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AU2002337129A1 - Method for forming a package for electronic components and package for electronic components - Google Patents

Method for forming a package for electronic components and package for electronic components

Info

Publication number
AU2002337129A1
AU2002337129A1 AU2002337129A AU2002337129A AU2002337129A1 AU 2002337129 A1 AU2002337129 A1 AU 2002337129A1 AU 2002337129 A AU2002337129 A AU 2002337129A AU 2002337129 A AU2002337129 A AU 2002337129A AU 2002337129 A1 AU2002337129 A1 AU 2002337129A1
Authority
AU
Australia
Prior art keywords
package
electronic components
forming
electronic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002337129A
Inventor
Christina Bohm
Torsten Hauck
Anton Johann Kolbeck
Joerg Strogies
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of AU2002337129A1 publication Critical patent/AU2002337129A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W76/157
    • H10W40/22
    • H10W76/47
AU2002337129A 2001-10-04 2002-09-23 Method for forming a package for electronic components and package for electronic components Abandoned AU2002337129A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0123807A GB2380613A (en) 2001-10-04 2001-10-04 Package for electronic components and method for forming such a package
GB0123807.0 2001-10-04
PCT/EP2002/010685 WO2003032391A2 (en) 2001-10-04 2002-09-23 Method for forming a package for electronic components and package for electronic components

Publications (1)

Publication Number Publication Date
AU2002337129A1 true AU2002337129A1 (en) 2003-04-22

Family

ID=9923207

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002337129A Abandoned AU2002337129A1 (en) 2001-10-04 2002-09-23 Method for forming a package for electronic components and package for electronic components

Country Status (3)

Country Link
AU (1) AU2002337129A1 (en)
GB (1) GB2380613A (en)
WO (1) WO2003032391A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005026233B4 (en) * 2005-06-07 2008-08-07 Tyco Electronics Ec Kft Electric power module
DE102009015757A1 (en) * 2009-04-01 2010-10-14 Siemens Aktiengesellschaft Pressure support for an electronic circuit
DE102017212233A1 (en) 2017-07-18 2019-01-24 Siemens Aktiengesellschaft Electrical assembly and method of making an electrical assembly
CN113410193B (en) * 2021-05-27 2024-05-03 元成科技(苏州)有限公司 8+1 Stacked chip packaging device
WO2024041759A1 (en) * 2022-08-24 2024-02-29 Microchip Technology Caldicot Limited Electronic device package including a gel

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0116396A3 (en) * 1983-01-06 1985-11-06 Crystalate Electronics Limited Electrical assembly
DE4111247C3 (en) * 1991-04-08 1996-11-21 Export Contor Ausenhandelsgese Circuit arrangement
JPH0629459A (en) * 1992-07-08 1994-02-04 Mitsubishi Electric Corp Semiconductor device and manufacture thereof
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
US5455458A (en) * 1993-08-09 1995-10-03 Hughes Aircraft Company Phase change cooling of semiconductor power modules
DE19533298A1 (en) * 1995-09-08 1997-03-13 Siemens Ag Electronic module with power components
JPH11297906A (en) * 1998-03-23 1999-10-29 Motorola Inc Electronic assembly and manufacturing method

Also Published As

Publication number Publication date
GB2380613A (en) 2003-04-09
WO2003032391A2 (en) 2003-04-17
WO2003032391A3 (en) 2004-01-29
GB0123807D0 (en) 2001-11-21

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase