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AU2003279044A1 - Flexible assembly of stacked chips - Google Patents

Flexible assembly of stacked chips

Info

Publication number
AU2003279044A1
AU2003279044A1 AU2003279044A AU2003279044A AU2003279044A1 AU 2003279044 A1 AU2003279044 A1 AU 2003279044A1 AU 2003279044 A AU2003279044 A AU 2003279044A AU 2003279044 A AU2003279044 A AU 2003279044A AU 2003279044 A1 AU2003279044 A1 AU 2003279044A1
Authority
AU
Australia
Prior art keywords
chips
package
substrate
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003279044A
Inventor
Kevin S. Petrarca
Richard P. Volant
George F. Walker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of AU2003279044A1 publication Critical patent/AU2003279044A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10P72/74—
    • H10W70/611—
    • H10W70/688—
    • H10W90/00—
    • H10P72/743—
    • H10P72/7436—
    • H10W70/093—
    • H10W70/60—
    • H10W72/01—
    • H10W72/07554—
    • H10W72/547—
    • H10W72/59—
    • H10W72/60—
    • H10W72/853—
    • H10W72/874—
    • H10W72/932—
    • H10W72/9413—
    • H10W74/019—
    • H10W90/10—
    • H10W90/20—
    • H10W90/288—
    • H10W90/754—

Landscapes

  • Structure Of Printed Boards (AREA)
  • Battery Mounting, Suspending (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Toys (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

A three-dimensional package consisting of a plurality of folded integrated circuit chips ( 100, 110, 120 ) is described wherein at least one chip provides interconnect pathways for electrical connection to additional chips of the stack, and at least one chip ( 130 ) is provided with additional interconnect wiring to a substrate ( 500 ), package or printed circuit board. Further described, is a method of providing a flexible arrangement of interconnected chips that are folded over into a three-dimensional arrangements to consume less aerial space when mounted on a substrate, second-level package or printed circuit board.
AU2003279044A 2003-09-30 2003-09-30 Flexible assembly of stacked chips Abandoned AU2003279044A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2003/030640 WO2005041360A1 (en) 2003-09-30 2003-09-30 Flexible assembly of stacked chips

Publications (1)

Publication Number Publication Date
AU2003279044A1 true AU2003279044A1 (en) 2005-05-11

Family

ID=34519496

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003279044A Abandoned AU2003279044A1 (en) 2003-09-30 2003-09-30 Flexible assembly of stacked chips

Country Status (8)

Country Link
US (1) US7355271B2 (en)
EP (1) EP1668745B1 (en)
JP (1) JP4425217B2 (en)
CN (1) CN100448104C (en)
AT (1) ATE522953T1 (en)
AU (1) AU2003279044A1 (en)
IL (1) IL174504A0 (en)
WO (1) WO2005041360A1 (en)

Families Citing this family (14)

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Publication number Priority date Publication date Assignee Title
US7759167B2 (en) * 2005-11-23 2010-07-20 Imec Method for embedding dies
KR100726892B1 (en) 2006-03-17 2007-06-14 한국과학기술원 3D chip stack package module and manufacturing method thereof
US7990171B2 (en) * 2007-10-04 2011-08-02 Samsung Electronics Co., Ltd. Stacked semiconductor apparatus with configurable vertical I/O
US7473618B1 (en) 2008-04-22 2009-01-06 International Business Machines Corporation Temporary structure to reduce stress and warpage in a flip chip organic package
WO2013087101A1 (en) * 2011-12-14 2013-06-20 Reinhardt Microtech Gmbh Substrate-supported circuit parts with free-standing three-dimensional structures
US10555720B2 (en) * 2012-12-28 2020-02-11 Volcano Corporation Intravascular ultrasound imaging apparatus, interface, architecture, and method of manufacturing
US20140224882A1 (en) * 2013-02-14 2014-08-14 Douglas R. Hackler, Sr. Flexible Smart Card Transponder
CN103523739A (en) * 2013-11-05 2014-01-22 华进半导体封装先导技术研发中心有限公司 Packaging structure of three-dimensional flexible substrate of environment MEMS sensor and manufacturing method
CN104465548A (en) * 2014-12-10 2015-03-25 华进半导体封装先导技术研发中心有限公司 Three-dimensional flexible packaging structure and injection molding method thereof
US9984962B2 (en) * 2015-08-31 2018-05-29 Arizona Board Of Regents On Behalf Of Arizona State University Systems and methods for hybrid flexible electronics with rigid integrated circuits
KR102497583B1 (en) 2015-10-27 2023-02-10 삼성전자주식회사 Semiconductor devices having flexible interconnection and methods for fabricating the same
EP3206229B1 (en) 2016-02-09 2020-10-07 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Methods of manufacturing flexible electronic devices
CN113161338B (en) * 2021-03-30 2025-06-13 广东汇芯半导体有限公司 Intelligent power module and method for preparing the same
CN115565890B (en) * 2022-12-07 2023-04-18 西北工业大学 Folding type multi-chip flexible integrated packaging method and flexible integrated packaging chip

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2985484B2 (en) * 1992-03-19 1999-11-29 株式会社日立製作所 Semiconductor device and manufacturing method thereof
US4933810A (en) 1987-04-30 1990-06-12 Honeywell Inc. Integrated circuit interconnector
US5028983A (en) 1988-10-28 1991-07-02 International Business Machines Corporation Multilevel integrated circuit packaging structures
US5239448A (en) 1991-10-28 1993-08-24 International Business Machines Corporation Formulation of multichip modules
US5198965A (en) * 1991-12-18 1993-03-30 International Business Machines Corporation Free form packaging of specific functions within a computer system
FR2704690B1 (en) * 1993-04-27 1995-06-23 Thomson Csf Method for encapsulating semiconductor wafers, device obtained by this process and application to the interconnection of wafers in three dimensions.
US6121676A (en) * 1996-12-13 2000-09-19 Tessera, Inc. Stacked microelectronic assembly and method therefor
JP3611957B2 (en) * 1997-10-29 2005-01-19 日東電工株式会社 Stacked package
JPH11249215A (en) * 1998-03-06 1999-09-17 Olympus Optical Co Ltd Camera with flexible printed circuit board
JP2000088921A (en) * 1998-09-08 2000-03-31 Sony Corp Semiconductor device
JP3879803B2 (en) * 1999-03-25 2007-02-14 セイコーエプソン株式会社 Semiconductor device and manufacturing method thereof, circuit board, and electronic apparatus
JP2001085608A (en) * 1999-09-17 2001-03-30 Sony Corp Semiconductor device
US6572387B2 (en) * 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
KR100472334B1 (en) * 1999-10-01 2005-03-14 세이코 엡슨 가부시키가이샤 Wiring board, semiconductor device and method of producing, testing and packaging the same, and circuit board and electronic equipment
JP3721893B2 (en) * 1999-10-20 2005-11-30 セイコーエプソン株式会社 Semiconductor devices and electronic devices
JP4135284B2 (en) * 1999-12-07 2008-08-20 ソニー株式会社 Semiconductor module and electronic circuit device
JP3855594B2 (en) * 2000-04-25 2006-12-13 セイコーエプソン株式会社 Semiconductor device
JP2002009230A (en) * 2000-06-20 2002-01-11 Seiko Epson Corp Semiconductor device
JP2002009229A (en) * 2000-06-20 2002-01-11 Seiko Epson Corp Semiconductor device
JP2002270759A (en) * 2001-03-14 2002-09-20 Matsushita Electric Ind Co Ltd Semiconductor chip and multi-chip module
JP4633971B2 (en) * 2001-07-11 2011-02-16 ルネサスエレクトロニクス株式会社 Semiconductor device
JP2003133518A (en) * 2001-10-29 2003-05-09 Mitsubishi Electric Corp Semiconductor module
US7071547B2 (en) * 2002-09-11 2006-07-04 Tessera, Inc. Assemblies having stacked semiconductor chips and methods of making same

Also Published As

Publication number Publication date
JP2007521636A (en) 2007-08-02
CN1839518A (en) 2006-09-27
EP1668745A4 (en) 2008-12-03
EP1668745B1 (en) 2011-08-31
CN100448104C (en) 2008-12-31
JP4425217B2 (en) 2010-03-03
ATE522953T1 (en) 2011-09-15
US20070059951A1 (en) 2007-03-15
IL174504A0 (en) 2006-08-01
WO2005041360A1 (en) 2005-05-06
US7355271B2 (en) 2008-04-08
EP1668745A1 (en) 2006-06-14

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase