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AU2003261916A1 - Silsesquioxane derivative and process for producing the same - Google Patents

Silsesquioxane derivative and process for producing the same

Info

Publication number
AU2003261916A1
AU2003261916A1 AU2003261916A AU2003261916A AU2003261916A1 AU 2003261916 A1 AU2003261916 A1 AU 2003261916A1 AU 2003261916 A AU2003261916 A AU 2003261916A AU 2003261916 A AU2003261916 A AU 2003261916A AU 2003261916 A1 AU2003261916 A1 AU 2003261916A1
Authority
AU
Australia
Prior art keywords
producing
same
silsesquioxane derivative
silsesquioxane
derivative
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003261916A
Inventor
Yoshitaka Morimoto
Nobumasa Ootake
Kenichi Watanabe
Kazuhiro Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JNC Corp
Original Assignee
Chisso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chisso Corp filed Critical Chisso Corp
Publication of AU2003261916A1 publication Critical patent/AU2003261916A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/21—Cyclic compounds having at least one ring containing silicon, but no carbon in the ring

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
AU2003261916A 2002-09-13 2003-09-03 Silsesquioxane derivative and process for producing the same Abandoned AU2003261916A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002268717 2002-09-13
JP2002-268717 2002-09-13
PCT/JP2003/011277 WO2004024741A1 (en) 2002-09-13 2003-09-03 Silsesquioxane derivative and process for producing the same

Publications (1)

Publication Number Publication Date
AU2003261916A1 true AU2003261916A1 (en) 2004-04-30

Family

ID=31986782

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003261916A Abandoned AU2003261916A1 (en) 2002-09-13 2003-09-03 Silsesquioxane derivative and process for producing the same

Country Status (4)

Country Link
US (1) US7319129B2 (en)
JP (1) JP4470738B2 (en)
AU (1) AU2003261916A1 (en)
WO (1) WO2004024741A1 (en)

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JP4479160B2 (en) * 2003-03-11 2010-06-09 チッソ株式会社 Polymers obtained using silsesquioxane derivatives
TWI278473B (en) * 2003-03-12 2007-04-11 Chisso Corp Polymer with the silsesquioxane skeleton in its main chain, method of forming the same, and coating film and membrane of preventing metal ion elution
JP4396139B2 (en) * 2003-05-27 2010-01-13 チッソ株式会社 Polymer having silsesquioxane skeleton and method for forming thin film thereof
JP4581472B2 (en) * 2003-06-30 2010-11-17 チッソ株式会社 Organosilicon compound and method for producing the same, and polysiloxane and method for producing the same
JP4882270B2 (en) * 2004-05-07 2012-02-22 Ｊｎｃ株式会社 Silicon compounds
US7256243B2 (en) * 2004-05-07 2007-08-14 Chisso Corporation Silicon compound
KR20060095506A (en) * 2005-02-28 2006-08-31 칫소가부시키가이샤 Organosilicon Compounds and Polymeric Compounds with a Cage-type Silicon Skeleton
JP2007326988A (en) * 2006-06-09 2007-12-20 Chisso Corp Epoxy resin composition
JP5408597B2 (en) * 2006-06-13 2014-02-05 学校法人 関西大学 Thermosetting polymer composition and cured product thereof
US8029904B2 (en) * 2006-12-01 2011-10-04 Rohm And Haas Company Aryl (thio)ether aryl polysiloxane composition and methods for making and using same
JP5018065B2 (en) 2006-12-15 2012-09-05 Ｊｎｃ株式会社 Polysiloxane compound and method for producing the same
EP2151443B1 (en) * 2007-04-17 2014-03-26 Kaneka Corporation Polyhedral polysiloxane modified product and composition using the modified product
JP5013127B2 (en) * 2007-12-19 2012-08-29 Ｊｎｃ株式会社 Thermosetting resin composition and use thereof
US20090163652A1 (en) * 2007-12-19 2009-06-25 Chisso Corporation Thermosetting resin composition and use thereof
JP5072106B2 (en) * 2008-09-03 2012-11-14 住化スタイロンポリカーボネート株式会社 Flame retardant polycarbonate resin composition
JP5799803B2 (en) * 2009-04-14 2015-10-28 Jnc株式会社 Glass fiber composite silsesquioxane molded body and method for producing the same
JP5707607B2 (en) 2009-04-24 2015-04-30 Jnc株式会社 Organosilicon compound and thermosetting resin composition containing the same
JP5793824B2 (en) * 2009-06-02 2015-10-14 Jnc株式会社 Organosilicon compound, thermosetting composition containing the organosilicon compound, and sealing material for optical semiconductor
JP5338532B2 (en) * 2009-07-13 2013-11-13 Ｊｎｃ株式会社 Positive photosensitive composition
TWI500678B (en) 2010-05-18 2015-09-21 捷恩智股份有限公司 Novel organic hydrazine compound, thermosetting resin composition containing the organic cerium compound, hardening resin, and packaging material for optical semiconductor
KR101774306B1 (en) 2010-05-28 2017-09-04 가부시키가이샤 가네카 Polysiloxane composition, hardened material and optical device
KR101886173B1 (en) 2010-09-22 2018-08-08 가부시키가이샤 가네카 Modified product of polyhedral structure polysiloxane, polyhedral structure polysiloxane composition, cured product, and optical semiconductor device
JP5742510B2 (en) * 2011-06-27 2015-07-01 国立大学法人東北大学 Novel silsesquioxane derivative and proton conducting membrane composed thereof
EP2730603B1 (en) * 2011-07-04 2019-05-22 JNC Corporation Compound comprising isocyanuric skeleton, epoxy groups, and silsesquioxane skeleton having sih groups, thermosetting resin composition comprising compound as agent for imparting adhesion, cured product, and sealing member for optical semiconducto
JP6135675B2 (en) 2012-09-18 2017-05-31 Jnc株式会社 Epoxy and alkoxysilyl group-containing silsesquioxane and composition thereof
KR101989329B1 (en) 2012-11-13 2019-06-14 제이엔씨 주식회사 Thermosetting resin composition, cured product, composition for optical semiconductor and optical semiconductor element
CA2905913C (en) * 2013-03-14 2021-07-13 Nanosys, Inc. Polyhedral oligomeric silsesquioxane nanocrystal stabilization ligands
WO2016049269A1 (en) * 2014-09-24 2016-03-31 Nbd Nanotechnologies, Inc. F-poss coatings and additives and methods of making same
JP2016160420A (en) * 2015-03-05 2016-09-05 Jnc株式会社 Thermosetting composition, cured film, substrate with cured film, electronic component, and display device
KR102748006B1 (en) 2015-10-26 2024-12-31 오티아이 루미오닉스 인크. Method for patterning a coating on a surface and device including a patterned coating
CN108699340A (en) * 2016-03-02 2018-10-23 捷恩智株式会社 The manufacturing method of heat release component composition, heat release component, e-machine and heat release component
EP3436203A4 (en) * 2016-03-28 2019-12-04 Nbd Nanotechnologies, Inc. F-POSS MATERIALS FUNCTIONALIZED AS ADDITIVES TO POLYMERS
WO2018100559A1 (en) 2016-12-02 2018-06-07 Oti Lumionics Inc. Device including a conductive coating disposed over emissive regions and method therefor
JP6850408B2 (en) * 2017-01-10 2021-03-31 Jnc株式会社 A silsesquioxane derivative having a radically polymerizable functional group, its composition and a low-curing shrinkable cured film.
WO2018198052A1 (en) 2017-04-26 2018-11-01 Oti Lumionics Inc. Method for patterning a coating on a surface and device including a patterned coating
DE102017004541A1 (en) * 2017-05-11 2018-11-15 Klüber Lubrication München Se & Co. Kg lubricant composition
KR102685809B1 (en) 2017-05-17 2024-07-18 오티아이 루미오닉스 인크. Method for selectively depositing a conductive coating over a patterned coating and a device comprising the conductive coating
US11751415B2 (en) 2018-02-02 2023-09-05 Oti Lumionics Inc. Materials for forming a nucleation-inhibiting coating and devices incorporating same
CN112074966A (en) 2018-05-07 2020-12-11 Oti照明公司 Method for providing an auxiliary electrode and device comprising an auxiliary electrode
CN117769309A (en) 2018-11-23 2024-03-26 Oti照明公司 Electroluminescent device
KR102879562B1 (en) 2019-03-07 2025-11-03 오티아이 루미오닉스 인크. Materials for forming nucleation-inhibiting coatings and devices comprising the same
WO2020212953A1 (en) 2019-04-18 2020-10-22 Oti Lumionics Inc. Materials for forming a nucleation-inhibiting coating and devices incorporating the same
WO2020225778A1 (en) 2019-05-08 2020-11-12 Oti Lumionics Inc. Materials for forming a nucleation-inhibiting coating and devices incorporating same
CN114097102B (en) 2019-06-26 2023-11-03 Oti照明公司 Optoelectronic device comprising a light transmissive region having light diffraction features
WO2021028800A1 (en) 2019-08-09 2021-02-18 Oti Lumionics Inc. Opto-electronic device including an auxiliary electrode and a partition
JP7403883B2 (en) 2019-12-24 2023-12-25 オーティーアイ ルミオニクス インコーポレーテッド Light emitting device including capping layer and method for manufacturing same
JP7468064B2 (en) 2020-03-30 2024-04-16 Jnc株式会社 Cationically polymerizable composition
WO2022123431A1 (en) 2020-12-07 2022-06-16 Oti Lumionics Inc. Patterning a conductive deposited layer using a nucleation inhibiting coating and an underlying metallic coating
CN112876685B (en) * 2021-02-04 2022-04-22 浙江大学 Tetraepoxy group liquid cage type silsesquioxane as well as preparation method and application thereof
JP7803060B2 (en) * 2021-09-03 2026-01-21 Jnc株式会社 Thermosetting coating composition and decorative film
WO2024063066A1 (en) * 2022-09-22 2024-03-28 ダウ・東レ株式会社 Curable branched organopolysiloxane, high energy ray-curable composition containing same, and use of same
WO2024063067A1 (en) * 2022-09-22 2024-03-28 ダウ・東レ株式会社 Curable branched organopolysiloxane, high energy ray-curable composition containing same, and use thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000356720A (en) * 1999-06-16 2000-12-26 Sony Corp Optical waveguide material, optical waveguide and method for manufacturing the same
WO2003064490A2 (en) * 2001-06-27 2003-08-07 Hybrid Plastics Llp Process for the functionalization of polyhedral oligomeric silsesquioxanes
US6569932B2 (en) * 2001-07-06 2003-05-27 Benjamin S. Hsiao Blends of organic silicon compounds with ethylene-based polymers
US7169873B2 (en) * 2001-09-18 2007-01-30 Chisso Corporation Silsesquioxane derivatives and process for production thereof
JP4259148B2 (en) * 2002-03-28 2009-04-30 チッソ株式会社 Sealing material for LCD panels

Also Published As

Publication number Publication date
WO2004024741A1 (en) 2004-03-25
US20060052623A1 (en) 2006-03-09
JPWO2004024741A1 (en) 2006-01-05
US7319129B2 (en) 2008-01-15
JP4470738B2 (en) 2010-06-02

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase