AU2003292093A1 - Semi-conductor component with an encapsulation made of elastic material - Google Patents

Semi-conductor component with an encapsulation made of elastic material

Info

Publication number: AU2003292093A1
Authority: AU; Australia
Prior art keywords: semi; elastic material; conductor component; encapsulation made; encapsulation
Prior art date: 2003-02-24
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2003292093A

Inventor

Bernd Gebhard

Peter Muhleck

Heinz Nather

Jurgen Riedel

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Vishay Semiconductor GmbH

Original Assignee

Vishay Semiconductor GmbH

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2003-02-24

Filing date

2003-11-24

Publication date

2004-09-09

2003-11-24 Application filed by Vishay Semiconductor GmbH filed Critical Vishay Semiconductor GmbH

2004-09-09 Publication of AU2003292093A1 publication Critical patent/AU2003292093A1/en

Status Abandoned legal-status Critical Current

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
- H10W74/47—
- H10W90/756—

AU2003292093A 2003-02-24 2003-11-24 Semi-conductor component with an encapsulation made of elastic material Abandoned AU2003292093A1 (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
DE10307800A DE10307800A1 (en)	2003-02-24	2003-02-24	Semiconductor device
DE10307800.2		2003-02-24
PCT/EP2003/013180 WO2004075305A1 (en)	2003-02-24	2003-11-24	Semi-conductor component with an encapsulation made of elastic material

Publications (1)

Publication Number	Publication Date
AU2003292093A1 true AU2003292093A1 (en)	2004-09-09

Family

ID=32797699

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2003292093A Abandoned AU2003292093A1 (en)	2003-02-24	2003-11-24	Semi-conductor component with an encapsulation made of elastic material

Country Status (3)

Country	Link
AU (1)	AU2003292093A1 (en)
DE (1)	DE10307800A1 (en)
WO (1)	WO2004075305A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102006023593A1 (en) *	2006-05-19	2007-11-22	Valeo Schalter Und Sensoren Gmbh	Light guidance arrangement for use in automobile components such as motor vehicle sensor, has light guide proportionately formed from elastic material, which is transparent and dyed
DE102008012844A1 (en) *	2007-11-30	2009-06-04	Osram Opto Semiconductors Gmbh	Lighting device for providing background lighting of thin, laminar display device of e.g. mobile phone, has element emitting radiation in certain range, where element is embedded in medium so that radiation is emitted in direction of medium

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3820237A (en) *	1971-05-17	1974-06-28	Northern Electric Co	Process for packaging light emitting devices
DE3019239A1 (en) *	1980-05-20	1981-11-26	SIEMENS AG AAAAA, 1000 Berlin und 8000 München	Semiconductor encapsulation with layers of differing hardness layer fo - has semiconductor embedded in second layer of soft material for protection against external effects and degradation
DE3323259A1 (en) *	1983-06-28	1985-01-03	Siemens AG, 1000 Berlin und 8000 München	Process for producing a moulding compound suitable for covering opto-electronic components
US5098630A (en) *	1985-03-08	1992-03-24	Olympus Optical Co., Ltd.	Method of molding a solid state image pickup device
US5313365A (en) *	1992-06-30	1994-05-17	Motorola, Inc.	Encapsulated electronic package
DE19535777A1 (en) *	1995-09-26	1997-03-27	Siemens Ag	Optoelectronic semiconductor component and method for producing it
US6274924B1 (en) *	1998-11-05	2001-08-14	Lumileds Lighting, U.S. Llc	Surface mountable LED package
US6204523B1 (en) *	1998-11-06	2001-03-20	Lumileds Lighting, U.S., Llc	High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range
DE10041328B4 (en) *	2000-08-23	2018-04-05	Osram Opto Semiconductors Gmbh	Packaging unit for semiconductor chips
JP2002208668A (en) *	2001-01-10	2002-07-26	Hitachi Ltd	Semiconductor device and method of manufacturing the same
JP2002314139A (en) *	2001-04-09	2002-10-25	Toshiba Corp	Light emitting device
JP2002374007A (en) *	2001-06-15	2002-12-26	Toyoda Gosei Co Ltd	Light emitting device

2003
- 2003-02-24 DE DE10307800A patent/DE10307800A1/en not_active Withdrawn
- 2003-11-24 WO PCT/EP2003/013180 patent/WO2004075305A1/en not_active Ceased
- 2003-11-24 AU AU2003292093A patent/AU2003292093A1/en not_active Abandoned

Also Published As

Publication number	Publication date
WO2004075305A1 (en)	2004-09-02
DE10307800A1 (en)	2004-09-02

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Legal Events

Date	Code	Title	Description
2005-11-10	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase