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AU2003241778A1 - Adhesive film and prepreg - Google Patents

Adhesive film and prepreg

Info

Publication number
AU2003241778A1
AU2003241778A1 AU2003241778A AU2003241778A AU2003241778A1 AU 2003241778 A1 AU2003241778 A1 AU 2003241778A1 AU 2003241778 A AU2003241778 A AU 2003241778A AU 2003241778 A AU2003241778 A AU 2003241778A AU 2003241778 A1 AU2003241778 A1 AU 2003241778A1
Authority
AU
Australia
Prior art keywords
prepreg
adhesive film
adhesive
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003241778A
Inventor
Shigeo Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of AU2003241778A1 publication Critical patent/AU2003241778A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2461/00—Presence of condensation polymers of aldehydes or ketones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
AU2003241778A 2002-05-27 2003-05-26 Adhesive film and prepreg Abandoned AU2003241778A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002152489 2002-05-27
JP2002-152489 2002-05-27
PCT/JP2003/006562 WO2003099952A1 (en) 2002-05-27 2003-05-26 Adhesive film and prepreg

Publications (1)

Publication Number Publication Date
AU2003241778A1 true AU2003241778A1 (en) 2003-12-12

Family

ID=29561277

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003241778A Abandoned AU2003241778A1 (en) 2002-05-27 2003-05-26 Adhesive film and prepreg

Country Status (4)

Country Link
JP (1) JPWO2003099952A1 (en)
AU (1) AU2003241778A1 (en)
TW (1) TW200400242A (en)
WO (1) WO2003099952A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5011641B2 (en) * 2004-01-28 2012-08-29 味の素株式会社 Thermosetting resin composition, adhesive film using the same, and multilayer printed wiring board
JP2005244150A (en) 2004-01-28 2005-09-08 Ajinomoto Co Inc Resin composition, adhesive film using it, and multi-layer printed wiring board
JP5055683B2 (en) * 2004-03-30 2012-10-24 住友ベークライト株式会社 Insulating sheet, insulating sheet with substrate, and multilayer printed wiring board
TWI455988B (en) * 2006-10-13 2014-10-11 Ajinomoto Kk Resin composition
JP5130698B2 (en) * 2006-11-21 2013-01-30 住友ベークライト株式会社 Insulating resin composition for multilayer printed wiring board, insulating sheet with substrate, multilayer printed wiring board, and semiconductor device
JP2008143971A (en) * 2006-12-07 2008-06-26 Sumitomo Bakelite Co Ltd Insulation resin composition, insulation resin sheet with substrate, multi-layer printed wiring board and semiconductor device
KR101530868B1 (en) * 2007-09-11 2015-06-23 아지노모토 가부시키가이샤 Process for producing multilayer printed wiring board
US8969490B2 (en) 2008-03-25 2015-03-03 Sumitomo Bakelite Company, Ltd. Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board and semiconductor device
JP2010037489A (en) * 2008-08-07 2010-02-18 Hitachi Chem Co Ltd Adhesive film, and metal foil with resin
TWI471369B (en) 2009-01-19 2015-02-01 Ajinomoto Kk Resin composition
TWI565750B (en) 2009-02-20 2017-01-11 Ajinomoto Kk Resin composition
JP5168312B2 (en) * 2010-04-28 2013-03-21 住友ベークライト株式会社 Multilayer printed circuit board manufacturing method
WO2012176423A1 (en) * 2011-06-21 2012-12-27 住友ベークライト株式会社 Laminated plate manufacturing method
KR101908166B1 (en) * 2011-06-21 2018-10-15 스미토모 베이클리트 컴퍼니 리미티드 Method for manufacturing laminated board
JP5767540B2 (en) * 2011-09-14 2015-08-19 積水化学工業株式会社 B-stage film, multilayer substrate and laminated film which are episulfide resin materials
JP2012054573A (en) * 2011-10-11 2012-03-15 Sumitomo Bakelite Co Ltd Insulating resin composition for multilayer printed circuit board, insulation sheet with substrate, multilayer printed circuit board, and semiconductor device
JP6582807B2 (en) * 2015-09-25 2019-10-02 味の素株式会社 Manufacturing method of resin sheet

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08204296A (en) * 1995-01-20 1996-08-09 Hitachi Chem Co Ltd Multiwire wiring board and manufacture thereof
JPH1150032A (en) * 1997-08-04 1999-02-23 Hitachi Chem Co Ltd Connection member for circuit and circuit board
JPH11100562A (en) * 1997-09-26 1999-04-13 Sumitomo Bakelite Co Ltd Interlayer insulation adhesive for multilayer printed wiring board and copper foil
JP3409751B2 (en) * 1999-10-22 2003-05-26 ソニーケミカル株式会社 Connection material and connection body
JP2001240687A (en) * 2000-02-29 2001-09-04 Hitachi Chem Co Ltd Prepreg and laminated board clad with metallic foil
JP4601781B2 (en) * 2000-07-28 2010-12-22 株式会社Adeka Non-woven fabric for laminate
JP2002146323A (en) * 2000-11-16 2002-05-22 Hitachi Chem Co Ltd Adhesive composition and adhesive member using the same and substrate for loading semiconductor and semiconductor device

Also Published As

Publication number Publication date
JPWO2003099952A1 (en) 2005-10-20
WO2003099952A1 (en) 2003-12-04
TW200400242A (en) 2004-01-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase