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AU2002315785A1 - Contact, socket, socket board, and electronic component test apparatus - Google Patents

Contact, socket, socket board, and electronic component test apparatus

Info

Publication number
AU2002315785A1
AU2002315785A1 AU2002315785A AU2002315785A AU2002315785A1 AU 2002315785 A1 AU2002315785 A1 AU 2002315785A1 AU 2002315785 A AU2002315785 A AU 2002315785A AU 2002315785 A AU2002315785 A AU 2002315785A AU 2002315785 A1 AU2002315785 A1 AU 2002315785A1
Authority
AU
Australia
Prior art keywords
socket
contact
electronic component
test apparatus
component test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002315785A
Inventor
Fumio Kurotori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of AU2002315785A1 publication Critical patent/AU2002315785A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
AU2002315785A 2002-07-05 2002-07-05 Contact, socket, socket board, and electronic component test apparatus Abandoned AU2002315785A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2002/006850 WO2004005944A1 (en) 2002-07-05 2002-07-05 Contact, socket, socket board, and electronic component test apparatus

Publications (1)

Publication Number Publication Date
AU2002315785A1 true AU2002315785A1 (en) 2004-01-23

Family

ID=30022624

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002315785A Abandoned AU2002315785A1 (en) 2002-07-05 2002-07-05 Contact, socket, socket board, and electronic component test apparatus

Country Status (4)

Country Link
JP (1) JPWO2004005944A1 (en)
KR (1) KR100682380B1 (en)
AU (1) AU2002315785A1 (en)
WO (1) WO2004005944A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100886108B1 (en) * 2007-06-07 2009-02-27 완-촨 초우 Complex probes and methods for transmitting signals through the probes
KR100974586B1 (en) * 2007-12-31 2010-08-06 이성재 BK Semiconductor Test Socket
KR101013986B1 (en) * 2008-06-30 2011-02-14 주식회사 아이에스시테크놀러지 Test socket
KR101025027B1 (en) * 2008-08-20 2011-03-25 주식회사 아이에스시테크놀러지 Double springs and test sockets including them
KR101037786B1 (en) * 2008-08-21 2011-05-27 주식회사 아이에스시테크놀러지 Test socket with conductive wire inserted inside the spring and manufacturing method of the test socket
US20100102841A1 (en) * 2008-10-28 2010-04-29 Ibiden Co., Ltd. Device, method and probe for inspecting substrate
WO2011077555A1 (en) * 2009-12-25 2011-06-30 株式会社アドバンテスト Socket, socket board, and electronic component testing apparatus
JP2011180091A (en) * 2010-03-03 2011-09-15 Yung-Chi Tsai Contact type electronic inspection module
KR101476794B1 (en) * 2013-08-28 2014-12-29 주식회사 아이에스시 Socket for test and fabrication method thereof
JP6212234B2 (en) * 2014-05-23 2017-10-11 アルプス電気株式会社 IDC connector
TW201546463A (en) * 2014-06-09 2015-12-16 Jthink Technology Ltd Semiconductor testing carrier and testing needle module thereof
KR102162476B1 (en) * 2019-07-18 2020-10-06 박상량 High Performance Semiconductor Test Socket With Single Body Housing
US11322473B2 (en) 2019-09-12 2022-05-03 International Business Machines Corporation Interconnect and tuning thereof
US11561243B2 (en) 2019-09-12 2023-01-24 International Business Machines Corporation Compliant organic substrate assembly for rigid probes
US20240283176A1 (en) * 2023-02-16 2024-08-22 Molex, Llc Low profile board-to-board interface contactors

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3414593B2 (en) * 1996-06-28 2003-06-09 日本発条株式会社 Conductive contact
JPH10340773A (en) * 1997-06-05 1998-12-22 Hiroshi Nagano Socket for ic
JPH11144824A (en) * 1997-11-10 1999-05-28 Japan Aviation Electron Ind Ltd Connectors and their contacts
JP4060919B2 (en) * 1997-11-28 2008-03-12 富士通株式会社 Electrical connection device, contact manufacturing method, and semiconductor test method
JP3942734B2 (en) * 1998-06-05 2007-07-11 株式会社アドバンテスト Electronic component testing equipment
JP2001093634A (en) * 1999-09-21 2001-04-06 Kato Spring Works Co Ltd Socket for semiconductor package
US6341962B1 (en) * 1999-10-29 2002-01-29 Aries Electronics, Inc. Solderless grid array connector
JP2002050425A (en) * 2000-08-03 2002-02-15 Ulvac Japan Ltd Current conducting terminal and receiving side terminal

Also Published As

Publication number Publication date
KR100682380B1 (en) 2007-02-15
WO2004005944A1 (en) 2004-01-15
JPWO2004005944A1 (en) 2005-11-04
KR20050019831A (en) 2005-03-03

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase