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AU2003263597A1 - Soldering filler metal, assembly method for semiconductor device using same, and semiconductor device - Google Patents

Soldering filler metal, assembly method for semiconductor device using same, and semiconductor device

Info

Publication number
AU2003263597A1
AU2003263597A1 AU2003263597A AU2003263597A AU2003263597A1 AU 2003263597 A1 AU2003263597 A1 AU 2003263597A1 AU 2003263597 A AU2003263597 A AU 2003263597A AU 2003263597 A AU2003263597 A AU 2003263597A AU 2003263597 A1 AU2003263597 A1 AU 2003263597A1
Authority
AU
Australia
Prior art keywords
semiconductor device
same
assembly method
filler metal
soldering filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003263597A
Inventor
Nobuki Mori
Kei Morimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Publication of AU2003263597A1 publication Critical patent/AU2003263597A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H10W72/30—
    • H10W72/325—
    • H10W72/352—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Die Bonding (AREA)
AU2003263597A 2002-09-19 2003-09-12 Soldering filler metal, assembly method for semiconductor device using same, and semiconductor device Abandoned AU2003263597A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-273598 2002-09-19
JP2002273598A JP4147875B2 (en) 2002-09-19 2002-09-19 Brazing material, method of assembling semiconductor device using the same, and semiconductor device
PCT/JP2003/011730 WO2004026527A1 (en) 2002-09-19 2003-09-12 Soldering filler metal, assembly method for semiconductor device using same, and semiconductor device

Publications (1)

Publication Number Publication Date
AU2003263597A1 true AU2003263597A1 (en) 2004-04-08

Family

ID=32024961

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003263597A Abandoned AU2003263597A1 (en) 2002-09-19 2003-09-12 Soldering filler metal, assembly method for semiconductor device using same, and semiconductor device

Country Status (7)

Country Link
EP (1) EP2099580A1 (en)
JP (1) JP4147875B2 (en)
KR (1) KR100595037B1 (en)
CN (1) CN100404193C (en)
AU (1) AU2003263597A1 (en)
TW (1) TWI231238B (en)
WO (1) WO2004026527A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101239425A (en) * 2008-03-13 2008-08-13 浙江省冶金研究院有限公司 A kind of lead-free high-temperature electronic solder and its preparation method
JP5490258B2 (en) * 2010-12-10 2014-05-14 三菱電機株式会社 Lead-free solder alloy, semiconductor device, and manufacturing method of semiconductor device
JP5878290B2 (en) * 2010-12-14 2016-03-08 株式会社日本スペリア社 Lead-free solder alloy
JP5635561B2 (en) * 2012-06-21 2014-12-03 株式会社タムラ製作所 Solder composition
JP5938390B2 (en) * 2012-12-25 2016-06-22 三菱マテリアル株式会社 Power module
CN106271181A (en) * 2015-05-13 2017-01-04 广西民族大学 A kind of Sn-Sb-X system high-temperature oxidation resistant lead-free brazing
CN105750757A (en) * 2016-03-22 2016-07-13 苏州虎伏新材料科技有限公司 Welding material for surfacing to obtain Sn-based babbitt alloy wear-resisting layer
JP6355091B1 (en) * 2017-03-07 2018-07-11 パナソニックＩｐマネジメント株式会社 Solder alloy and joint structure using the same
JP6355092B1 (en) * 2017-05-11 2018-07-11 パナソニックＩｐマネジメント株式会社 Solder alloy and joint structure using the same
JP6998557B2 (en) 2017-09-29 2022-01-18 パナソニックＩｐマネジメント株式会社 Solder alloy and joint structure using it
CN115945754A (en) * 2022-12-28 2023-04-11 哈尔滨工业大学重庆研究院 A Soldering Process for Reducing the Void Rate of Lead-Sn-Ag Soldering Components

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2059019A (en) * 1936-02-20 1936-10-27 Cleveland Graphite Bronze Co Bearing alloy
GB2181009B (en) * 1985-09-23 1989-11-29 Fluke Mfg Co John Apparatus and method for providing improved resistive ratio stability of a resistive divider network
JPH0825051B2 (en) * 1992-06-22 1996-03-13 株式会社日本スペリア社 Solder alloy
US5851482A (en) * 1996-03-22 1998-12-22 Korea Institute Of Machinery & Metals Tin-bismuth based lead-free solder for copper and copper alloys
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
US5833921A (en) * 1997-09-26 1998-11-10 Ford Motor Company Lead-free, low-temperature solder compositions
JP2001191196A (en) * 1999-10-29 2001-07-17 Topy Ind Ltd Sn BASE Pb-FREE SOLDER EXCELLENT IN WETTABILITY, HEAT CYCLE CHARACTERISTICS AND OXIDATION RESISTANCE
DE10145389C2 (en) * 2001-09-14 2003-07-24 Forschungsvereinigung Antriebs Plain bearing alloy based on Sn

Also Published As

Publication number Publication date
JP2004106027A (en) 2004-04-08
CN1681620A (en) 2005-10-12
WO2004026527A1 (en) 2004-04-01
KR20050057490A (en) 2005-06-16
TWI231238B (en) 2005-04-21
TW200406278A (en) 2004-05-01
JP4147875B2 (en) 2008-09-10
KR100595037B1 (en) 2006-06-30
CN100404193C (en) 2008-07-23
EP2099580A1 (en) 2009-09-16

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase