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AU2003242423A1 - Sputtering target material - Google Patents

Sputtering target material

Info

Publication number
AU2003242423A1
AU2003242423A1 AU2003242423A AU2003242423A AU2003242423A1 AU 2003242423 A1 AU2003242423 A1 AU 2003242423A1 AU 2003242423 A AU2003242423 A AU 2003242423A AU 2003242423 A AU2003242423 A AU 2003242423A AU 2003242423 A1 AU2003242423 A1 AU 2003242423A1
Authority
AU
Australia
Prior art keywords
target material
sputtering target
sputtering
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003242423A
Inventor
Tomoyoshi Asaki
Koichi Hasegawa
Nobuo Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishifuku Metal Industry Co Ltd
Original Assignee
Ishifuku Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishifuku Metal Industry Co Ltd filed Critical Ishifuku Metal Industry Co Ltd
Publication of AU2003242423A1 publication Critical patent/AU2003242423A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Optical Record Carriers And Manufacture Thereof (AREA)
  • Manufacturing Optical Record Carriers (AREA)
AU2003242423A 2002-05-28 2003-05-23 Sputtering target material Abandoned AU2003242423A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002153729 2002-05-28
JP2002-153729 2002-05-28
PCT/JP2003/006455 WO2003100112A1 (en) 2002-05-28 2003-05-23 Sputtering target material

Publications (1)

Publication Number Publication Date
AU2003242423A1 true AU2003242423A1 (en) 2003-12-12

Family

ID=29561318

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003242423A Abandoned AU2003242423A1 (en) 2002-05-28 2003-05-23 Sputtering target material

Country Status (4)

Country Link
JP (1) JP4162652B2 (en)
AU (1) AU2003242423A1 (en)
TW (1) TWI283710B (en)
WO (1) WO2003100112A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010287565A (en) * 2009-05-14 2010-12-24 Mitsubishi Materials Corp Al alloy reflective electrode film forming anode layer of upper light emitting organic EL device
JP4793502B2 (en) * 2009-10-06 2011-10-12 三菱マテリアル株式会社 Silver alloy target for forming reflective electrode film of organic EL element and method for producing the same
JP5522599B1 (en) * 2012-12-21 2014-06-18 三菱マテリアル株式会社 Ag alloy sputtering target
JP5850077B2 (en) * 2014-04-09 2016-02-03 三菱マテリアル株式会社 Ag alloy film and sputtering target for forming Ag alloy film
CN115976478B (en) * 2022-12-13 2023-11-28 江苏迪纳科精细材料股份有限公司 Silver sulfide resistant alloy target and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06243509A (en) * 1993-02-19 1994-09-02 Ricoh Co Ltd Light reflection film and optical recording information medium using the film
JPH09324264A (en) * 1996-06-03 1997-12-16 Toppan Printing Co Ltd Sputtering target
JP2001035014A (en) * 1999-07-19 2001-02-09 Ricoh Co Ltd Optical information recording medium, method for producing the same, and sputtering apparatus used for the production
JP4638015B2 (en) * 2000-10-31 2011-02-23 株式会社フルヤ金属 Sputtering target material for forming a thin film, thin film formed using the same, and optical recording medium
JP4801279B2 (en) * 2001-05-09 2011-10-26 石福金属興業株式会社 Sputtering target material
JP3915114B2 (en) * 2001-11-26 2007-05-16 三菱マテリアル株式会社 Silver alloy sputtering target for reflection film formation of optical recording media

Also Published As

Publication number Publication date
JP4162652B2 (en) 2008-10-08
JPWO2003100112A1 (en) 2005-09-22
TW200401835A (en) 2004-02-01
TWI283710B (en) 2007-07-11
WO2003100112A1 (en) 2003-12-04

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase