748285B (en) |
| AU (1) | AU2003297065A1 (en) |
| TW (1) | TWI279828B (en) |
| WO (1) | WO2004061914A2 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7326877B2 (en) * | 2004-12-01 | 2008-02-05 | Ultratech, Inc. | Laser thermal processing chuck with a thermal compensating heater module |
| KR100707788B1 (en) * | 2005-02-04 | 2007-04-13 | 주식회사 테라세미콘 | Thin film transistor liquid crystal display heat treatment method and the heat treatment apparatus |
| KR101073550B1 (en) | 2009-10-29 | 2011-10-14 | 삼성모바일디스플레이주식회사 | Apparatus for thermal processing of substrate |
| CN102300342A (en) * | 2010-06-24 | 2011-12-28 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Support plate heating device and plasma processor using same |
| US8517657B2 (en) * | 2010-06-30 | 2013-08-27 | WD Media, LLC | Corner chamber with heater |
| CN102508381B (en) * | 2011-11-29 | 2015-02-11 | 深圳市华星光电技术有限公司 | Baking device for liquid crystal display panel |
| CN104269368A (en) * | 2014-08-29 | 2015-01-07 | 沈阳拓荆科技有限公司 | Device and method utilizing front end module for heating wafers |
| JP2019119903A (en) * | 2017-12-28 | 2019-07-22 | キヤノントッキ株式会社 | Device for heating substrate and film deposition apparatus |
| JP7191678B2 (en) * | 2018-12-27 | 2022-12-19 | 株式会社アルバック | SUBSTRATE PROCESSING APPARATUS, CASSETTE REMOVAL METHOD OF SUBSTRATE PROCESSING APPARATUS |
| US11319627B2 (en) * | 2018-12-27 | 2022-05-03 | Ulvac, Inc. | Vacuum processing apparatus |
| CN112363335A (en) * | 2020-11-12 | 2021-02-12 | 深圳市华星光电半导体显示技术有限公司 | Liquid crystal display panel baking equipment |
| CN114959659B (en) * | 2022-03-31 | 2023-11-28 | 松山湖材料实验室 | Heating device for sample heating |
| CN120569514A (en) * | 2022-12-30 | 2025-08-29 | 周星工程股份有限公司 | Substrate processing apparatus and substrate processing method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3474258B2 (en) * | 1994-04-12 | 2003-12-08 | 東京エレクトロン株式会社 | Heat treatment apparatus and heat treatment method |
| US5626680A (en) * | 1995-03-03 | 1997-05-06 | Silicon Valley Group, Inc. | Thermal processing apparatus and process |
| US5850071A (en) * | 1996-02-16 | 1998-12-15 | Kokusai Electric Co., Ltd. | Substrate heating equipment for use in a semiconductor fabricating apparatus |
| US6310328B1 (en) * | 1998-12-10 | 2001-10-30 | Mattson Technologies, Inc. | Rapid thermal processing chamber for processing multiple wafers |
| US6765178B2 (en) * | 2000-12-29 | 2004-07-20 | Applied Materials, Inc. | Chamber for uniform substrate heating |
-
2003
- 2003-12-15 JP JP2004565462A patent/JP2006515433A/en not_active Withdrawn
- 2003-12-15 CN CN200380109616.2A patent/CN1748285B/en not_active Expired - Lifetime
- 2003-12-15 WO PCT/US2003/039783 patent/WO2004061914A2/en not_active Ceased
- 2003-12-15 AU AU2003297065A patent/AU2003297065A1/en not_active Abandoned
- 2003-12-16 TW TW092135659A patent/TWI279828B/en not_active IP Right Cessation
- 2003-12-16 KR KR1020030091832A patent/KR101035828B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004061914A3 (en) | 2008-01-17 |
| KR20040054514A (en) | 2004-06-25 |
| CN1748285A (en) | 2006-03-15 |
| AU2003297065A8 (en) | 2008-03-13 |
| KR101035828B1 (en) | 2011-05-20 |
| TW200416798A (en) | 2004-09-01 |
| WO2004061914A2 (en) | 2004-07-22 |
| JP2006515433A (en) | 2006-05-25 |
| TWI279828B (en) | 2007-04-21 |
| CN1748285B (en) | 2010-04-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |