AU2003266600A1 - Connection method and connection device - Google Patents
Connection method and connection deviceInfo
- Publication number
- AU2003266600A1 AU2003266600A1 AU2003266600A AU2003266600A AU2003266600A1 AU 2003266600 A1 AU2003266600 A1 AU 2003266600A1 AU 2003266600 A AU2003266600 A AU 2003266600A AU 2003266600 A AU2003266600 A AU 2003266600A AU 2003266600 A1 AU2003266600 A1 AU 2003266600A1
- Authority
- AU
- Australia
- Prior art keywords
- connection
- connection device
- connection method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H10W72/072—
-
- H10W72/0711—
-
- H10W72/07118—
-
- H10W72/07125—
-
- H10W72/07141—
-
- H10W72/07178—
-
- H10W72/07236—
-
- H10W72/07251—
-
- H10W72/20—
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002/280607 | 2002-09-26 | ||
| JP2002280607A JP2006080099A (en) | 2002-09-26 | 2002-09-26 | Joining method and apparatus |
| PCT/JP2003/012204 WO2004030077A1 (en) | 2002-09-26 | 2003-09-25 | Connection method and connection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2003266600A1 true AU2003266600A1 (en) | 2004-04-19 |
Family
ID=32040486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003266600A Abandoned AU2003266600A1 (en) | 2002-09-26 | 2003-09-25 | Connection method and connection device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2006080099A (en) |
| AU (1) | AU2003266600A1 (en) |
| WO (1) | WO2004030077A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4537974B2 (en) * | 2006-04-12 | 2010-09-08 | パナソニック株式会社 | Component mounter |
| JP5022093B2 (en) * | 2007-04-24 | 2012-09-12 | パナソニック株式会社 | Implementation method |
| DE102007021269B4 (en) * | 2007-05-03 | 2009-07-09 | Siemens Ag | Surface mount device repair soldering head and method of operation |
| JP2008311265A (en) * | 2007-06-12 | 2008-12-25 | Nec Electronics Corp | Bonding apparatus and method of manufacturing electronic apparatus using the bonding apparatus |
| JP4852521B2 (en) * | 2007-12-07 | 2012-01-11 | 株式会社新川 | Bonding apparatus and bonding method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2854963B2 (en) * | 1990-11-28 | 1999-02-10 | 株式会社日立製作所 | Solid phase bonding method and apparatus |
| JPH0955581A (en) * | 1995-08-11 | 1997-02-25 | Tamura Seisakusho Co Ltd | Processing method for fluxless soldering |
| JPH0982588A (en) * | 1995-09-12 | 1997-03-28 | Denso Corp | Direct bonding method for nitride and direct bonded object |
| JP4252631B2 (en) * | 1996-02-29 | 2009-04-08 | 和夫 杉山 | Method for cleaning and modifying surface for solder joint and soldering method |
| US6605175B1 (en) * | 1999-02-19 | 2003-08-12 | Unaxis Balzers Aktiengesellschaft | Process for manufacturing component parts, use of same, with air bearing supported workpieces and vacuum processing chamber |
-
2002
- 2002-09-26 JP JP2002280607A patent/JP2006080099A/en active Pending
-
2003
- 2003-09-25 WO PCT/JP2003/012204 patent/WO2004030077A1/en not_active Ceased
- 2003-09-25 AU AU2003266600A patent/AU2003266600A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006080099A (en) | 2006-03-23 |
| WO2004030077A1 (en) | 2004-04-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |